80S-2080F480F4-680F5 User’s Manual - 第364页

SIPLACE 80S-20/F4/F4-6/F5 User’s Manual 5 Vision Functi on s Edition 03/98 from S oftware Version SR.404.xx 5.7 Guidelines for Describing Package Form s Line engi neer 5 - 143 5.7.8.4 Testing Illumination Settings You ca…

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5 Vision Functions SIPLACE 80S-20/F4/F4-6/F5 User’s Manual
5.7 Guidelines for Describing Package Forms Edition 03/98 from Software Version SR.404.xx
5 - 142 Line engineer
.
Fig. 5.7.11 Illumination parameters for components at the 6x revolver head camera (32x32)
D ia g r a m fo r a d ju s tin g th e illu m in a tio n o f c o m p o n e n ts
Chip
IC
Melf
BGA
Tantalum
capacitor
fla t: 1 5 0
steep:150
J-Lead
PLCC
fla t: 7 0
steep: 140
Ceram ic
BGA
fla t: 0
steep: 255
Plastic
BGA
0805 and
larger
fla t: 2 0 0
steep: 120
0603
fla t: 1 5 0
steep: 200
G eneral
fla t: 1 2 0
steep: 150
fla t: 2 5 5
steep: 130
fla t: 2 0 0
s te e p : 0
G u llw in g
SO, SO T,
TSO P
QFP,
Special com ponents
Power
transistor
fla t: 2 5 5
steep: 150
PLCC-
socket
fla t: 0 - 3 0
steep:150-200
Plug
fla t: 0
steep: 150-200
Q uartz
fla t: 2 0 0
steep:120-180
TBG A
re fle c t. b o d y
fla t: 2 0 0
s te e p : 0
TBG A
dull
fla t: 0
steil:150-200
approx. 180
255
If necessary,
use the LU T
below
1
Reflect.
body
fla t: 2 5 5
steep: 40
8
6
2
7
5
3
4
6
1
2
3
4
5
D o not use for reflective com ponents.
U se negative ball contrast w hen m apping the ball.
The description m ust only contain the innerm ost row of balls. U se negative contrast.
It m ust be possible to insert the com ponents. The test m ust be carried out for each type.
7
The edge of the large cooling surface is extrem ely irregular on som e types on account of the production m ethods used.
If you are unsure, do not use it for the m easurem ent
U p to PLC C 52 base. M ake sure that you are using the correct nozzle.
D escribe as for a BG A , if necessary.
8
D escribe as for an FD C . M easuring m ode: size+ lead
150
255
C ontrast
graduation
SIPLACE 80S-20/F4/F4-6/F5 User’s Manual 5 Vision Functions
Edition 03/98 from Software Version SR.404.xx 5.7 Guidelines for Describing Package Forms
Line engineer 5 - 143
5.7.8.4 Testing Illumination Settings
You can set the illumination parameters by calling the ’Illumination’ option (see Section 5.6.4.8, Page 5 - 101).
Using the 'Measure Component Option' you can then measure the component and check your settings with
the aid of the measurement results.
Proceed as follows to test your illumination setting:
Using the illumination values suggested in Fig. 5.7.11 carry out measurement. Measurement should run
through successfully.
For each level reduce the set brightness level by 50 %.
Measurement should run through successfully.
For each level raise the set brightness level by 50 %.
Measurement should run through successfully.
If you are not successful with the above procedure, proceed as follows:
Starting with the suggested illumination value, increase the brightness of each individual illumination level
for as long as measurement is still successful.
Find this upper limit value for each individual illumination level in turn.
Starting with the suggested illumination value, decrease the brightness of each individual illumination level
for as long as measurement is still successful. Find this lower limit value for each individual illumination
level in turn.
Determine the average value of the upper and lower limit values. This will be the optimum illumination
value.
Example of an illumination test:
– Settings from the diagram:
flat: 150
steep: 180
– Measure the component. Measurement is successful.
– Reduce setting values by 50%.
flat: 75
steep: 90
– Increase setting values by 50%.
flat: 225
steep: 255
– Measure the component. Measurement is successful.
– Reset the settings to the suggested values:
flat: 150
steep: 180
¬ optimum setting
5 Vision Functions SIPLACE 80S-20/F4/F4-6/F5 User’s Manual
5.7 Guidelines for Describing Package Forms Edition 03/98 from Software Version SR.404.xx
5 - 144 Line engineer
NOTE
With respect to 0603 components, avoid the nozzle being displayed during imaging. If this seems likely,
remove the component from the nozzle and use the ’Illumination Option’ on Page 101 to see whether the noz-
zle did appear in the image.
5.7.8.5 General Information on Setting Illumination Values
– As a rule it is better to overilluminate the component than to underilluminate it. A saturated image is prefer-
able to a low-contrast image.
– Optimum illumination is attained when only the leads are imaged and the component body is not shown.
– If you cannot clearly separate the image of the component body from the leads, we recommend to illumi-
nate body and leads equally and then to measure the outline.
5.7.9 Setting the component illumination on the 6-nozzle revolver head
camera (vision system for flip-chips, bare dies, etc. - DCA option)
5.7.9.1 General Information on Illumination Methods
The idea of illumination setting is to obtain an image of the leads of a component which is as high-contrast as
possible. At the same time it is also important to suppress representation of the body of the component.
These instructions are intended to help you find the best possible illumination parameters. This, however,
does not imply that you rigidly comply with the values specified in these instructions. The way you should pro-
ceed is first to follow these instructions and then to adjust the parameters yourself where necessary. It may
well be that you come across one or other component the leads of which are better illuminated using values
different to the ones suggested in these instructions.
The illumination system comprises four different illumination levels. The intensities can be programmed indi-
vidually. By using the individual illumination levels one at a time or in combination with one another you can
adapt the illumination to suit a wide range of components.
X plane illumination level
The X plane illumination level is ideally suited for use with flip-chips, µBGAs and melf components. It high-
lights balls particularly clearly.
Flat illumination level
The flat illumination level is used for illuminating BGAs, µBGAs, flip-chips, J-lead components (PLCC), Melfs
and components with convex-type leads. It tends to emphasize body and lead edges. It is, however, less suit-
able for displaying bright component bodies and ceramic components.