KE-3010_SPE_EN - 第41页

- 36 - 5.2.16. Fluxer ( Factory - Set Opti on ) This is a flux supply dev ice that applies flux to bal l components such as a BGA, CSP and flip chip (does not apply any adhesive or solder pas te). Y ou can install this d…

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5.2.15. Offset Placement After Solder Screen-printing (Factory-Set Option)

A component placement position error may occur after re-flowing if you place a component

on the PWB pad when the solder printing position is shifted from the pad position because a

PWB expands or shrinks.

This function uses an OCC to recognize a gap between a PWB pad and printed solder that is

generated as a result of expansion and/or contraction of a PWB, and places a component on

the printed solder instead of the pad. This makes use of the self-alignment effect to

improve the component placement accuracy after re-flowing.

① Applicable solder shape

A pair of cream solders, which are symmetrical, screen-printed on a PWB pad for a

square chip

* The shape of screen-printed solder should be symmetrical. The system cannot

accurately detect how much to correct the gap unless the shape is symmetrical.

The applicable shapes should be: circle, oval, square, rectangle and pentagon.

(Recognition of other shapes should be checked.)

② A

pplicable solder

Eutectic solder (NIHON HANDA: RX363-92MY0 (S)) and lead-free solder (TAMURA

KAKEN: TFL-204F-111S)

(* Solder described in parentheses is already checked for its appropriateness.)

③ Applicable chip size

0402, 0603, 1005, 1608, 2012, 3216

* Note that image of a set of solder whose shorter side is 0.16 mm or more and whos

longer side is 3.2 mm or less has to be obtained.

④ A

pplicable solder angle

0°, 90°, 180°, 270° (Angle error for a camera: within ± 3°)

⑤ A

pplicable board material and pad material

− Board material: glass epoxy, paper phenol, flexography, ceramic

− Pad material: gold, copper, hot air leveling

* The solder paste should have a certain level of contrast. If there is a portion whose

ightness is the same as that of solder in the area to be detected due to the condition of the

printed solder, serigraph, a pattern or PWB, and so any image that only solder looks bright

cannot be obtained, the system may not be able to correct the component placement

position by recognizing it. In such a case, you have to set the position of solder paste again

so that it can have the certain level of contrast.

PWB

Solder

Pad

PWB

Solder

Pad

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5.2.16. Fluxer (Factory-Set Option)

This is a flux supply device that applies flux to ball components such as a BGA, CSP and flip

chip (does not apply any adhesive or solder paste).

ou can install this device on the mounter with either of the following two methods.

Where to install>

Installation position Remarks

Type 2

(To be attached on the main

unit)

Since this type of fluxer is attached on the base frame, any MTC cannot be attached

on the machine when the fluxer is attached. The number of component supply

devices to be attached on the bank is not restricted.

Type 3

(To be attached on a bank/Rear

side only)

The area for six mechanical 8-mm tape feeders (12 slots) is to be occupied.

Mechanical bank

The area for six mechanical 8-mm tape feeders (12 slots) is

to be occupied. (A connector bracket is required.)

Electric bank

The area for six electric 8-

mm tape feeders (6 slots) is to be

occupied.

Note 1: Either a fluxer or a rotary-type solder transfer unit option can be installed on the machine.

Note 2: The type of attached on an electric bank does not correspond to the Feeder exchange trolley RF.

Facility specifications>

Item

Specifications

Remarks

Applicable flux viscosity

8.4 Pa·s to 22.0 Pa·s

Cycle time required for flux application

and component placement

1,100cph

When the distance each of the X and Y

axes travels is 450 mm or less

Cavity dimensions

(*See Note 3.)

Depth

Minimum 0.02 mm (± 5 μm)

Maximum 0.2 mm (± 10 %)

Size

Maximum 30 mm×30 mm

(*See Note1 and 2.)

Maximum size of a cavity when only

one cavity is provided

Number of

cavities

1 to 4

Maximum eight on the top and bottom

sides

Power consumption

DC24V/0.3A

Life

5 years

(22 hours×300 days)/1 year

Parts needing periodic replacements

Electromagnetic valve, cylinder

Time for replacement: 2 years after use

Consumables

Fluxer plate, flux container

Time for replacement: 1 year after use

ote 1: The cavity size shall be “the maximum size of a component to be used” + “3-mm

margin around the component.”

Note 2: When two or more cavities are used, all cavities shall fit in the 30 mm×30 mm

area.

Note 3: If you need a cavity whose dimensions are not any of the JUKI standard

dimensions, contact our Sales person.

Standard part

Part number

Dimensions of a cavity

Fluxer plate 120/200 40044090

Size: X = 30 mm, Y = 30 mm

Depth: Front 0.12 mm/Rear 0.20 mm

Fluxer plate 30/50/70/100 40044091

Size: X = 30 mm, Y = 14 mm

Depth: Front A 0.03 mm/Front B 0.05 mm

Rear A 0.10 mm/Rear B 0.07 mm

5.2.17. Electrical Leakage Breaker (Factory-Set Option)

A standard breaker functions if any excess current flows or if a short-circuit fault occurs.

When you replace it with an electrical leakage breaker, this new breaker interrupts electrical

leakage, and then prevents the resulting electrical shock, so you can handle the machine

more safely.

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5.2.18. Ionizer (Factory-Set Option)

This option maintains the ion balance inside the machine to eliminate static electricity and

prevent it from being generated.

This option prevents components as well as pick-up/placement operation of a component

from being damaged by static electricity to allow the machine to produce PWBs more stably.

5.2.19. IC Collection Belt (Option)

* The equipment is different between the mechanical bank and the electric bank. Use the

equipment suitable for each bank type.

- Applicable component size: 10 x 10 mm to 50 x 50 mm, Height: 1 mm or higher

- Belt feeding pitch: 15 mm to 55 mm (in increments of 5 mm)

- Number of components that can be collected: 5 to 16

- Number of occupied positions: 9

5.2.20. Handheld Operating Device (HOD: Factory-set option)

The KE-3010/3020V/3020VR allows you to check the recognized mark image on the

operation screen or perform various teaching operations. In addition, if an experienced

user of any of conventional mounters does not want to change the operability of the mounter,

or if you want to make the operability of the entire line consistent, you can use the HOD as

conventionally.

5.2.21. Tape Cutter Unit (Option for the electric type of bank)

This tape cutter automatically cuts empty tapes to dispose of them in a lump.

It is an integrated type of unit that is attached onto a main unit, and can be used with a fixed

bank and also an feeder trolley.

5.2.22. Automatic Tape Cutter (Option)

This tape cutter automatically cuts empty tapes to dispose of them in a lump.

5.2.23. Connector Bracket (Option for the Fixed Bank)

This is a unit necessary for connecting devices such as an adhesive tape feeder, an IC

collection belt, an automatic tape cutter and a DTS to the mounter. When the optional batch

feeder change function is selected, you do not require this unit.

5.2.24. Flexible Calibration System, The adjustment jig (FCS is an option.)

After a jig component that is recognized with the VCS or laser is placed on a glass jig board,

the FCS uses a camera to automatically measure the difference between a value set with the

program and the position at which the component is placed, and calculates the offset value

to be used for placing the component.

A series of operations can be automatically performed by setting the jig PWB and reading the

program.

When you use the FCS, you can check whether the precision is maintained and adjust the

precision at relocation or routine maintenance.

The calibration jig is optional.