Condenso_Series - 第7页
7 Galden ® storage container Filter granules Lowm ediumconsumption Resource-c o nservin gandefcient Afte rsold ering ,the asse mbly ispa ssed ontot heco oling proce ss.Pr oces sgas is e xtr acted and …

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With all Condenso series systems, the soldering process
takes place in a hermetically sealed process chamber made
of aluminium or a mix of stainless steel and aluminium. The
processchamberisttedwithhigh-qualityelectricpanelhe-
aters that ensure optimum process conditions. The assem-
bly is heated up to soldering temperature by injecting and
vaporising Galden
®
. Steam allows for optimum heat transfer
to the soldering material. The heating systems’ target
temperature value remains constant. Therefore, excellent,
reproducible soldering results are ensured. The Galden
®
is
fully extracted after the soldering process, and air is blown
in via a nozzle system to gently bring the assemblies to
lower temperatures before the actual cooling process. The
systemscanbeoptionallyttedwithaviewingwindowor
camera so that the soldering process can be observed and
analysed. Soldering defects can be detected and eliminated
in a timely fashion as a result.
HermeticallysealedProcessChamber
for soldering, vacuum and cooling
Heating plate PCB
Process chamber structure for Condenso Optional viewing window with camera

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Galden
®
storage container
Filter granules
Lowmediumconsumption
Resource-conservingandefcient
Aftersoldering,theassemblyispassedontothecoolingprocess.Processgasisextractedandcleaned
atthesametime.Therefore,alargepartoftheGalden
®
canbereused–whichisasolutionthatsaves
agreatdealonmaterials,andisenvironmentallyfriendly!Avacuumiscreatedduringextractionwhich
alsoensuresthatsolderingmaterialisdriedquickly.
The extracted Galden
®
islteredandclearedofimpurities
using granules. Approx. 99.9 % of the medium can be
recovered as a result. The cleaned fluid is made available
in a container for other processes. “Loss of vaporisation” is
low during soldering due to hermetically sealing the process
chamber.Aswellaslittleneedformaintenance,youbenet
from low medium consumption, and save money as a result.
›
Nolossofvaporisationintheprocesschamber
›
Mediumfilteringandre-use
›
Environmentallyfriendly
Condenso series | Medium consumption

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Void-free(cavity-free)solderingwithunleaded
soldersisanimportantrequirementforman-
ufacturingpowerelectronics.However,lower
voidratescanonlybeachievedwithsoldering
processeswherethemoltensolderissubjected
toavacuum.
The residues that remain in the soldered joint can
escape more easily due to the vacuum. The Con-
densoseriescanbettedwithavacuumpump
asanoptionforthisreason.Youendupwith
soldered joints with a surface binding proportion
of up to 99 %. Vacuum can also be drawn during
the melt phase, even before the actual solder-
ing process. This doesn’t just allow the Galden
®
steam to be evenly distributed in the process area,
but also enables the solvent and moisture to be
de-gassed from the solder paste. In addition, the
atmosphere can also be varied in the process
chamber throughout the whole dwell time as well
the temperature.
Whyvacuum?
Reliable, reproducible soldered joints
T
liq
t
T
Pressure