KE-3010_SPE_EN - 第71页

- 66 - 6.8. Mul ti - di e ser ve r 6.8.1. O ve r vi e w This equipment DF01 (multi - die server , hereafter re ferred to as “ this equipment ” ) is designed to supply bare chips from the wafer or waff l e tray to the mou…

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6.7.4. Options

No. Name

Function/applicable model (Note1)

TR5SNX TR5DNX

TR6SNX

TR6SXLX

TR6DNX

TR6DXLX

TR7DN

①

Inspection conveyor

specification

This function stops a PWB on the conveyor and inspects it visually.

- -

○ ○

②

Auto PWB width

adjusting function

This function adjusts the transport width in accordance with the auto width

adjusting function of the mounter.

- -

○ ○

③ Seesaw nozzle

When a socket component has a level difference on its pickup surface and is

brought into contact with the adjacent pickup pad, this unit prevents the

component against interference by operating the pickup pack like a seesaw.

- -

○ ○

④ FBGA chuck

This is a mechanical chuck for small components such as an FBGA.

This chuck is applicable to components of □9 mm to □43 mm.

- -

○ ○

⑤

No-components

display function

This function turns on the LED button to notify the number of steps without

components. Additional components can be replenished by pressing its LED

button.

○ ○ ○

○

(Note2)

⑥

Ultra-slow mode

(Note 3)

To pull out/store the tray base to which components are supplied, this function

changes the motor/cylinder speed to a low speed in order to prevent components

from jumping out. This speed setting is performed by production program.

○ ○ ○ ○ ○

⑦

Stacker with

opening/closing

cover

To prevent the tray base from jumping out when setting the tray base in the

stacker, this stacker is provided with a cover for fixing the tray base without level

difference of the tray base.

○ ○ ○ ○ ○

⑧

Signal tower

(Note 4)

Two-lamp signal light for non-stop.

- - - ○ -

⑨

2-inch waffle tray

holder

Tray holder to set the waffle tray of □50 mm.

○ ○ ○ ○ ○

⑩

Applicability to RFID

function

Reading the RFID tag attached to the tray base is enabled by adding the RFID

reader (antenna).

For using this function, IFS-NX applicable to the mounter proper is required.

For details, refer to “IFS-NX Device Specification.”

○ ○ ○ ○ ○

Note1 The above functions of the TR series are factory-set options.

Note2 TR7DN is a standard function.

Note3 Ultra-slow mode is displayed as “Low speed 2” on the operation screen of the

mounter.

Note4 TR5DNX, TR6DNV, TR6DXLX and TR7DN are equipped with a one-lamp signal

tower as a standard device.

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6.8. Multi-die server

6.8.1. Overview

This equipment DF01 (multi-die server, hereafter referred to as “this equipment”) is designed

to supply bare chips from the wafer or waffle tray to the mounter in a process where

components, such as Sip (System In Package) and MCM (Multi Chip Module) and devices

advancing more compact sizes are mixed. Face-up or face-down (flip) supply and

high-speed simultaneous pickup can be selected. This makes the equipment applicable to a

wide variety of applications.

* Refer to the “DF01 PRODUCT SPECIFICATIONS” for details.

6.8.2. Basic Specifications

Model

DF01

Applicable language

Japanese, English

Supply style Wafer/waffle tray

Wafer supply

Grip ring (for 4-, 5-, 6-, or 8-inch)

Tray supply Waffle tray (2- or 4-inch)

Component

size

Direct supply

0.3 mm to 10.0 mm Note 1

Shuttle supply 1.0 mm to 10 mm

Allowable

thickness

0.05 mm to 0.725 mm

Target

component to

be used

Wafer Bare chip

Package

component

BGA or CSP, etc. (up to 10 mm)

Supply method

• Face-up supply by shuttle

•

Face-down supply by shuttle (flip chip)

Number of storage pallets

10 pcs.

Grip ring

1 pc./pallet

2-inch waffle tray

8 pcs./pallet (option)

4-inch waffle tray

4 pcs./pallet (option)

Component supply speed 2,400 CPH

Supply

accuracy

0.1 mm

Note 1: Separate measures are taken for a size ranging from 10.0 mm to 25.0 mm. For details,

contact JUKI’s sales personnel.

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6.8.3. Facility Specification

Item Contents

Power supply

Voltage

Single-phase AC 200V/220V/240v (

10%)

Frequency 50/60 Hz

Apparent power 1.5 kVA

Compressed air

to be used

Air pressure

0.5

0.05 MPa, dry air

Max. air consumption

150 L/min. (standard status) ∗

Note 1

Noise

75 dB (A) or less

∗

Note 2

Degree of cleanliness Class 10,000 or less

Note 1: Standard status: Air status with a temperature of 20

C, an absolute pressure of

0.1 MPa (= 100 kPa =1 bar), and a relative humidity of 65%

Note 2: Noise is measured in conformity with JIS Z 8731.

6.8.4. External dimensions

Item

Board transport height 900mm 950mm

Dimensions

Height H (with signal light) 1,955 2,005

Height H (without signal light) 1,400 1,450

Width W 696

Depth D

(from mechanism part to handle)

1,160

Dimensions with cover open 450

Weight

Approx. 340kg

6.8.5. Options

No. Name Description

Heater (Option to be attached

at shipment from the factory)

Heater for the push-up unit

2 Pallet for a grip ring Pallets for 4-, 5-, 6-, and 8-inch wafers are available.

3 Grip ring

Grip rings for 4-, 5-, 6-, and 8-inch wafers are available. See n

ote 1

4 Pallet for a waffle tray Pallets for 2- and 4-inch waffle trays are available.

5 Needle For push-up of a bare chip

6 Collet For absorption of a bare chip

A collet for each size of bare chip is available.

7 Stacker Additional stacker (not including a pallet)

8 Pallet for a 6-inch flat ring Pallet on which a wafer is to be attached directly

9 Grip ring replacement jig Jig for attaching a wafer on a grip ring

10 Wafer alignment jig Jig for attaching a wafer parallel to a pallet

11 Leveling jig pallet Pallet for leveling the machine

Note 1: When you purchase an option from the recommended manufacturer:

ULTRONICS INC. http://www.ultronics.co.jp/

Manufacture’s model name 4-inch: GRP-2620-44 5-inch: GRP-2620-5

6-inch: UGR-6 8-inch: UGR-8