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User manual SIPLACE CA-Series 1 Introduction From software version SC.708.0 Edition 12/2014 EN -DRAFT 1.2 Machine Description 21 1.1.1.1 Overview of Placement Head Configuration 1 The performance dat a can be found in se…

1 Introduction User manual SIPLACE CA-Series

1.1 Machine Overview From software version SC.708.0 Edition 12/2014 EN -DRAFT

1.1 Machine Overview

1.1.1 SIPLACE CA4

Fig. 1.1 - 1 SIPLACE CA4 placement machine with SIPLACE Wafer System (SWS)

(1) SIPLACE CA4

(2) SIPLACE Wafer System (SWS)

The CA4 placement machine has four gantries, two for each placement area (PA). All the gantry

axes are driven by linear motors. The gantry axes can be positioned quickly and accurately in the

X and Y directions. The gantry arms are lightweight constructions made from a highly rigid carbon

fiber composite material.

The placement machine has at least one SIPLACE Wafer System (SWS) at one of the four loca-

tions, so that dies can be placed from wafers.

User manual SIPLACE CA-Series 1 Introduction

From software version SC.708.0 Edition 12/2014 EN -DRAFT 1.2 Machine Description

1.1.1.1 Overview of Placement Head Configuration

The performance data can be found in section 3.1, page 121.

1.2 Machine Description

The SIPLACE CA placement systems impress with high configuration flexibility, top placement

performance and maximum precision. The SIPLACE CA can place bare dies directly from the wa-

fer, by using the flip chip or die attach process, and can also place the entire SMD spectrum cov-

ered by the SIPLACE X machines.

Two placement methods are used on the placement machines:

– The Collect&Place method for high-speed placement of standard components

– The Pick&Place method for fast placement of special components in the fine-pitch and super

fine-pitch range

The SIPLACE CA is based on the well-proven hardware and software of the SIPLACE X machine.

Various modifications to the hardware and software enable the SIPLACE CA to operate with an

innovative new design: the SIPLACE Wafer System (SWS), which uses the same user interface

for both SIPLACE Pro and the station software. The placement machine has at least one SI-

PLACE Wafer System (SWS) at one of the four locations, so that dies can be placed from wafers.

The Siplace CA can also be operated without the SWS, in the same way as an X-Series machine.

This makes the components (dies) directly available to the placement head, in so-called wafers.

The gantries that are driven by linear motors can be positioned fast and precisely in X and Y di-

rection. Each gantry has one placement head.

Placement area 1 Placement area 2

C&P20 M / C&P20 M C&P20 M / C&P20 M

C&P20 M / C&P20 M CPP / CPP

CPP / CPP CPP / CPP

C&P20 M / C&P20 M CPP / TH

CPP / CPP CPP / TH

1 Introduction User manual SIPLACE CA-Series

1.2 Machine Description From software version SC.708.0 Edition 12/2014 EN -DRAFT

The moving head picks the components up from the waiting SWS and places them on the waiting

printed circuit board. This proven SIPLACE principle has many advantages:

– No downtime due to refilling or splicing

– Safe pick up of even the smallest components

– No shifting of the components on the circuit board

– Minimized travel range

High flexibility, economic efficiency and reliable setups are the guarantee for the high level of pro-

ductivity in the SIPLACE CA placement systems. Minimum down times increase utilization and

thus help to increase productivity. Even small 03015 components can be processed with the SI-

PLACE CA-Series.

1.2.1 Description of the SIPLACE Wafer System (SWS)

1.2.1.1 Description and Function

Up to four SIPLACE Wafer Systems (SWS) can be used at the SIPLACE CA placement machines.

The SWS provides the placement head with components directly from the wafer. The SWS there-

fore extends the component spectrum of the established SIPLACE X machines, by enabling

placement of bare dies from wafers.

The wafer is fed in fully automatically, by the wafer magazine and the components can then be

processed using the customary placement procedure.

Flip chip process - function

The wafers are transported fully automatically from the wafer magazine to the wafer table. This

then positions the die concerned over the ejection system, which releases the die from the wafer

foil. After this release procedure, the flip unit nozzle takes the die, rotates it by 180° and makes it

available to the placement head for pickup.

The process spectrum is supplemented by the following options:

– Die attach unit:

The die attach unit takes the die from the flip unit nozzle and turns it, so that it has the same

top-bottom orientation on the board as it had on the wafer.

– Linear Dipping Unit

The Linear Dipping Unit distributes precise layers of flux for the flip chip process. After taking

over from the flip unit the placement head dips the die in to the flux layer.