KE-3010_SPE_EN - 第13页

- 8 - 4. S pecifi catio ns 4.1. Features of each model ① Basic specifications KE - 3010 KE - 3020V / KE - 3020VR Board specific ations M PW B L PW B XL P W B M PW B L PW B XL P W B Board dimensi ons S tandard 330×250 ㎜ 4…

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Model name

KE-3010 KE-3020V KE-3020VR

Feeder bank (Electric type/Combination type: for both a mechanical feeder and an electric feeder)

Electric feeder bank (fixed type)

●*1

Electric feeder bank (trolley type)

●*1

Feeder exchange trolley for electric feeder(EF)

●*1

Feeder exchange trolley for electric feeder(RF)

●*1*18

Intelli trolley(RFID) for electric feeder

●*8

Tape cutter unit

●*1

IC collection belt unit

● ● ●

Component supply unit

- EF series electric feeder

●*8 *16

- RF series electric feeder

●*18

- Stick feeder

●*8 *16

Tray supply unit

- MTC

*14

●

*8 *9

●

*8 *9

●

*8 *9

- MTS

●*8 *9

- DTS

●

*8 *9 *17

●

*8 *9 *17

●

*8 *9 *17

- Tray holder

●*8 *9

Wafer supply unit

Multi-die server (DF01)

●*15

Fluxer: Type 3 (To be attached on a bank/rear side only)

●*1*13*17

Rotary-type solder transfer device

(To be attached on a bank/front side only)

●*1*13*17 ●*1*13*17 ●*1*13*17

Feeder setup stand for E-feeder (EF)

●

Feeder setup stand for E-feeder (RF)

●

RF_ETF_Attachment

●*16

Offline power supply for electric bank

●

Feeder bank for both mechanical type and electric type

●*1 *10

*1 This option is a factory-set option.

*2 Both MNVC and component recognition camera are provided as a set.

*3 This is applicable to the M PWB machine and L PWB machine.

*4 When the L-wide PWB specification is adopted, pin reference cannot be selected.

*5 Applicable only to the L PWB machine.

*6 The MNVC function is required.

*7 To use the component database, a PC is separately required.

*8 To use the production management system, Applicable to FRID is required.

(For mountable models and models for which a countermeasure can be taken later, refer to the

PRODUCT SPECIFICATIONS of production management system.)

*9 For installing, MTS, it is necessary to change the rear side of the main unit so that a feeder exchange

trolley can be mounted on it.

*10 For the options of both mechanical and electric feeder banks, refer to the description of each feeder

bank.

*11 This is not mounted on the machine when a placement monitor is selected.

*12 LNC 61 and LNC62 are heads exclusively designed for a placement monitor into which an

ultra-miniature camera is incorporated.

The specifications of recognition with laser are equivalent with those of an LNC60.

*13 Select either of a fluxer and a rotary-type solder transfer device.

*14 You cannot select both a fluxer (Type 2: to be attached on the main unit) and an MTC at the same

time.

*15 This unit can be attached on the rear bank of the main unit designed for a feeder exchange trolley.

*16 Attach the RF_ETF_Attachment when feeders for electric bank are used by a feeder trolley (RF). (If you

use the RF_ETF_Attachment, non-teaching and synchronous adsorption guarantee are excluded.)

*17 It does not correspond to the Feeder exchange trolley RF.

*18 It's necessary to change the cutter unit to the latest to use "Feeder exchange trolley RF".

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Specifications

4.1. Features of each model

① Basic specifications

KE-3010

KE-3020V / KE-3020VR

Board specifications

M PWB

L PWB

XL PWB

M PWB

L PWB

XL PWB

Board

dimensi

ons

Standard

330×250 ㎜ 410×360 ㎜ 610×560 ㎜ 330×250 ㎜ 410×360 ㎜ 610×560 ㎜

L-Wide -

510×360 ㎜

- -

510×360 ㎜

Long PWB

650x250 ㎜ 800×360 ㎜ 1210×560 ㎜ 650x250 ㎜ 800×360 ㎜ 1210×560 ㎜

L-Wide(long

PWB)

1010×360 ㎜

- -

1010×360 ㎜

Board transport reference

position

Front reference

Rear reference

Front reference

Rear reference

Front reference

Supported languages

English, Japanese and Chinese is selected in real time.

Conveyor height

900 ㎜±20 ㎜

950 ㎜±20 ㎜ (option, EN machine: standard)

Component height

SC（6 ㎜）

NC（12 ㎜）

HC（20 ㎜）

EC(25 ㎜)

Componen

placement

speed

* See

Note

1, 2, and 4

Chip

component

（IPC9850）

18,500(CPH) 17,100(CPH) 15,300(CPH)

IC component

9,000(CPH)

* S

ee Note 3.

7,000 (CPH)

* S

ee Note 3.

KE-3020V(LNC60+IC head)

9,470(CPH) 9,350(CPH) 7,100(CPH)

KE-3020VR(LNC60)

9,000(CPH) 7,000(CPH)

Componen

t size

See Note

Laser

recognition

0402～□33.5 ㎜ or opposite angle 47 ㎜

Image

recognition

(MNVC)

* See Note 3

Standard camera: □3～□33.5 ㎜

High-resolution camera (option): 1005～□20 ㎜

Image

recognition

(IC head)

Standard camera: □3～50×150 ㎜ or □74 ㎜

High-resolution camera: 1005～50×120 ㎜ or □48 ㎜

Placement

accuracy

See Note

Laser

recognition

±50μm (Cpk≧1)

Image

recognition

(MNVC)

* See Note 3

±40μm ±40μm

Image

recognition

(IC head)

- ±30μm

Number of component to

be placed

A maximum of 160 types (when using EF08HD)

EN Specifications

Enable

* Note 1: For details of specifications, refer to Section 4-3 Placement cycle time, Section 4-5 Target

components, and Section 4-6 Placement accuracy.

For each specification of MNVC (option) of KE-3010, refer to Section 4-3, Section 4-5, and Section

4-6. which are aforementioned.

* Note 2: Transport: Front reference, Component height: 6 mm (KE-3010)/12 mm (KE-3020V/20VR M

specification/L specification)/25 mm (KE-3020V/20VR XL specification)

* Note 3: It is the approximate value when MNVC (option for KE-3010) is used and/or the components are

simultaneously picked up with 6 nozzles.

*Note 4: Except case of using the RF_ETF_Attachment.

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② The relationship among the model names, recognition devices and heads is shown below.

KE-3010

KE-3020V

KE-3020VR

Explanation

LNC60 ○ ○ ○

This can place small-shape and thin chips at a

high speed by 6 nozzles.

head

(CDS)

- ○ -

This head can place IC components of

large-shape QFP, CSP, BGA, etc. by vision

recognition.

head

(FMLA)

- - ○

This head can place components by laser

recognition and vision recognition. All types of

nozzles such as gripper nozzle and particular

ordering nozzle can be used for the IC head

(FMLA).

VCS

* See

Note 1.

○ ○

VCS can perform vision recognition of IC

components. An optional high-resolution camera

can be added.

*Note 1: The standard camera is attached to MNVC (option). The high-resolution camera is

also attached.

③ Recognition function

KE-3010 KE-3020V KE-3020VR Explanation

MNVC Option

○ ○

Vision recognition can be performed by LNC60.

IC components of small-shape QFP, CSP, BGA,

etc. can be placed at a high speed. Vision

recognition can be performed by VCS in the

high-speed non-stop mode. (S-VCS)