00197498-03_UM_SiplaceCA-Serie_EN - 第142页

3 Technical Data User Manual SIPLACE CA-Series 3.6 Overviews of the Modules From software version SC.708.0 Edition 12/2014 EN -DR AFT 142 3.6 Overviews of the Modules 3.6.1 Overview of the SIPLACE CA4 Modules 3 3 Fig. 3.…

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User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.5 Line Concept
141
The machine is equipped with both SIPLACE wafer systems and with changeover tables and can
therefore produce the entire product with SMDs and bare dies, in one production cycle.
The SIPLACE CA even demonstrates a higher throughput performance than previous placement
systems for products which are only placed with bare dies.
Since this new concept combines at least two production lines to form a single lines (SMD and
bare die placement), the investment costs and cost of ownership can be reduced significantly.
Over the medium term, our customers will be able to convert their production lines from IC pack-
ages to bare die placement, thereby improving lead times, product costs and product dimensions.
3 Technical Data User Manual SIPLACE CA-Series
3.6 Overviews of the Modules From software version SC.708.0 Edition 12/2014 EN -DRAFT
142
3.6 Overviews of the Modules
3.6.1 Overview of the SIPLACE CA4 Modules
3
3
Fig. 3.6 - 1 CA4 machine with SWS - overview of modules
(1) Machine frame (2) PCB conveyor
(flexible dual conveyor)
(3) Extension kit on the PCB input side (4) Component trolley docking unit,
tape cutter, used tape channel
(5) Gantry 1 with placement head (6) Gantry 2 with placement head
(7) Extension kit on the PCB output side (8) Gantry 3 with placement head
(9) Monitor screen (2x) (10) Keyboard (2x)
(11) Gantry 4 with placement head (12) SIPLACE Wafer-System (SWS) at location
2
User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.7 Placement Heads
143
3.7 Placement Heads
3.7.1 SIPLACE SpeedStar for Top Placement Accuracy (C&P20 M)
3
Fig. 3.7 - 1 SIPLACE SpeedStar (C&P20 M) - function groups part 1
(1) DP drive, 20 drives
(2) "Vacuum sensor hold circuit" board
(3) Compressed air connection for 20 Venturi nozzles in the pickup/placement and holding circuit
(4) Line for the exhaust air from the pressure control valve (7)
(5) Return cylinder
(6) Z motor (linear motor)
(7) Pressure control valve