00197498-03_UM_SiplaceCA-Serie_EN - 第382页

6 Working with the Machine User Manual SIPLACE CA-Series 6.10 Changing the Setup From software version SC.708.0 Edition 12/2014 EN -DR AFT 382 6.10 Changing the Setup 6.10.1 Changing the Setup on the Placement Machine 6.…

User Manual SIPLACE CA-Series 6 Working with the Machine

From software version SC.708.0 Edition 12/2014 EN -DRAFT 6.9 LCD and Status Displays on the X Feeder Module

381

Foil Jam

(Foil jam)

Red Foil motor has locked up Leveling gears blocked by foil? => Remove

the foil

EEP-WriteErr

(Error while back-

ing up data in the

EEPROM)

Red The data back-up in the EE-

PROM was not carried out

correctly

Remove the component tape (tape can be

moved out by pressing the arrow keys or

pulled out after raising the pick-up window).

Press the SET button to confirm the error.

Then press the yellow button to confirm the

reference run prompt.

EEP-ReadErr

(Error while read-

ing the

EEPROMS)

Red Data was not read from the

EEPROM correctly

EEP-DataErr

(Error while back-

ing up the data in

the EEPROM)

Red The data back-up in the EE-

PROM was not carried out

fully

Reference o

Red Position information is no

longer available for the com-

ponent tape drive

Remove the component tape (tape can be

moved out by pressing the arrow keys or

pulled out after raising the pick-up window).

Then press the "FOIL" button to start the

reference run.

CAN BusError

(CAN bus error)

Red CAN bus error Log off and on again, check the optical fiber

interface

ParNotSaved! Red Parameters were not saved Default parameters are loaded automatical-

ly, i.e. the most recent operator settings are

overwritten -> The settings (e.g. increment)

will have to be made again. Replace the

control board if this error occurs frequently.

ParWrongSave Red Wrong or incomplete param-

eters were saved

BootFlashErr

FlashDataErr

Red Can no longer write to boot

or application memory cor-

rectly

Replace the feeder module or control board

PLEASE NOTE

 Remove the component tape before a reference run.

Text on the

LCD display

Status

display

Meaning Solution

6 Working with the Machine User Manual SIPLACE CA-Series

6.10 Changing the Setup From software version SC.708.0 Edition 12/2014 EN -DRAFT

382

6.10 Changing the Setup

6.10.1 Changing the Setup on the Placement Machine

6.10.1.1 Printing Out Conversion Instructions Before Changing the Setup

Before a change of setup, print out the conversion instructions on the printer for the SIPLACE Pro

computer as described in the "SIPLACE Pro" manual or in the online help.

6.10.1.2 Important Points When Changing the Feeder Modules

 Handle the feeder modules carefully when you insert them into or remove them from the

changeover table. Make sure that the X feeder modules do not bump against the centering

bar (see item 5 in fig. 6.7 - 3

, page 373) of the changeover table.

 Vacuum the supporting surfaces of the feeder modules and clean the surface of the compo-

nent feeder table when necessary according to the instructions in the Preventive Mainte-

nance Manual.

 Remove loose components using a brush or a vacuum cleaner with a suitable nozzle.

CAUTION

Risk of injuries!

Fine metal splinters from components could injure hands.

 Avoid removing components from the changeover table with your fingers.

User Manual SIPLACE CA-Series 6 Working with the Machine

From software version SC.708.0 Edition 12/2014 EN -DRAFT 6.10 Changing the Setup

383

6.10.2 Changing the Setup on the SWS

 Check whether the orientation of the wafer locking bar matches the relevant wafer size (see

fig. 4.3 - 5

page 221).

 Adjust the support plate for the wafer magazine and insert the new magazine. check that the

magazine is occupied correctly.

 Check the needle configuration of the ejector system (see section 6.4.5, page 358).

 Check whether the flip unit has been fitted with the required tools and nozzles (see section

6.4.6, page 362).

 Load or compile the required product (see software guide).

PLEASE NOTE

Configuring the SWS

When putting the SWS into operation, it is configured with the required wafer size and

thickness of the wafer frame.

Adapting the SWS to other sizes and thicknesses is described in the service manual.