GD450 说明书(中英文版) - 第11页

- 1 1 - includes electronic control system a nd control software, counter drive, stepp ing moto r , servo motor , signal monitoring system and pneumatic system. 1.4.1 平台教正系统 Workt able alignme nt sy s tem 组成: 包括 Z 轴升降装置 …

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1.3 机器外形尺寸 Equipment dimension
1-1 机器外形图
Pix 1-1 Equipment dimension
1.4 系统的主要组成 Main sections of the system
本机包括机械、电气两大部分。
机械部分由平台校正系统PCB 传输及其定位系统图象捕捉系统钢网自动定位及其
清洁系统刮锡系统等组成。电气部分由电控系统及控制软件、计数器、驱动器、步进电机、
伺服电机以信号监测、和气动系统系统组成。
The equipment includes two sections, machinery and electric.
Mechanical section includes table alignment system, PCB transmission and its
positioning system, image capture system, stencil automatic positioning system and
corresponding cleaning system and solder paste removed system,etc. Electrical section
includes electronic control system and control software, counter drive, stepping motor,
servo motor, signal monitoring system and pneumatic system.
1.4.1 平台教正系统 Worktable alignment system
组成:包括 Z 轴升降装置(升降底座、升降丝杠、控制电机、升降导轨等)平台移动装置(丝
杆、导轨及分别控制 XYθ方向移动的控制电机等)、印刷工作台面(磁性顶针、
真空吸腔(选配))等。
Component: Z-axis lifting device (lifting base, lifting screw, control motor, lifting rail etc.),
table mobile device (screw, rail and control motor which can control the direction on
the XY、θ, etc.), printing table (magnetic thimble, vacuum chamber (optional) etc.).
功能:通过机器视觉,工作台自动调节 XY θ方向位置偏差,精确实现印刷模板与 PCB 板的对准。
Function: Worktable can adjust the positioning offset of the direction of XY、θ through the
equipment vision. It can insure the alignment of the printing template and PCB board.
1.4.2 PCB 传输及其定位系统 PCB transmission and the positioning system
1.4.2.1PCB 传输系统 PCB transmission system
组成:包括运输导轨、运输带轮及同步带、步进电机、停板装置、导轨调宽装置等。
Component: It includes the transmission rail, conveyer belt roller, synchronous belt,
stepper motor, board breaker device and the device which can adjust the width of the rail
etc.
功能: PCB 进板、出板的运输、停板位置及导轨宽度的自动调节以适应不同尺寸 PCB 基板。
Function: Input and output the PCB, board breaker position and adjustable rail width. It can match
different sizes of PCB base board.
1.4.2.2 PCB 定位系统-底部支撑 PCB positioning system-bottom supporting
组成:磁性顶针、顶销、偏心顶针、等高块,专用工装夹具(Grid-Lock)等。薄板可选用
选配真空吸腔。
Component: Magnetic thimble, top pin, eccentricity thimble, contour block, special
fixture (Grid-Lock) etc.. Thin board can select the vacuum chamber.
功能:基板边缘夹紧系统将基板固定提高至更高层次,为获得最佳的基板夹持力,边缘夹紧
系统使用软件控制压力,调整以匹配被编程基板厚度,该解决方案辅以顶部夹持系统
稳固地夹持基板,提供最佳的模板基板间密合,实现锡膏的有效沉淀,有效提高印刷
品质.
Function: Base board edge holding system fix the base board and lift it to a higher level to
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get the best holding force. Edge holding system uses the software to control and
adjust the pressure to match thickness of the programmed base board. This solution
can help the top holding system to hold the base board firmly. It can support the best
connection between the template and base board and insure the Effective
precipitation of the solder paste and improve the printing quality.
1.4.3 图像捕捉系统 Image capture system
组成:包括 CCD 运动部分和 CCDCamera 装置(摄像头、光源)及高分辨率显示器等,
由视觉系统软件进行控制。
Component: It includes the CCD movement, CCD-Camera device (camera, light source)
and high resolution screen etc.. Control by the visual system software.
功能:上视/下视视觉系统,独立控制与调节的照明,高速移动的镜头确保快速、精确地进行
PCB 和钢网板对准,无限制的图像模式识别技术具有 0.01mm 的辩识精度。
Function: Up/down visual system, independent controllable and adjustable lighting, high
speed mobile lens which can insure the make the PCB and stencil aligned fast and
accurate. Unlimited image pattern recognition technology reaches 0.01mm recognition
accuracy.
1.4.4 钢网自动定位及其清洁系统 Stencil automatically positioning and the
cleaning system
1.4.4.1 钢网自动定位系统 Stencil automatically positioning
组成:包括网板移动装置及网板固定装置等。
Component: It includes stencil mobile device and stencil fixed device etc..
功能:只需输入钢 MARK 点位置就可以自动定,更方便用户不同大小钢网的灵活更换.
适用的钢网夹持装置, 370x470mm470 左右方向放置), 737×737mm,厚度
20~40mm.
Function: Inputting the stencil mark location can positioning automatically and it is
convenient for operator to replace different sizes of stencil. The stencil holding device can
hold the Min. stencil whose size is 370x470mm (470 left and right direction placed) and
Max. stencil whose size is 737×737mm and thickness is 20~40mm.