GD450 说明书(中英文版） - 第46页
- 46 - 慢，待完全脱离后 ，基板可以快速下 降。慢速分离有 利于焊膏形成清 晰边缘，对细间距 的印 刷尤其重要。一般设定为 3mm/s ，太快易破坏锡膏形状。 本机器允许设置范围为 0 ～ 20mm/s 。 Demoulding speed: It is the speed afte r the printed base board sep arates f rom the template. Before the solder …
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刮刀的压力及刮刀速度是钢网印刷中两个重要的工艺参数。
The two parameters of the pressure and speed of the scraper in the stencil
printing are very important.
刮刀速度：
选取的原则是刮刀的速度和锡膏的粘稠度及 PCB 板上 SMD 的最小引脚间距
有关，选择锡膏的粘稠度大，则刮刀的速度要低，反之亦然。对刮刀速度的选择，一般先从
较小压力开始试印，慢慢加大，直到印出好的焊膏为止。速度范围为 15～50mm/s。在印刷
细间距时应适当降低刮刀速度，一般为 15～30mm/s，以增加锡膏在窗口处的停滞时间，从
而增加 PCB 焊盘上的锡膏；印刷宽间距元件时速度一般为 30～50mm/s。（＞0.5mm pitch
为宽间距，＜0.5mm pitch 为细间距〕
Scraper speed: The selection of scraper speed is related to the solder paste viscosity
and the min pin space of the SMD on PCB board. The viscosity of solder paste is higher,
the speed of scraper is lower and vise versa. For the selection of scraper speed, do the trial
printing with small pressure in general. And add the pressure slowly until print the good
solder paste. The speed range is 15～50mm/s. Lower the scraper speed in order to add the
delay time in entrance for solder paste so that to add the solder paste on the bonding pad of
PCB when print the narrow space and the speed is 15～30mm/s in general. The printing
speed for the large space component is 30～50mm/s. (＞0.5mm pitch is large space，＜
0.5mm pitch is narrow space）
本机器刮刀速度允许设置范围为 0～200mm/s。
The allowed scope of scraper speed is 0～200mm/s.
刮刀压力：压力直接影响印刷效果，压力以保证印出的焊膏边缘清晰，表面平整，厚度
适宜为准。压力太小，锡膏量不足，产生虚焊；压力太大，导致锡膏连接，会产生桥接。因
此刮刀压力一般是设定为 0.5～10kg。
Scrape pressure: The pressure has direct influence on the printing performance. The
suitable pressure is the one that can insure the clear edge, even surface and good
thickness of the printing solder paste. Too little pressure and insufficient solder paste will
lead to empty solder. Too much pressure will bring about solder paste connection and
bridging. So the scrape pressure is set from 0.5kg to 10kg.
3.2.5 脱模速度和脱模长度 Speed and length of demoulding
脱模速度：指印刷后的基板脱离模板的速度，在焊膏与模板完全脱离之前，分离速度要
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慢，待完全脱离后，基板可以快速下降。慢速分离有利于焊膏形成清晰边缘，对细间距的印
刷尤其重要。一般设定为 3mm/s，太快易破坏锡膏形状。
本机器允许设置范围为 0～20mm/s。
Demoulding speed: It is the speed after the printed base board separates from the
template. Before the solder paste separates from the template completely, the separation
speed need be slow. After completed separation, the base board can decline fast. Slow
separation speed is good for the clear edge formation of solder paste. It is very crucial for
the narrow space printing. Generally, the speed is set at 3mm/s. If the speed is too fast, the
shape of solder paste will be damaged.
The allowed scope of demouding speed is 0～20mm/s.
PCB
与模板的分离时间：即印刷后的基板以脱板速度离开模板所需要的时间。时间过长，
易在模板底面残留焊膏，时间过短，不利于焊膏的站立。一般控制在 1 秒左右。
Separation time for the PCB and template: It is the time for the printed base board
separates from template with stripper plate speed. Too much time, it is easy to remain the
solder paste on the bottom side of template. Too little time, it is not good for the standing of
solder paste. The speed is controlled at about 1 second in general.
本机器用脱模长度来控制此变量，一般设定为 0.5～2mm。本机器允许设置范围为 0～
10mm。
The printer control this variate by the demoulding length which is set at 0.5～2mm. The
allowed scope for this printer is 0～10mm.
3.3 试生产 Trial production
在以上准备工作做完以后，即可进行 PCB 板的试印刷。操作方法是：
Can do the trial printing of the PCB board after above preparations are finished. The
operation methods are as following:
1. 单击主工具栏中的[ ]按钮，出现图 3-18 界面，在该界面上勾选显示调节窗口，
然后点击[确定]按钮回到软件主界面。
Click the “ ”(production setting) button in the mail tool bar. The interface in the
Pix 3-18 will be displayed. Select “显示调节窗口” (display adjustment window) and
click “确定”（ok）button to come back to the main interface of the software.
2. 在软件主界面上点击[ ]按钮，接下来按软件提示操作进入生产模式，机器在完成
PCB 运输，定位，取像，Z 轴上升到印刷位置后，出现图 3-18 画面。
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Click “ ” (start) button in the main interface of the software. According to the
software instructions, it will enter production mode. The interface in the pix 3-18 will
be displayed after the finish of the PCB transmission, positioning and image capture
and the Z axis lift up to the printing location.
3. 在 3-18 界面下，检查 PCB 是否和钢网紧贴，要求是 PCB 刚好挨着钢网，否则需调节
Z 轴高度，直到满足要求。检查 PCB 焊盘是否和钢网网孔重合，如不重合，则需要调
整平台 X、Y1、Y2，直到重合为止。
Check whether the PCB is against stencil in the interface of pix 3-18. The PCB need
be against stencil. Otherwise operator need adjust the height of Z axis until the PCB
is against stencil. Check whether PCB bonding pad and stencil hole is overlapped. If
not, please adjust the X,Y1,Y2 of platform until PCB bonding pad and stencil hole is
overlapped.
在图 3-18 界面下安装刮刀，
注意：
刮刀片安装前应检查其刀口是否平直，有无缺损。
Assemble the scraper in the interface of pix 3-13. Please check whether the blade is
even, straight and damaged before assembling the scraper blade.
4. 以上工作完成后点击[确定]按钮，完成第一块 PCB 的印刷。
Click “确定”（ok） button after above preparation are finished. Then the printing of the
first PCB are finished.
5. 如印刷结果不符合质量要求，应重新进行参数设置或在主界面上点击[ ]按钮进入
图 3-19 界面输入平台及印刷误差补偿值，直到印刷结果满足质量要求，方可正式开始
生产。
If the printing performance can not meet the quality requirement, operator need reset
the parameter or click “ ” (production setting) button to enter the interface of pix
3-19. Input the error compensation value of platform and printing in that interface
until printing performance can not meet the quality requirement and then can start
the production officially.
6. 锡膏印刷质量要求：
The quality requirement of solder paste printing.
本机器设定锡膏厚度在 0.1—0.3mm 之间、焊膏覆盖焊盘的面积在 75%以上即满足质
量要求。
The thickness of solder paste for this printer need be 0.1—0.3mm. There are
above 75% solder paste printed on the bonding pad.