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User manual SIPLACE SX1/SX2 3 Technical data and assemblies From software version SC 706.1 SP1 Version 10/2014 3.1 Performance data for SIPLACE SX1/SX2 93 3 T echnical dat a and assemblies 3.1 Performance dat a for SIPLA…

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2 Operational safety User manual SIPLACE SX1/SX2
2.12 ESD guidelines From software version SC 706.1 SP1 Version 10/2014
92
Do not move the assemblies near to data view devices, monitors or television units. Keep a min-
imum distance of > 10 cm to monitors.
2.12.4 Measurements and modifications to ESD modules
Do not take measurements on the modules unless the following conditions are fulfilled:
– the measuring device is earthed (e.g. via PE conductors) or
– you discharge the measuring head just before taking measurements with a potential-free
measuring device (e.g. by touching an unpainted metal part of the controller casing).
Always use an earthed soldering iron if you carry out any soldering work.
2.12.5 Dispatching ESD modules
Always store modules and components in conductive packaging (e.g. metallized plastic bags
or metal sleeves) and dispatch them in conductive packaging.
If the packaging is not conductive, place the modules in a conductive envelope before pack-
aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex-
ample. NEVER use plastic bags or film. 2
If the module has integral batteries, ensure that the conductive packaging does not touch or
short-circuit the battery terminals and, if necessary, first cover the terminals with insulating
tape or material.
User manual SIPLACE SX1/SX2 3 Technical data and assemblies
From software version SC 706.1 SP1 Version 10/2014 3.1 Performance data for SIPLACE SX1/SX2
93
3 Technical data and assemblies
3.1 Performance data for SIPLACE SX1/SX2
3.1.1 Machine performance
3
Placement head types SIPLACE SpeedStar (C&P20)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
Placement performance
The placement performance is influenced by the different head combinations and head positions, plus the conveyor
configurations. Individual options and customized applications also influence the placement performance. On request,
SIPLACE can calculate the actual performance of your product on your machine configuration.
IPC value [components/h]
According to the vendor-neutral conditions of the IPC 9850 standard published by the Association of Connecting Elec-
tronics Industries.
SIPLACE benchmark value [components/h]
The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the conditions set
out in the SIPLACE scope of service and supply.
Theoretical maximum output value [components/h]
The theoretical maximum output value is calculated from the most favorable conditions for each machine type and set-
ting, and corresponds to the theoretical conditions normally used in the industry.
SIPLACE SX2 placement machine Placement area IPC value Benchmark value Theoretical value
C&P20 / C&P20 48,000 60,000 67,750
CPP / CPP
*a
38,000 46,000 56,000
CPP
*b
/ TH 23,100 27,000 31,000
TH / TH 10,200 11,000 13,000
SIPLACE SX1 placement machine Placement area IPC value Benchmark value Theoretical value
C&P20 24,000 30,000 33,875
CPP
a
19,000 23,000 28,000
TH 5,100 5,500 6,500
Placement positions 6,000 / gantry for the Collect&Place heads
2,000 / gantry for the TwinStar
*)a MultiStar CPP: low installation position
*)b MultiStar CPP: high installation position
3 Technical data and assemblies User manual SIPLACE SX1/SX2
3.1 Performance data for SIPLACE SX1/SX2 From software version SC 706.1 SP1 Version 10/2014
94
3.1.2 Placement head - data
3
Component range
*a
0.4 mm x 0.2 mm to max. 200 mm x 125 mm
Component height C&P20 4 mm
CPP
*b
6 mm
CPP
*c
8.5 mm to 11.5 mm
TH 25 mm (greater height on request)
X/Y accuracy
*d
C&P20 ± 41 μm (3σ), ± 55 μm (4σ) Component camera, type 23 (6 x 6)
C&P20 ± 41 μm (3σ), ± 55 μm (4σ) Component camera, type 41 (6 x 6)
CPP ± 41 μm (3σ), ± 55 μm (4σ) Component camera, type 30 (27 x 27)
CPP ± 34 μm (3σ), ± 45 μm (4σ) Component camera, type 33 (55 x 45)
TH ± 26 μm (3σ), ± 35 μm (4σ) Component camera, type 33 (55 x 45)
TH ± 22 μm (3σ), ± 30 μm (4σ) Component camera, type 25 (16 x 16)
Angular accuracy C&P20 ± 0.5° (3σ), ± 0.7° (4σ) Component camera, type 23 (6 x 6)
C&P20 ± 0.5° (3σ), ± 0.7° (4σ) Component camera, type 41 (6 x 6)
CPP
*e
± 0.4° (3σ), ± 0.5° (4σ) Component camera, type 30 (27 x 27)
CPP
*f
± 0.5° (3σ), ± 0.7° (4σ) Component camera, type 30 (27 x 27)
CPP ± 0.2° (3σ), ± 0.3° (4σ) Component camera, type 33 (55 x 45)
CPP
*g
± 0.4° (3σ), ± 0.5° (4σ) Component camera, type 30 (27 x 27)
TH ± 0.05° (3σ), ± 0.07° (4σ) Component camera, type 33 (55 x 45)
TH ± 0.05° (3σ), ± 0.07° (4σ) Component camera, type 25 (16 x 16)
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-specific standards,
the component packaging tolerances and the component tolerances.
*)b CPP head: in low installation position (stationary component camera not possible).
*)c CPP head: in high installation position
*)d The accuracy value, measured using the vendor-neutral IPC standard.
*)e Component dimensions between 6 mm x 6 mm and 27 mm x 27 mm.
*)f Component dimensions smaller than 6 mm x 6 mm.
*)g Component dimensions between 6 mm x 6 mm and 27 mm x 27 mm.