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User Manual SIPLACE CA-Series 4 SIPLACE Wafer System (SWS) From software version SC.708.0 Edition 12/20 14 4.5 SIPLACE SWS Wafer Stretcher 237 4.5.2 T echnical Dat a 4 4 4.5.3 Placement Accuracy and Performance V alues S…
4 SIPLACE Wafer System (SWS) User Manual SIPLACE CA-Series
4.5 SIPLACE SWS Wafer Stretcher From software version SC.708.0 Edition 12/2014
236
4.5.1 Safety Instructions
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Fig. 4.5 - 2 Wafer support with SIPLACE SWS Wafer Stretcher
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CAUTION
Risk of burns due to high temperatures!
The heating can reach temperatures of up to 60°C.
Do not reach into the area around the fan with your hands.
Be careful when touching the wafer support.
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User Manual SIPLACE CA-Series 4 SIPLACE Wafer System (SWS)
From software version SC.708.0 Edition 12/2014 4.5 SIPLACE SWS Wafer Stretcher
237
4.5.2 Technical Data
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4.5.3 Placement Accuracy and Performance Values
See also the specifications for SIPLACE CA-Series, SC 708.0, edition 12/2014
SIPLACE SWS Wafer Stretcher
Value
Wafer frame 8" or 12"
Wafer width for 8" wafer frame 10.5 " and 10.8"
Weight of stretcher with wafer support 8 " 14 kg
Weight of stretcher with wafer support 12 " 15 kg
Wafer frame (metal and plastic) Up to 3.5 mm thick
Minimum operating pressure 4.0 bar
Maximum operating pressure 5.5 bar
Travel time whole stroke Approx. 2 seconds
Lowering time Approx. 2 seconds
Stretching factor (adjustable)
*1
*)1The specified stretching factors relate to a wafer frame with a thickness of 1.5 mm. The following applies to
other wafer frame thicknesses:
Stretching factor = set stretch height + frame thickness -1.5 mm
2 mm, 4 mm, 6 mm, 8 mm
Clamping speed wafer centering 0.5 to 1.0 seconds
PLEASE NOTE
Definition
Extensive tests with various materials are conducted during the product development
phase.
However, due to the multitude of wafer foils available, the many die sizes and wafer
frames, we are unable to make a general function promise for all imaginable materials.
New materials should therefore be tested in advance, if there is any doubt
4 SIPLACE Wafer System (SWS) User Manual SIPLACE CA-Series
4.5 SIPLACE SWS Wafer Stretcher From software version SC.708.0 Edition 12/2014
238
4.5.4 Description
While picking dies from a wafer, there is a danger that the die could begin to tilt. This can be
caused by an irregular adhesion of the die on the foil or an eccentric positioning of the needle. In
the case of dies which are positioned closely to one another, the neighboring die could be touched
and mutual damage can not be ruled out.
To prevent this, the wafer foil is stretched before the die is picked.This increases the distances
between the dies on the foil and makes it possible to pick dies without risks. The larger distances
between the dies also makes it easier for the Vision system to recognize them.
After the downholder plate has moved up and the clamp has been opened, the wafer foil sags. A
wafer with a sagging foil can not be moved back into the magazine.
Once the clamp and the downholder plate have been opened, the stretched wafer foil is warmed
up by the heater module. This shrinks the wafer foil (sag less than 9 mm) so that it can be moved
back into the magazine.
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Fig. 4.5 - 3 SIPLACE SWS Wafer Stretcher with stretched wafer foil
(1) Stretched wafer foil in the SIPLACE SWS Wafer Stretcher
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