GD450 说明书(中英文版） - 第25页
- 2 5 - 6) 使用时应将锡膏均匀地刮涂在刮刀前面的模板上，且超出模板开口位置，保证刮刀运 动时能将锡膏通过网板开口印到 PCB 板的所有焊盘上。 S pread the solder paste evenly on the template which is assembled before th e scraper . The solder pa ste need be spread beyond the open posit…
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注：本机器推荐用户使用规格为 650×550mm 的网框（见《用户手册》附 1 推荐使用的网框
尺寸）。
Notice: The size of the frame recommended for this equipment is 650×550mm(See the
frame size in the attachment 1of the help manual)
3.2.2 锡膏准备 Solder paste preparation
1) 在 SMT 中，焊膏的选择是影响产品质量的关键因素之一。不同的焊膏决定了允许印刷
的最高速度，焊膏的粘度、润湿性和金属粉粒大小等性能参数都会影响最后的印刷品
质。
The quality of the solder paste is one of the critical factors which will affect the
quality of the production in SMT industry. The difference of the solder paste can
determine the highest speed of printing. The viscosity and wettability of the solder
paste and the size of the metal particle etc. also will affect the quality of the
production.
2) 对焊膏的选择应根据清洗方式、元器件及电路板的可焊性、焊盘的镀层、元器件引脚
间距、用户的需求等综合起来考虑。
Selecting the solder paste need consider the cleaning method, weldability of the
component and circuit board, bonding pad coating, the space of the component pin
and operator need.
3) 锡膏选定后，应根据所选锡膏的使用说明书要求使用。
Use the solder paste according to the help manual of the selected solder paste.
4) 在使用之前必须搅拌均匀，直至锡膏成浓浓的糊状并用刮刀挑起能够很自然的分段落
下即可使用。
Mix the solder paste fully until it is very thick and can drop segmentedly and naturally
when it is stirred up.
5) 锡膏从冰柜中取出不能直接使用，必须在室温 25℃左右回温（具体使用根据说明书而
定）；锡膏温度应保持与室温相同才可开瓶使用
Operator can not use the solder paste directly when it is taken out from the freezer. It
can be used after the warming up in the room temperature which is about 25℃.(see
the help manual of the solder paste ). The solder paste container can be open when
the temperature of solder paste and room temperature is the same.
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6) 使用时应将锡膏均匀地刮涂在刮刀前面的模板上，且超出模板开口位置，保证刮刀运
动时能将锡膏通过网板开口印到 PCB 板的所有焊盘上。
Spread the solder paste evenly on the template which is assembled before the
scraper. The solder paste need be spread beyond the open position of the template
to insure that scraper can print the solder paste on all of the bonding pads of the
PCB boards through the stencil open position.
3.2.3 PCB 定位调试 PCB Positioning adjustment
1. 打开机器主电源开关。
Turn on the main power switch of the equipment.
2. 进入印刷机主画面。如图 3-2
Enter the main interface of the printer. See pix 3-2
图 3-2(打开机器程序的主界面)
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Pix 3-2 (The main interface of the program)
3. 机器会自动转入归零模式。单击[退出]按钮，机器退出归零模式；单击[开始归零]按钮，
机器转入归零进程，并自动检测机器内部是否存在 PCB 板,如图 3-3,如机器内有 PCB，
请在该提示下状态下取出，并单击[确定]按钮,机器正式开始归零直到完成,如图 3-4。
The printer will enter into the mode of returning to zero. Clicking the 退出(exit) button,
the printer exits the mode of returning to zero. Clicking the 开始归零(return to zero)
button, the printer will enter into the process of returning to zero and inspect
automatically whether there is PCB board inside the printer. See pix 3-3. If there is
PCB board, please take out it according to the indication and click 确定(OK )button.
The process of returning to zero finished. See pix 3-4.
图 3-3(归零时提示机器内存在 PCB，提示取出)