GD450 说明书(中英文版） - 第16页
- 16 - 第二章 设备安装与调试 Chapter 2 Equip ment inst allatio n and debugging 2.1 开箱 Open th e equipment 开箱后，请您首先做好以下工作： Do the following checks af ter opening the equipment 1. 对照《装箱清单》所列各项进行查验。 Recheck all in items on the packin…
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component let the low viscosity solder paste go through the window and it will be printed
on the PCB bonding pad. The clear solder paste picture will remains after the table
descends.
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第二章 设备安装与调试
Chapter 2 Equipment installation and debugging
2.1 开箱 Open the equipment
开箱后，请您首先做好以下工作：
Do the following checks after opening the equipment
1. 对照《装箱清单》所列各项进行查验。
Recheck all in items on the packing list.
2. 检查机器各部分是否有损坏，包括另箱包装的显示器、键盘、鼠标及刮刀板等，并将
它们重新安装到印刷机上。
Check all the units, including the screen, keyboard, mouse and scraper board etc.
And assemble them on the printer.
3. 将运输导轨上的固定扎带剪开。
Cut off the fixed tie on the transmission rail.
4. 刮刀横梁固定在网框横杆上的，请将固定带剪开。
Scraper beam is fixed on the frame beam with the tie. Cut off the tie.
5. 请将网框横杆上的固定套松开，使网框支板能左右移动。
Loose the fixed sleeve on the frame beam so that the frame supporting board can
move left and right.
6. 将运输时安装的工作台固定板取下（如图 2 –1 示）。
Take off the fixed plate which is assembled inside the table during the
transportation.(see pix 2-1)
7. 检查各联接处是否有松动脱落，各运动部分传输皮带有无脱落。
Check all the connections are loosen or not and the transmission belts are loosen or
not.
8. 检查各直线导轨上的滑块有无滑脱。
Check the sliders on the linear rail slip or not
9. 检查电气元件是否固定、接触是否良好。
Check electronic components are fixed or not, connected or disconnected.
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工作台固定板（红色）Fixed plate on the table (red section)
10. 开机前请务必详细阅读本《操作说明书》。
Read help manual carefully before turn on the equipment.
图 2-1（松开工作台固定板）
Pix 2-1(Loose the fixed plate on the table)
2.2 操作环境 Operating environment
环境温度：不论印刷机内有无工件，该机的工作环境温度最好在 23±5℃之间。
Temperature: No matter there are work pieces or not inside the printer, the operation
temperature is best between 23±5℃.
相对湿度：该系列机的工作环境相对湿度应＜80%。
Relative humidity: The operation relative humidity of this serial of printer need be ＜80%.
储存条件：机器储存应防潮、防尘、防暴晒。在运输过程中，请尽量避免过高的湿度、震动、
压力及机械冲击。
Restore requirement: Dampproof, dustproof, anti-exposure. Avoid high humidity, shake,