00197498-03_UM_SiplaceCA-Serie_EN - 第162页
3 Technical Data User Manual SIPLACE CA-Series 3.7 Placement Heads From software version SC.708.0 Edition 12/2014 EN -DR AFT 162 3.7.3 SIPLACE T winS t ar fo r High-Precision IC Placement 3 Fig. 3.7 - 10 SIPLACE T winSta…
User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.7 Placement Heads
161
3.7.2.9 Technical Data
3
SIPLACE MultiStar (CPP)
with component camera type 30 With component camera
type 33
(stationary camera)
*a
*)a Not in conjunction with SWS and not on location 2/4.
Component range
*b
*)b Please note that the placeable component range is also affected by the pad geometry, the customer-specific stan-
dards, the component packaging tolerances and the component tolerances.
01005 mm to 27 mm x 27 mm 0402 to 50 mm x 40 mm
Component spec.
Max height
*c
Max. height
*d
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
*)c CPP head: in low installation position (stationary component camera not possible).
*)d CPP head: in high installation position
6.0 mm
8.5 mm
0.3 mm
0.15 mm
0.25 mm
*e
0.35 mm
*f
0.14 mm
e
0.20 mm
f
0.4 mm x 0.2 mm
27 mm x 27 mm
4 g
*)e For components < 18 mm x 18 mm
*)f For components ≥ 18 mm x18 mm
11.5 mm
0.3 mm
0.15 mm
0.35 mm
0.2 mm
1.0 mm x 0.5 mm
50 mm x 40 mm
8 g
Programmable set-down force 1.0 - 10 N 1.0 - 10 N
Nozzle types 20xx, 28xx 20xx, 28xx
X/Y accuracy
*g
*)g The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the conditions
set out in the SIPLACE scope of service and supply.
± 41 µm / 3σ
± 55 µm / 4σ
± 34 µm / 3σ
± 45 µm / 4σ
Angular accuracy ± 0.4° / 3σ
*h
, ± 0.5° / 3σ
*i
± 0.5° / 4σ
h
, ± 0.7° / 4σ
i
*)h Component dimensions between 6 mm x 6 mm and 27 mm x 27 mm.
*)i Component dimensions smaller than 6 mm x 6 mm.
± 0.2° / 3σ
± 0.3° / 4σ
Illumination level 5 6
Possible illumination level settings 256
5
256
6
3 Technical Data User Manual SIPLACE CA-Series
3.7 Placement Heads From software version SC.708.0 Edition 12/2014 EN -DRAFT
162
3.7.3 SIPLACE TwinStar for High-Precision IC Placement
3
Fig. 3.7 - 10 SIPLACE TwinStar for high-precision IC placement
3
(1) Pick&Place module 1 (P&P1) - the TwinStar consists of 2 Pick&Place modules
(2) Pick&Place module 2 (P&P2)
(3) DP axis
(4) Z axis drive
(5) Incremental distance measuring system for the Z axis
User Manual SIPLACE CA-Series 3 Technical Data
From software version SC.708.0 Edition 12/2014 EN -DRAFT 3.7 Placement Heads
163
3.7.3.1 Description
This sophisticated placement head consists of two placement heads of the same type coupled to-
gether ("twin" head). Both heads work using the Pick&Place principle. The TwinStar is suitable for
processing complex and large components. Two components are picked up by the placement
head, optically centered on the way to the placement position and rotated into the necessary
placement angle. They are then placed gently and accurately onto the PCB with a controlled blast
of air.
New nozzles (type 5xx) have been developed for the TwinStar. With an adapter you can also use
the nozzles of type 4xx from the Pick&Place head and nozzles of type 8xx and 9xx from the Col-
lect&Place heads.