Condenso_Series - 第8页

8 V o id-free(cavity-free)solderingwithunleaded soldersisanimportantrequirementforman - ufacturingpowerelectronics.However ,lower voidratescanonlybeachievedwithsoldering processeswherethemolten…

Galden

storage container

Filter granules

Lowmediumconsumption

Resource-conservingandefcient

Aftersoldering,theassemblyispassedontothecoolingprocess.Processgasisextractedandcleaned

atthesametime.Therefore,alargepartoftheGalden

canbereused–whichisasolutionthatsaves

agreatdealonmaterials,andisenvironmentallyfriendly!Avacuumiscreatedduringextractionwhich

alsoensuresthatsolderingmaterialisdriedquickly.

The extracted Galden

islteredandclearedofimpurities

using granules. Approx. 99.9 % of the medium can be

recovered as a result. The cleaned fluid is made available

in a container for other processes. “Loss of vaporisation” is

low during soldering due to hermetically sealing the process

chamber.Aswellaslittleneedformaintenance,youbenet

from low medium consumption, and save money as a result.

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Nolossofvaporisationintheprocesschamber

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Mediumfilteringandre-use

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Environmentallyfriendly

Condenso series | Medium consumption

Void-free(cavity-free)solderingwithunleaded

soldersisanimportantrequirementforman-

ufacturingpowerelectronics.However,lower

voidratescanonlybeachievedwithsoldering

processeswherethemoltensolderissubjected

toavacuum.

The residues that remain in the soldered joint can

escape more easily due to the vacuum. The Con-

densoseriescanbettedwithavacuumpump

asanoptionforthisreason.Youendupwith

soldered joints with a surface binding proportion

of up to 99 %. Vacuum can also be drawn during

the melt phase, even before the actual solder-

ing process. This doesn’t just allow the Galden

steam to be evenly distributed in the process area,

but also enables the solvent and moisture to be

de-gassed from the solder paste. In addition, the

atmosphere can also be varied in the process

chamber throughout the whole dwell time as well

the temperature.

Whyvacuum?

Reliable, reproducible soldered joints

liq

Pressure

Condensovacuumtechnologyisusedinawiderangeofprocesses.Oxidationisreduced

fordryingandadhesiveprocesses,andsolderedjointreliabilityisincreasedduring

reowsolderingbyreducingvoids.

Condensovacuumtechnology

for void-free results

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Pre-vacuum:

-Preventionofoxidation,drying(solderpaste,adhesives)

 -HomogeneousGalden-gas-distribution(3-dimensionalsoldering)

 -Microwaveplasma(pre-cleaning)

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Vacuumduringreowsoldering:Improvedwetting

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Vacuumafterreowsoldering:Avoidingvoids

Surfacecontacts

upto99%

Improvedllingof

microviasand

THD-solderjoints

Minimumofvoids

(particularly important on

power electronics)

Improved

wetting

WithVacuumWithoutVacuum

Condenso series | Vacuum