00197498-03_UM_SiplaceCA-Serie_EN - 第139页
User Manual SIPLACE CA-Series 3 Technical Data From software version SC.708.0 Edition 12/20 14 EN -DRAFT 3.4 Dimensions and Weight of th e SIPLACE CA 139 3.4.8 Center of Gravity for SWS 3 Fig. 3.4 - 10 Coordinate system …

3 Technical Data User Manual SIPLACE CA-Series
3.4 Dimensions and Weight of the SIPLACE CA From software version SC.708.0 Edition 12/2014 EN -DRAFT
138
3.4.7 Center of Gravity for CA-Series Machines
3
Fig. 3.4 - 9 Center of gravity for CA-Series machines
3
Center of gravity coordinates:
These center of gravity coordinates relate to placement machines with a PCB conveyor height of
930 mm.
3
CAUTION
Before transportation, remove all changeover tables and SWS from the CA machine.
CA4 machine
Without SWS, without compo-
nent trolley
X coordinate
Y coordinate
Z coordinate
0 mm
0 mm
120 mm height

User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.4 Dimensions and Weight of the SIPLACE CA
139
3.4.8 Center of Gravity for SWS
3
Fig. 3.4 - 10 Coordinate system for SWS center of gravity
3
Center of gravity coordinates:
SWS X coordinate
Y coordinate
0 mm
650 mm

3 Technical Data User Manual SIPLACE CA-Series
3.5 Line Concept From software version SC.708.0 Edition 12/2014 EN -DRAFT
140
3.5 Line Concept
3.5.1 Description
3
The SIPLACE concept is distinguished by its flexibility, modularity, compact design and high per-
formance. Operated together with the SIPLACE X-Series, the SIPLACE CA machine allows you
to individually configure your production line with both identical and differing modules. If the pro-
duction requirements change, the individual placement machines are so compact and can be
combined with such flexibility that they can be recombined quickly and easily.
3
Fig. 3.5 - 1 Sample line concept
3
The SIPLACE family has the optimum placement system for each individual performance require-
ment.
SIPLACE CA-Series machines can place bare dies directly from the wafer, by using the flip chip
or die attach process, and can also place the entire SMD spectrum covered by the SIPLACE X
machines. The SIPLACE CA therefore marks the starting point of an innovative new placement
technology in the SIPLACE family.