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4 SIPLACE Wafer System (SWS) User Manual SIPLACE CA- Series 4.3 Description of the SWS Modules From software version SC.708.0 Edition 12/2014 226 4 4.3.7 W afer Changer System The wafer changer syste m consists of the ma…

User Manual SIPLACE CA-Series 4 SIPLACE Wafer System (SWS)

From software version SC.708.0 Edition 12/2014 4.3 Description of the SWS Modules

225

4.3.6 Ejector Tool

Fig. 4.3 - 9 Ejector tool

(1) Vacuum cap

(2) Ejection needle

The die ejector is used to release the die from the wafer foil. It consists of a base unit and the ejec-

tor tool.

The ejector tool is fitted to the base unit and consists of the interface, the needle system and a

vacuum cap.

The wafer foil is picked up by vacuum suction at the vacuum cap, the needle system moves up

and releases the die from the wafer foil. The die can now be taken up by the nozzle of the flip unit.

The ejector tool needs to be adjusted to the size of the die and can therefore be exchanged to suit

requirements. It is fixed to the base unit by a bayonet connection..

The ejector tool can be equipped with 2 different needle types:

– Non-piercing needles

These cause the wafer foil to curve upwards and so release the die. The wafer foil is not

pierced in this case, so that the components are not touched by the needles.

– Piercing needles

These pierce the foil and lift the die directly off the foil.

4 SIPLACE Wafer System (SWS) User Manual SIPLACE CA-Series

4.3 Description of the SWS Modules From software version SC.708.0 Edition 12/2014

226

4.3.7 Wafer Changer System

The wafer changer system consists of the magazine lift and the wafer changer with gripper.

The wafer changer system is needed to ensure a fully automatic production with the SWS. The

operator is only needed for refilling the magazine lift with new wafer cassettes.

The wafers are provided in a wafer magazine. The wafer magazine is placed by the user into the

wafer magazine lift. The magazine lift lifts the wafer magazine into the appropriate height so that

the corresponding wafer is in handover position. In this position the wafer changer can take the

wafer out of the magazine and push it back in after the wafer has been processed.

The wafer changer consists primarily of the gripper unit and the guidance rails. The gripper unit

takes up the wafer and moves it to the position currently required.

PLEASE NOTE

No automatic ejector tool changeover

In this first version there is no automatic ejection tool changer available.

The SWS can therefore only continuously process dies which can be released using the

same ejector tool.

User Manual SIPLACE CA-Series 4 SIPLACE Wafer System (SWS)

From software version SC.708.0 Edition 12/2014 4.3 Description of the SWS Modules

227

Fig. 4.3 - 10 Wafer changer system

(1) Wafer changer with gripper

(2) Magazine lift