Condenso_Series - 第4页

4 TheCondensoseriessystemversionscanbeintegra tedintoawiderangeof manufacturingenviro nments.Whetherit’ sabatchoperation,inlineconnection orcontinuoussoldering–Rehmoffersthehighestdegreeof…

Condenso series|Overview

TheCondensoseriesataglance

Flexible and adjustable

Doyouprocesslargeandheavyboardsforwhichcondensationsolderingisoutofthequestion?Ordoyou

wantasystemthatyoucanreliablycarryoutvacuumprocesseswithatanytime?ThenchooseaCondenso-

Seriessystemthatcanbecustomisedtoyourmanufacturingenvironment!

CondensoXC

Space-saving and powerful

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Batch system for low throughput

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Used in laboratory applications, small production

lines or prototyping

CondensoXMsmart

All-rounder for electronics production

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Inline system for medium throughput

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Autom. side Loeading/unloading with pre-

assembled carriers

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Used for small and medium-sized series

Condensosmartline

Ideal for large series

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Inline connection for medium throughput

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Automatical loading, internal carrier return

transport

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Used in series production

CondensoXSsmart

Great performance with a small footprint

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Inline ready system for medium throughput

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Low space requirements

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Ideal for small-series production

CondensoX-Line

Reliable in the through-feed process

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Inline system for high throughput

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3-chamber system and built-in vacuum soldering

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Series manufacture and power electronics

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Fully inert soldering process unter nitrogen

TheCondensoseriessystemversionscanbeintegratedintoawiderangeof

manufacturingenvironments.Whetherit’sabatchoperation,inlineconnection

orcontinuoussoldering–Rehmoffersthehighestdegreeofprocessreliability

forallareas!

The application options for the Condenso series are as varied as their production.

Wewouldbehappytodeterminethemostefcientsystemforyourmanufac-

turing process, taking all relevant processes such as throughput, assembly size,

thermal mass and follow-up processes into account.

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Patentedinjectionprinciple–reproduciblereowprole

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Hermeticallysealedprocesschamber

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Controllablevacuumprocess–Pre-vacuumingundvacuumfeasibleaftersoldering

›

NoGalden

spreading,activeGalden

ltering

Vapourphasesoldering

in every manufacturing environment

Condenso series | Patented principle

WiththeCondensoseries,afargreateramount

ofexibilityisavailableforthecondensation

solderingprocessthancanbeachievedwith

theconventionalmethod.Usingtheinjection

principleandtemperatureandpressure(vacu-

um)controlensuremoreaccurateandversatile

reowproling.

The soldering process takes place in a hermet-

icallysealedprocesschamber.Almoffluid

builds up during condensation soldering using

the heat-conducting medium Galden

, which

surrounds and vaporises the entire assembly.

The steam condenses on the assembly until a

soldering temperature of 240°C (e.g. when using

HS240) is achieved. Galden

is a perfluorpolyether

– fluid polymers that consist of carbon, fluoride

and oxygen. Rehm applies a patented injection

principle to improve control of the condensation

phase. Exactly the right amount of Galden

incorporated at the right time. Then, during this

process, redundant, latent heat is used when

changing the state of the medium from vaporous

to fluid to evenly and steadily heat the assembly.

The max. temperature of the assembly cannot

exceed the max. boiling/condensation temper-

ature of the medium to ensure the components

don’t overheat.

Thetemperature/reflowproleoftheassembly

can also be accurately adjusted by precise fluid

volume control and intermediate steam extraction.

Therefore, reproducible soldering conditions are

ensured that increase process stability. A vacuum

option is available with all Condenso systems for

optimum results that are virtually void-free.

Condenso–apatentedprinciple

with clear advantages