182050 User manual - 第211页

semi automatic &21680$ %/(5( 3/(1,6+0 (176 3$67(/2$ ',1* Software Version 07SP02 User Manual 8.3 4. Load the solder p aste onto the screen. 5. Lower the print head cover . 6. Press the System butto n. 7. Press…

100%1 / 266
semi automatic
&21680$%/(5(3/(1,6+0(176
3$67(/2$',1*
8.2 User Manual Software Version 07SP02
PASTE LOADING
Two options are provided for loading paste onto the screen, Manual Load and
Auto Dispense. Manual load allows the operator to load paste by hand onto
the stencil. Auto dispense loads paste automatically onto the stencil in the
correct area, from the paste cartridge located in the paste dispenser on the print
carriage. Auto dispense can be programmed into a product file to take place
automatically during a print run or either option can be selected, directly from
the MMI, to take place at the operators discretion.
The print direction option allows the user to select the direction of the next print
stroke after paste loading. The option is available prior to pressing Run in all
machine modes, ie Auto/Single/Stop.
WARNING
SOLDER PASTE AND SOLVENTS. WHEN USING OR HANDLING ANY SOLDER
PASTE OR SOLVENT FORMULATION THE MANUFACTURERS’ RECOMMEND
SAFETY PRECAUTIONS MUST BE STRICTLY ADHERED TO.
WARNING
PROTECTIVE CLOTHING. APPROVED PROTECTIVE CLOTHING SHOULD BE
WORN BY SOLDER PASTE AND SOLVENT HANDLERS AT ALL TIMES TO
ELIMINATE FUME INHALATION, EYE CONTACT, SKIN CONTACT AND
INGESTION.
Manual Loading
Paste
Replenishment Off
NOTE
With the Paste Dispenser not fitted, the paste dispense rate (in the product file)
pauses the machine after printing the amount of boards specified. This allows
the operator to open the printhead to load paste on to the stencil. The paste
dispense rate can be set from 1 to 100 boards. If 0 (zero) is entered, the
operator is not be reminded to replenish the paste.
1. Press Paste Load (F3).
2. Press Manual Load (F2). The message ‘Open cover and load paste’ is
displayed.
3. Raise the printhead cover.
Run
Open
Cover
Paste
Load
Clean
screen
Setup Monitor Maint.
Auto
Dispense
Manual
Load
Load
Cart.
Print
Directn
Exit
semi automatic
&21680$%/(5(3/(1,6+0(176
3$67(/2$',1*
Software Version 07SP02 User Manual 8.3
4. Load the solder paste onto the screen.
5. Lower the printhead cover.
6. Press the System button.
7. Press Continue (F1).
8. Press Exit (F8).
Paste
Replenishment On
NOTE
With the Paste Dispenser not fitted, the paste dispense rate (in the product file)
pauses the machine after printing the amount of boards specified. This allows
the operator to open the printhead to load paste on to the stencil. The paste
dispense rate can be set from 1 to 100 boards. If 0 (zero) is entered, the
operator is not be reminded to replenish the paste.
1. When the machine has printed the amount of boards specified in the Paste
Dispense Rate setting, the machine is stopped and the message ‘Open
cover and load paste’ is displayed in the Message Prompt Window of the
MMI. The following menu bar is displayed.
NOTE
Selecting the Continue (F1) button restarts the printing without the oppor-
tunity to replenish the paste.
2. Raise the printhead cover.
3. Load the solder paste onto the stencil.
4. Lower the printhead cover.
5. Press the System button.
Continue
Auto
Dispense
Manual
Load
Load
Cart.
Print
Directn
Exit
Continue
semi automatic
&21680$%/(5(3/(1,6+0(176
3$67(/2$',1*
8.4 User Manual Software Version 07SP02
6. Press the Continue (F1) button.
Paste Removal During continuous printing operations paste residue build up may occur with the
same screen in use and with the squeegee option fitted. This build up can affect
the print quality of the print process, ie paste in apertures, paste ‘tramlining’ on
the screen and residue on the squeegees.
Before loading paste the operator should ensure that any residue is cleaned off
the screen and squeegees.
To clean the screen effectively, it is recommended that the operator removes
the screen from the machine during this operation (see Operator manual -
Product Change over).
WARNING
RECOMMENDED SOLVENTS. ANY SOLVENTS USED MUST COMPLY WITH
LOCAL ENVIRONMENTAL GUIDELINES. DEK RECOMMEND USING SOLVENTS
THAT ARE ENVIRONMENTALLLY FRIENDLY, IE CFC FREE AND WATER BASED.
SOLVENTS USED MUST HAVE FAST EVAPORATION RATES AND FLASHPOINT
SPECIFICATIONS GREATER THAN 39ºC.
WARNING
SOLDER PASTE AND SOLVENTS. WHEN USING OR HANDLING ANY SOLDER
PASTE OR SOLVENT FORMULATION THE MANUFACTURERS’ RECOMMEND
SAFETY PRECAUTIONS MUST BE STRICTLY ADHERED TO.
WARNING
PROTECTIVE CLOTHING. APPROVED PROTECTIVE CLOTHING SHOULD BE
WORN BY SOLDER PASTE AND SOLVENT HANDLERS AT ALL TIMES TO
ELIMINATE FUME INHALATION, EYE CONTACT, SKIN CONTACT AND
INGESTION.
Remove paste from the screen and squeegees with a spatula and place in a
suitable container. Smear deposits are removed using a suitable cleaning cloth
dampened with a suitable solvent.
NOTE
Waste paste and contaminated cleaning cloths are to be disposed of in accord-
ance with local authority regulations.
Continue