GD450 说明书(中英文版） - 第24页
- 24 - 注： 本机器推荐用户使用规格为 650 × 550mm 的网框 （见 《用户手册》 附 1 推荐使用的网框 尺寸） 。 Notice: T he size of the f rame recommended for this equipment is 650 × 550mm(See the frame size in the attachment 1o f the help manual) 3.2.2 锡膏准备 Solde…
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tank (Liquid level should be beyond the liquid level sensor).
检查机器的紧急制动开关是否弹起；
Check whether the emergency switch bounces.
检查三色灯工作是否正常，检查机器前后门是否关好。
Check whether tri-color light work normally and the doors in the front and back
are closed,
3.2 开始生产前准备 Preparation before the production
3.2.1 模板的准备 Template preparation
1) 模板基材厚度及窗口尺寸大小直接关系到焊膏印刷质量，从而影响到产品质量。模板
应具有耐磨、孔隙无毛刺无锯齿、孔壁平滑、焊膏渗透性好、网板拉伸小、回弹性好
等特点。
The thickness of base material of template and the size of window relate directly to
the printing quality of the solder paste and then relate to the production quality. The
template need has following features. Wearable. There is no burr and sawtooth on
the pore. Wall of hole need be smooth and even. Solder paste permeability is high.
The extension of stencil is small. Good resilience.
2) 根据网框尺寸大小移动网框支承板，将网框前后、左右方向的中心对准印刷机前横梁
及左、右支承板上的标尺“0”刻度位置，居中摆放后，再将网板锁紧。
Remove frame supporting plate according to the size of the frame. Let the centre in
the front/back/left/right direction of frame align at “0” position scale on the scale plate
of the front beam of printer and the left/right supporting plate. Place it in the centre
and fixed the stencil.
网框中心对准箭头指示处
The centre of the frame aims at the position remarked by the arrow
图 3-1
Pix 3-1
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注：本机器推荐用户使用规格为 650×550mm 的网框（见《用户手册》附 1 推荐使用的网框
尺寸）。
Notice: The size of the frame recommended for this equipment is 650×550mm(See the
frame size in the attachment 1of the help manual)
3.2.2 锡膏准备 Solder paste preparation
1) 在 SMT 中，焊膏的选择是影响产品质量的关键因素之一。不同的焊膏决定了允许印刷
的最高速度，焊膏的粘度、润湿性和金属粉粒大小等性能参数都会影响最后的印刷品
质。
The quality of the solder paste is one of the critical factors which will affect the
quality of the production in SMT industry. The difference of the solder paste can
determine the highest speed of printing. The viscosity and wettability of the solder
paste and the size of the metal particle etc. also will affect the quality of the
production.
2) 对焊膏的选择应根据清洗方式、元器件及电路板的可焊性、焊盘的镀层、元器件引脚
间距、用户的需求等综合起来考虑。
Selecting the solder paste need consider the cleaning method, weldability of the
component and circuit board, bonding pad coating, the space of the component pin
and operator need.
3) 锡膏选定后，应根据所选锡膏的使用说明书要求使用。
Use the solder paste according to the help manual of the selected solder paste.
4) 在使用之前必须搅拌均匀，直至锡膏成浓浓的糊状并用刮刀挑起能够很自然的分段落
下即可使用。
Mix the solder paste fully until it is very thick and can drop segmentedly and naturally
when it is stirred up.
5) 锡膏从冰柜中取出不能直接使用，必须在室温 25℃左右回温（具体使用根据说明书而
定）；锡膏温度应保持与室温相同才可开瓶使用
Operator can not use the solder paste directly when it is taken out from the freezer. It
can be used after the warming up in the room temperature which is about 25℃.(see
the help manual of the solder paste ). The solder paste container can be open when
the temperature of solder paste and room temperature is the same.
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6) 使用时应将锡膏均匀地刮涂在刮刀前面的模板上，且超出模板开口位置，保证刮刀运
动时能将锡膏通过网板开口印到 PCB 板的所有焊盘上。
Spread the solder paste evenly on the template which is assembled before the
scraper. The solder paste need be spread beyond the open position of the template
to insure that scraper can print the solder paste on all of the bonding pads of the
PCB boards through the stencil open position.
3.2.3 PCB 定位调试 PCB Positioning adjustment
1. 打开机器主电源开关。
Turn on the main power switch of the equipment.
2. 进入印刷机主画面。如图 3-2
Enter the main interface of the printer. See pix 3-2
图 3-2(打开机器程序的主界面)