80S-2080F480F4-680F5 User’s Manual - 第308页
SIPLACE 80S-20/F4/F4-6/F5 User’s Manual 5 Vision Functi on s Edition 03/98 from S oftware Version SR.404.xx 5.6 Test Component Line engi neer 5 - 87 Fig. 5.6.13 Test component menu, Test component video image With the Re…
5 Vision Functions SIPLACE 80S-20/F4/F4-6/F5 User’s Manual
5.6 Test Component Edition 03/98 from Software Version SR.404.xx
5 - 86 Line engineer
5.6.4.3
Test Component
Option
NOTE
This option can only be activated if you have already loaded a package form number and a component has
been picked up.
If a component is not optically centered you will have the possibility of checking the centering procedure with
this option. The measurement results are displayed on the screen but not saved.
Fig. 5.6.12 Test component menu, Test component option
When this option is activated the following actions are started:
– The measurement procedure is activated.
– The video image appears on the screen.
– The header and footers are displayed.
SIPLACE 80S-20/F4/F4-6/F5 User’s Manual 5 Vision Functions
Edition 03/98 from Software Version SR.404.xx 5.6 Test Component
Line engineer 5 - 87
Fig. 5.6.13 Test component menu, Test component video image
With the Return key you can call all defined individual steps in the measurement procedure one after the
other. Each time you press the Return key a measurement command is given and the results shown on
the screen.
Use Esc to quit the option. The video image closes and the Test component menu reappears.
GF No. = 5Test component
RET: Test component
5 Vision Functions SIPLACE 80S-20/F4/F4-6/F5 User’s Manual
5.6 Test Component Edition 03/98 from Software Version SR.404.xx
5 - 88 Line engineer
5.6.4.4
Measure Component
Option
NOTE
This option can only be activated if you have already loaded a package form number and a component has
been picked up.
Fig. 5.6.14 Test component menu, Measure component option
When this option is activated the following actions are started:
– The video image appears on the screen.
– The measurement command is given, using the predefined parameters.
– The MVS performs each component-specific measurement step in turn.
– The measurement values are displayed in the video image.
In addition, to conventional components with lead connections the 80F
4
, 80F
4
-6 or 80F
5
machines can also
optically center BGAs (B
all Grid Arrays) and flip-chips. The body of BGA and flip-chip components is made of
passivated silicon chips. Such bodies have strong reflective properties and their surfaces are wavy. The con-
nections of these components take the form of balls with a diameter of at least 80 µm. Ball-grid arrays have
their connections, as the name suggests, arranged in the form of a grid - this means that they can be
described in terms of rows and columns.