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8 Troubleshooting and Process Review 8.1 Identify Causes of Print Defects Process Foundation DEK Micron-Series 12/2017 55 8 Troubleshooting and Process Review 8.1 Identify Causes of Print Defects It is important that the…
7 Product File and Machine Optimisation
7.5 Optimise Parameters to Produce Acceptable Quality Prints at Higher Throughputs
54 Process Foundation DEK Micron-Series 12/2017
Step 5
Determine, through experimentation, the best print parameter settings to successfully achieve the
objective. Record your results in the table over:
Squeegees
Print Speed
Squeegee Pressure
Separation Speed
Separation Distance
USC Program (mode 1)
USC Rate (Mode 1)
USC Program (Mode 2)
USC Rate (Mode 2)
Notes:
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8 Troubleshooting and Process Review
8.1 Identify Causes of Print Defects
Process Foundation DEK Micron-Series 12/2017 55
8 Troubleshooting and Process Review
8.1 Identify Causes of Print Defects
It is important that the people responsible for the design and maintenance of the process
understand which areas under their control can have a direct influence on the print quality, how to
identify a defect and to quickly rectify the problem.
Note: This section refers to solder paste related print defects. For other print materials, refer to
the appropriate application modules.
The Perfect Solder Print
Causes:
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Good Alignment
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Good Gasket Seal
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Good Board Support
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Good Stencil Design
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Good Print Material
Well Designed Process (speed, pressure, etc.)
Exercise
For each of the print defects shown below, identify the possible design and/ or process
maintenance causes:
Bridging
Causes:
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8 Troubleshooting and Process Review
8.1 Identify Causes of Print Defects
56 Process Foundation DEK Micron-Series 12/2017
Incomplete
Causes:
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Scooping
Causes:
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Missing Edge
Causes:
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