Specification SIPLACE X-Series S 规格说明书 - 第39页

39 SIPLACE Vision PCB position recognition Fiducial criteria Fiducial criteria Locate 2 fiducials Locate 3 fiducials X-/Y -position, rot ation angle, mean PCB distortion Additional: sh earing, distor tion separately in X…

SIPLACE Vision

OnBoard Inspection and Pattern Matching

OnBoard Inspection

The OnBoard PCB Inspec-

tion (SW option) uses the

PCB camera to inspect criti-

cal areas of the board, spec-

ified by the user, e.g. under

BGA or shields just before or

after placement, to make

sure that all components

were placed or to make sure

that there are no objects in

the way of the placement

process.

It is also possible to inspect

the solder paste to make

sure that it is present. How-

ever, this must always be

performed at the first place-

ment machine, before any

placement begins.

A requirement for all inspec-

tion tasks is that a "good pat-

tern" has been saved before

starting.

Pattern Matching

Pattern matching can be

used for components with

very fine contact pads, which

can not be detected with the

existing component camera

resolution. Searching and

detection is performed over a

larger area, which contains

unique structures (patterns).

Once the specified area has

been detected, the compo-

nent is aligned and placed

according to the position of

this area and in relation to the

substrate.

SIPLACE Vision

PCB position recognition

Fiducial criteria

Locate 2 fiducials

Locate 3 fiducials

X-/Y-position, rotation angle, mean PCB distortion

Additional: shearing, distortion separately in X and Y direc-

tion

Fiducial shapes Synthetic fiducials: circle, cross, square, rectangle, dia-

mond, circular, square and rectangular contours, double

cross, pattern: any

Dimensions of patterns

Min. size

Max. size

0.5 mm

3 mm

Fiducial environment Clearance around reference fiducial not necessary if there

is no similar fiducial structure in the search area

Dimensions of synthetic fiducials

Min. X/Y size for circle and rectangle 0.25 mm

Min. X/Y size for annulus and rectangle 0.3 mm

Min. X/Y size for cross 0.3 mm

Min. X/Y size for double cross 0.5 mm

Min. X/Y size for diamond 0.35 mm

Min. frame width for annulus and rectangle 0.1 mm

Min. bar width / bar distance for cross, double-cross 0.1 mm

Max. X/Y size for all fiducial shapes 3 mm

Max. bar width for cross/double-cross 1.5 mm

Minimum tolerances generally 2% of nominal dimension

Max. tolerances generally 20% of nominal dimension

SIPLACE Vision

PCB position recognition

Technical Data and Inkspot Criteria

Ink spot criteria

Methods • Synthetic fiducial recognition method

• Mean gray scale value

• Histogram method

• Pattern recognition

Shapes and sizes of fiducials/structures for

Synthetic fiducials

Other methods

For dimensions of synthetic fiducials,

see page 39

Min. 0.3 mm

Max. 5 mm

Masking material Good coverage

Recognition time Depends on the method: 20 ms - 200ms

Description

In the cluster technology

each subpanel is assigned

an inkspot.

If this is present during the

measurement via the PCB

vision module, the corre-

sponding subpanel will not

be populated.

This function helps prevent

costs caused by unneces-

sary placement of defective

panels.

Technical data for PCB position detection

PCB fiducials

Local fiducials

Library of bad panel recognition

Up to 3 (subpanels and multiple panels)

Up to 6 for the long board option (optional PCB fiducials

are output by the optimization.)

Up to 2 per PCB (may be of different type)

Up to 255 fiducial types per subpanel

Image analysis Edge detection method (singular feature) based on gray

scale values

Illumination type Front lighting

Fiducial recognition time 0.1 s

Field of vision 5.78 mm x 5.78 mm