GD450 说明书(中英文版) - 第4页

- 4 - 4.2.3 附属菜单功能解释及其操作 · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · 57 Function explanation and operation of attached menu 第五章报警处置 · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · …

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2 .6.2 软件安················································20
Software installation
第三章 生产工作流程··············································21
Chapter 3 Production working flow
3.1 开机前检查···················································21
Check before turning on the equipment
3.2 开始生产前准备···············································22
Preparation before production
3.2.1 模板的准备···············································22
Template preparation
3.2.2 锡膏准备················································23
Solder paste preparation
3.2.3 PCB 定位调试············································24
PCB Positioning adjustment
3.2.4 刮刀压力和速度的选择····································38
Selection of the pressure and speed of the scraper
3.2.5 脱模速度和脱模长·····································39
Speed and length of demoulding
3.3 试生产························································40
Trial production
3.4 生产流程图···················································43
Production flow
第四章 操作系统说明··············································45
Chapter 4 Introduction of the operation system
4.1 系统启动·····················································45
System start-up
4.2 主窗口组成···················································45
Main window components
4.2.1 主工具栏 1 功能解释及其操作································46
Function explanation and operation of the main toolbar 1
4.2.2 主工具栏 2 功能解释及其操作································49
Function explanation and operation of the main toolbar 2
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4.2.3 附属菜单功能解释及其操作·································57
Function explanation and operation of attached menu
第五章报警处置····················································62
Chapter 5 Alarm disposal
5.1 机器报警项目·················································62
Equipment alarm items
5.2 机器报警项目解释以及处置方·································62
Explanation of equipment alarm items and the solutions
第六章新增部分功能介绍说明········································69
Chapter 6 Introduction of the new functions
6.1 2D 锡膏检测操作说明·········································69
Operating introduction of 2D solder paste test
6.2 SPC 数据分析系统简介及使用说·······························75
SPC data analysis system introduction and its help manual
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第一章 系统描述
Chapter 1 System description
1.1 功能特性 Function
先进的上视/下视视觉系统,独立控制与调节的照明,高速移动的镜头,精确地进行
PCB 与模板的对准,确保印刷精度为±0.025mm
Advanced up/down visual system, independent controllable and adjusted lighting,
high speed mobile camera lens, precisely alignment for the PCB and template
and make sure that the printing accuracy is ±0.025mm.
高精度伺服马达驱动及 PC 控制,确保印刷之稳定性和精密度,无限制的图像模式
识别技术具有±0.01mm 重复定位精度。
High accurate servo motor and PC control which can insure the stability and
precision of the printing. Unlimited image pattern recognition technology has the
repeated positioning accuracy for ±0.01mm.
悬浮式印刷头,具有特殊设计的高刚性结构,刮刀压力、速度、行程均由电脑智能
控制,维持印刷质量的均匀稳定;刮刀横梁经过特殊优化结构设计,轻巧且外形美
观。
Suspended printing head which is designed specially in high rigid structure. The
computer controls the pressure, speed and movement of the scraper, which can
maintain the even and stability of the printing. The structure of scraper beam has
been optimized designed. The scraper beam is light and well-formed.
可选择人工/自动网板底面清洁功能。自动、无辅助的网板底面清洁功能,可编程控
制干式、湿式或真空清洗,清洗间隔时间可自由选择,能彻底清除网孔中的残留锡
膏,保证印刷品质。
The bottom of the board can be cleaned by manual or automatically. The clean
function for the bottom of board is automatic and without assists. It can be
programmed to control the dry, wet or vacuum cleaning. The cleaning time
interval can be free to choose. It can clean all the solder paste inside the board