ZEVAm - 第2页
The ZEV Am+ brings the nex t dimension to selec tive point -to- point soldering. With the ever decreasing pitc h of compone nts it becomes inevitable soon to u se an angle during soldering t o guarantee proper soldering …
High frequency, high speed
drop jet uxing, matching
every cycle time and drop size
requirement
Electromagnetic moveable
solderpot with the option to solder
under an angle and a choice of
wettable and non-wettable nozzles
Up to three products can be
processed simultaneously for
maximized throughput
Electronic Assembly Equipment
l High frequency uxing technology provides the most accurate
process to answer the highest quality challenges
l Up to three full-size preheating units, including closed loop
preheating during soldering
l Patented soldering technology, tilting and SDC will prepare you for any
soldering challenge that may come including further decrease of pitch
l SmartTeach software to enable fast set up and reliable recipes
l Process control provides maximum insight on day-to-day performance
Selective Soldering Solution
Proven Performance
from a Century of
Soldering Experience
The ZEVAm+ brings the next dimension to selective point-to-point soldering. With the ever decreasing pitch of components it
becomes inevitable soon to use an angle during soldering to guarantee proper soldering results. The platform is supported by
SmartTeach software enabling users to quickly and reliably set up a new process.
Key standard features
• High frequency uxing
• Inline preheating system
• SmartTeach programming
• Movable Electromagnetic solderpot
• Automatic waveheight and
solderheight measurement
• Fiducial correction
Key optional features
• Flux ow measurement
• Topside preheating (also during soldering)
• Closed loop preheating management
• Non-wettable or wettable nozzles
• Tilting for ne pitch soldering
• Solder Drainage Conditioner (SDC)
• Process view camera
• Product warpage compensation
Bottom and optional top side
quartz heaters
Rotatable non-wettable nozzles
avoiding operator interference/
maintenance
Easily programmable allowing
a fast process set up
Specication ZEVAm+
Max PCB or pallet size 410 x 410 mm (16 x 16 inch)
Optional increase to max product length 500 mm (19.6 inch)
Max PCB weight 10 kg
Solder pot volume 8 kg
N consumption 20 L/min (25 L/min include SDC)
Maximum components height top side 120 mm
Power supply 3 x 400V 50/60 Hz
Machine size (L x W x H) 2370 x 1285 x 1220 mm (93.3 x 50.6 x 48 inch)
Selective Soldering Solution
www.itweae.com
© 2019 ITW all rights reserved. ZEVAm+ 09-19
ITW EAE is a division of Illinois Tool Works, Inc. It is a consolidation of all of its Electronic Assembly
Equipment and Thermal Processing Technology. The group includes world-class products from MPM,
Camalot, Electrovert (Speedline), Vitronics Soltec and Despatch.
Soldering Solutions