Condenso_Series - 第5页

5 With theConden soseries, afargreat eramount ofe xi bil ity is ava ila ble for th ec on dens ati on solderingprocessthancanbeachievedwith the c onve nti onal  meth od. Usi ng th ein je cti on…

TheCondensoseriessystemversionscanbeintegratedintoawiderangeof

manufacturingenvironments.Whetherit’sabatchoperation,inlineconnection

orcontinuoussoldering–Rehmoffersthehighestdegreeofprocessreliability

forallareas!

The application options for the Condenso series are as varied as their production.

Wewouldbehappytodeterminethemostefcientsystemforyourmanufac-

turing process, taking all relevant processes such as throughput, assembly size,

thermal mass and follow-up processes into account.

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Patentedinjectionprinciple–reproduciblereowprole

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Hermeticallysealedprocesschamber

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Controllablevacuumprocess–Pre-vacuumingundvacuumfeasibleaftersoldering

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NoGalden

spreading,activeGalden

ltering

Vapourphasesoldering

in every manufacturing environment

Condenso series | Patented principle

WiththeCondensoseries,afargreateramount

ofexibilityisavailableforthecondensation

solderingprocessthancanbeachievedwith

theconventionalmethod.Usingtheinjection

principleandtemperatureandpressure(vacu-

um)controlensuremoreaccurateandversatile

reowproling.

The soldering process takes place in a hermet-

icallysealedprocesschamber.Almoffluid

builds up during condensation soldering using

the heat-conducting medium Galden

, which

surrounds and vaporises the entire assembly.

The steam condenses on the assembly until a

soldering temperature of 240°C (e.g. when using

HS240) is achieved. Galden

is a perfluorpolyether

– fluid polymers that consist of carbon, fluoride

and oxygen. Rehm applies a patented injection

principle to improve control of the condensation

phase. Exactly the right amount of Galden

incorporated at the right time. Then, during this

process, redundant, latent heat is used when

changing the state of the medium from vaporous

to fluid to evenly and steadily heat the assembly.

The max. temperature of the assembly cannot

exceed the max. boiling/condensation temper-

ature of the medium to ensure the components

don’t overheat.

Thetemperature/reflowproleoftheassembly

can also be accurately adjusted by precise fluid

volume control and intermediate steam extraction.

Therefore, reproducible soldering conditions are

ensured that increase process stability. A vacuum

option is available with all Condenso systems for

optimum results that are virtually void-free.

Condenso–apatentedprinciple

with clear advantages

With all Condenso series systems, the soldering process

takes place in a hermetically sealed process chamber made

of aluminium or a mix of stainless steel and aluminium. The

processchamberisttedwithhigh-qualityelectricpanelhe-

aters that ensure optimum process conditions. The assem-

bly is heated up to soldering temperature by injecting and

vaporising Galden

. Steam allows for optimum heat transfer

to the soldering material. The heating systems’ target

temperature value remains constant. Therefore, excellent,

reproducible soldering results are ensured. The Galden

fully extracted after the soldering process, and air is blown

in via a nozzle system to gently bring the assemblies to

lower temperatures before the actual cooling process. The

systemscanbeoptionallyttedwithaviewingwindowor

camera so that the soldering process can be observed and

analysed. Soldering defects can be detected and eliminated

in a timely fashion as a result.

HermeticallysealedProcessChamber

for soldering, vacuum and cooling

Heating plate PCB

Process chamber structure for Condenso Optional viewing window with camera