Condenso_Series - 第9页

9 Condensovacuumtechnologyisusedinawiderangeofprocesses.Oxidationisreduced fordryingandadhesiveprocesses,andsolderedjointreliabilityisincreasedduring reowsolderingbyreducingvoids. Condenso …

Void-free(cavity-free)solderingwithunleaded

soldersisanimportantrequirementforman-

ufacturingpowerelectronics.However,lower

voidratescanonlybeachievedwithsoldering

processeswherethemoltensolderissubjected

toavacuum.

The residues that remain in the soldered joint can

escape more easily due to the vacuum. The Con-

densoseriescanbettedwithavacuumpump

asanoptionforthisreason.Youendupwith

soldered joints with a surface binding proportion

of up to 99 %. Vacuum can also be drawn during

the melt phase, even before the actual solder-

ing process. This doesn’t just allow the Galden

steam to be evenly distributed in the process area,

but also enables the solvent and moisture to be

de-gassed from the solder paste. In addition, the

atmosphere can also be varied in the process

chamber throughout the whole dwell time as well

the temperature.

Whyvacuum?

Reliable, reproducible soldered joints

liq

Pressure

Condensovacuumtechnologyisusedinawiderangeofprocesses.Oxidationisreduced

fordryingandadhesiveprocesses,andsolderedjointreliabilityisincreasedduring

reowsolderingbyreducingvoids.

Condensovacuumtechnology

for void-free results

›

Pre-vacuum:

-Preventionofoxidation,drying(solderpaste,adhesives)

 -HomogeneousGalden-gas-distribution(3-dimensionalsoldering)

 -Microwaveplasma(pre-cleaning)

›

Vacuumduringreowsoldering:Improvedwetting

›

Vacuumafterreowsoldering:Avoidingvoids

Surfacecontacts

upto99%

Improvedllingof

microviasand

THD-solderjoints

Minimumofvoids

(particularly important on

power electronics)

Improved

wetting

WithVacuumWithoutVacuum

Condenso series | Vacuum

Condenso series

CondensoXC

Optimal results with the smallest footprint

The CondensoXC is a space-saving, powerful system for

laboratory applications, small series production and proto-

typing.Exactprolingbymeansoftheinjectionprincipleand

the option of soldering under an inert atmosphere provides

the optimal soldering results. Void-free soldering can also be

carried out easily with the vacuum option, which increases

thereliabilityofassembliessignicantly.

With a footprint of just 2.3 m², this system is specially de-

signed for small series and is also ideal for prototype produc-

tion. As a batch system, it can be used flexibly, irrespective of

the production environment.

 Stableprocessforreliableresults

 Processchamberforamaximumassemblysizeof500x540mm(WxL)

 Cameraforprocessobservation

(optional)

 Patentiertedinjektionprinziple

 Vacuumprocess

(optional)