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2 Operational Safety User Manual SIPLACE CA- Series 2.13 ESD Guidelines From software version SC.708.0 Edition 12/2014 EN -DRAFT 120 Always place the modules on a conductive surfac e ( table with an ESD coating, conducti…
User Manual SIPLACE CA-Series 2 Operational Safety
From software version SC.708.0 Edition 12/2014 EN -DRAFT 2.13 ESD Guidelines
119
2.13 ESD Guidelines
2.13.1 What Does ESD Mean?
Almost all of the modules in use today are equipped with highly integrated MOS blocks and com-
ponents. The manufacturing techniques used mean that these electronic components are ex-
tremely sensitive to overvoltage and thus to electrostatic discharge.
The abbreviation for such modules is 'ESD' (Electrostatic Sensitive Device). ’ESD’ is used inter-
nationally. The following symbol on cabinet rating plates, racks or packaging indicates that com-
ponents which are sensitive to electrostatic discharge have been used and thus that the modules
concerned are also touch-sensitive.
ESDs can be destroyed by voltages and power levels that are far below the level
that can be perceived by humans. Such voltages occur if a person touches a com-
ponent or module without earthing themselves. Components that are exposed to
such overvoltages do not generally appear to be defective immediately - incorrect
behavior starts after the component or module has been in operation for some time.
2.13.2 Important Measures to Protect Against Static Charging
Most plastics can easily become charged and must therefore be kept away from at-risk com-
ponents.
Always ensure that people, the workplace and packaging are safely earthed when handling
electrostatic sensitive components.
2.13.3 Handling ESD Modules
Do not touch electronic modules unless it is absolutely essential to do so in order to carry out other
work. If it is necessary, make sure that you do not touch the pins or printed conductors when you
pick up flat modules.
Do not touch components unless
you are constantly earthed by an ESD wrist strap or
you are wearing ESD shoes or ESD shoe earthing strips on an ESD floor.
Always discharge yourself before you touch an electronic module. To do this, simply touch a con-
ductive and earthed object immediately before you touch the module (such as unpainted parts of
a switch cabinet, a water pipe, etc.).
Do not allow modules with chargeable and highly insulating materials to touch one another, e.g.
plastic films, insulating table surfaces or items of clothing made from synthetic fibers.
2 Operational Safety User Manual SIPLACE CA-Series
2.13 ESD Guidelines From software version SC.708.0 Edition 12/2014 EN -DRAFT
120
Always place the modules on a conductive surface (table with an ESD coating, conductive ESD
foam, ESD bag or container).
Do not move the assemblies near to data view devices, screens or television units. Keep a mini-
mum distance of > 10 cm to monitors.
2.13.4 Measurements and Modifications to ESD Modules
Do not take measurements on the modules unless the following conditions are fulfilled:
– the measuring device is earthed (e.g. via PE conductors) or
– you discharge the measuring head just before taking measurements with a potential-free
measuring device (e.g. by touching an unpainted metal part of the controller casing).
Always use an earthed soldering iron if you carry out any soldering work.
2.13.5 Dispatching ESD Modules
Always store modules and components in conductive packaging (e.g. metallized plastic bags
or metal sleeves) and dispatch them in conductive packaging.
If the packaging is not conductive, place the modules in a conductive envelope before pack-
aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex-
ample. NEVER use plastic bags or film. 2
If the module has integral batteries, ensure that the conductive packaging does not touch or
short-circuit the battery terminals and, if necessary, first cover the terminals with insulating
tape or material.
User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.1 Performance Data for the SIPLACE CA
121
3 Technical Data
3.1 Performance Data for the SIPLACE CA
3
PLEASE NOTE
Benchmark values
The following table lists the benchmark values (as defined in the "Scope of Service and
Delivery SIPLACE CA") for SMT placement per placement area.
Placement head types
SIPLACE SpeedStar (C&P20 M)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
Placement performance
The placement performance is affected by the different head combinations and positions, plus the conveyor
configuration. Individual options and customized applications also influence the placement performance.
On request, SIPLACE can calculate the actual performance of your product on your machine configuration.
SIPLACE benchmark value [components/h]
The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the
conditions set out in the SIPLACE scope of service and supply.
SIPLACE CA4 placement machine
*a
See the note above for definition of placement performance values.
Number of gantries 4
Placement area 1 Placement area 2 Benchmark value Option
C&P20 M / C&P20 M C&P20 M / C&P20 M 80,000
Without High Precision Flag
C&P20 M / C&P20 M C&P20 M / C&P20 M 64,000 With High Precision Flag
C&P20 M / C&P20 M CPP_H / CPP_H 76,000 Without High Precision Flag
C&P20 M / C&P20 M CPP_H / CPP_H 67,000 With High Precision Flag on
C&P20 M
CPP_H / CPP_H CPP_H / CPP_H 72,000 --
C&P20 M / C&P20 M CPP_H/TH 63,000
Without High Precision Flag
C&P20 M / C&P20 M CPP_H/TH 54,000 With High Precision Flag on
C&P20 M
CPP_H / CPP_H CPP_H/TH 59,000 --
*)a Values only valid in conjunction with 4 X tables
CPP_H = MultiStar CPP only in high assembly position