00197498-03_UM_SiplaceCA-Serie_EN - 第231页

User Manual SIPLACE CA-Series 4 SIPLACE Wafer System (SWS) From software version SC.708.0 Edition 12/20 14 4.4 Optional Components 231 4.4 Optional Component s 4.4.1 Linear Dipping Unit (LDU) 4 Fig. 4.4 - 1 Linear Dippin…

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4 SIPLACE Wafer System (SWS) User Manual SIPLACE CA-Series
4.3 Description of the SWS Modules From software version SC.708.0 Edition 12/2014
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Fig. 4.3 - 13 Main gripper modules (location 1,3)
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(1) Gripper (2) Toothed belt axis
(3) Insertion location for barcode scanner
(optional)
(4) AD-MOT board
(5) Motor with coupling
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User Manual SIPLACE CA-Series 4 SIPLACE Wafer System (SWS)
From software version SC.708.0 Edition 12/2014 4.4 Optional Components
231
4.4 Optional Components
4.4.1 Linear Dipping Unit (LDU)
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Fig. 4.4 - 1 Linear Dipping Unit (LDU)
The Linear Dipping Unit (LDU) is often needed, to apply flux to the die during the flip chip process.
This is required to ensure a reliable reflow process.
The LDU is able to apply highly accurate layers of flux. This flux is made available in a so-called
cavity. The depth of the cavity determines the thickness of the flux layer.
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PLEASE NOTE
The LDU must be provided for all types of suitable flip chip fluxes.
Only use epoxide and solder pastes after internal factory tests have been performed.
PLEASE NOTE
Do not use the LDU together with the die attach unit.
4 SIPLACE Wafer System (SWS) User Manual SIPLACE CA-Series
4.4 Optional Components From software version SC.708.0 Edition 12/2014
232
4.4.2 Die Attach Unit
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Fig. 4.4 - 2 Die Attach Unit
(1) Motor for rotating the die attach unit
(2) Driver
(3) Motor transfer X axis
(4) Solenoid valve
The die attach unit is needed for die attach mode.
The flip unit transfers the die to the die attach unit. The die is then rotated accordingly there and
made available for pickup. The die is therefore made available to the placement head in the same
top/bottom orientation as it was on the wafer and is placed in this position.
In die attach mode, only one of the nozzles for the flip unit functions. The flip unit takes up the next
die, while the current die is being picked up by the placement head from the die attach unit.
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PLEASE NOTE
Do not use the die attach unit together with the LDU.
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