KE-3010_SPE_EN - 第39页

- 34 - 5.2.14. Coplanarity (Factory - Set O ption) By moving a tar get component that is to be measured at constan t speed in the direction (Y - dir ection) perpendicular to the laser line (X - direction), the camera sho…

- 33 -

5.2.10. Applicability to long PWB (factory-set option)

The PWB size in the X direction can be extended by PWB twice-feed transport. This

permits producing long PWBs to be used for LED lighting. With the PWB exceeding the

single-feed size of the maximum size in the X direction shown in the following table,

twice-feed transport is performed.

Single-feed

Twice-feed

M PWB

330×250mm

650x250mm

L PWB

410×360mm

800×360mm

L-Wide PWB

510×360mm

1010×360mm

XL PWB

610×560mm

1210×560mm

strictions

- The IN buffer/OUT buffer function is disabled.

- When MTC is used, a limitation is put on the maximum PWB size in the X direction that

can be transported.

5.2.11. Solder recognition lighting (factory-set option)

When there is no BOC mark on a PWB or circuit, the solder print is recognized as a BOC

mark. When executing twice-feed transport of long PWBs, the placement pad for which

solder print is performed can be used as a BOC mark in placement in a range without any

BOC mark.

n the case of the solder print, the shape is not clear as a mark, so that satisfactory

placement accuracy may not be obtained.

5.2.12. Residual number-of-components control function (option)

This function controls product lots of placement components (LED components, etc.). The

function checks whether the necessary number of placement components exists in the

feeder in carrying in PWBs without mixing different-lot components into the same PWB. If

the number is less than the necessary number, an alarm is displayed before placement is

started.

5.2.13. Auto PWB width adjusting function (Automatic Board Adjustment/AWC

factory-set option)

This function can adjust the rail width automatically according to the PWB width.

The minimum value of applicable PWB dimensions is 50mm x 50 mm.

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5.2.14. Coplanarity (Factory-Set Option)

By moving a target component that is to be measured at constant speed in the direction

(Y-direction) perpendicular to the laser line (X-direction), the camera shoots the diffuse

reflection of laser beam emitted to the component and the device creates 3-D image to

measure displacement without touching the component. This device determines if a

component is appropriate or not based on the 3-D image obtained from the component

information sent by the mounter in advance (that is, checks the height of the electrode).

Accordingly, lead bend in the up/down direction of a lead component or a nick of a ball

component can be recognized, thereby preventing a contact fault between a PWB and a

component.

Colinearity check:

The colinearity check inspects “how much a side on which leads are located is bent in the

up/down directions.”

Coplanarity check:

This check can check coplanarity (uniformity of the bottom of a terminal) of a component with

the three-point method (JEDEC standard: JESD22-B108A) or the method of least squares

(JEDEC standard: JESD22-B108A).

pplicable components

- Components to be recognized with a VCS only.

- BGA, FBGA, connector, and lead components (SOP and QFP) whose respective pitch

is the same and whose respective lead width is the same

1. If you do not enter the correct lead width and electrode size of a component whose

lead width is less than 0.3 mm on the “Component” data screen of the Program Editor,

the system may not be able to detect its terminal correctly.

*2. Component height：SC specification: 6 mm, NC specification: 12 .0 mm

HC specification: 20.0mm, EC specification:25.0mm

A product whose laser class is 3b is used in the coplanarity sensor.

- K

ey switch

The front section of the machine is equipped with a key switch. Only when the key

switch is set to ON, you can use the coplanarity function.

- Cover open

Regardless of the key switch state, any laser is not emitted when the cover opens.

Item

Dimensions

Lead

component

Pitch 0.4 mm or more

Lead width

0.18 mm or more

Lead length 0.5 mm or more

Component size 48 mm×150 mm or less

Ball

component

Pitch 0.8 mm or more

Ball diameter 0.4 mm or more

Component size 48 mm×150 mm or less

- 35 -

5.2.15. Offset Placement After Solder Screen-printing (Factory-Set Option)

A component placement position error may occur after re-flowing if you place a component

on the PWB pad when the solder printing position is shifted from the pad position because a

PWB expands or shrinks.

This function uses an OCC to recognize a gap between a PWB pad and printed solder that is

generated as a result of expansion and/or contraction of a PWB, and places a component on

the printed solder instead of the pad. This makes use of the self-alignment effect to

improve the component placement accuracy after re-flowing.

① Applicable solder shape

A pair of cream solders, which are symmetrical, screen-printed on a PWB pad for a

square chip

* The shape of screen-printed solder should be symmetrical. The system cannot

accurately detect how much to correct the gap unless the shape is symmetrical.

The applicable shapes should be: circle, oval, square, rectangle and pentagon.

(Recognition of other shapes should be checked.)

② A

pplicable solder

Eutectic solder (NIHON HANDA: RX363-92MY0 (S)) and lead-free solder (TAMURA

KAKEN: TFL-204F-111S)

(* Solder described in parentheses is already checked for its appropriateness.)

③ Applicable chip size

0402, 0603, 1005, 1608, 2012, 3216

* Note that image of a set of solder whose shorter side is 0.16 mm or more and whos

longer side is 3.2 mm or less has to be obtained.

④ A

pplicable solder angle

0°, 90°, 180°, 270° (Angle error for a camera: within ± 3°)

⑤ A

pplicable board material and pad material

− Board material: glass epoxy, paper phenol, flexography, ceramic

− Pad material: gold, copper, hot air leveling

* The solder paste should have a certain level of contrast. If there is a portion whose

ightness is the same as that of solder in the area to be detected due to the condition of the

printed solder, serigraph, a pattern or PWB, and so any image that only solder looks bright

cannot be obtained, the system may not be able to correct the component placement

position by recognizing it. In such a case, you have to set the position of solder paste again

so that it can have the certain level of contrast.

PWB

Solder

Pad

PWB

Solder

Pad