Specification SIPLACE X-Series S 规格说明书 - 第44页

44 Virtual Inkspot Handler (VIH) The virtual inks pot handle r (VIH) allows you to scan in inkspots from an external system. This option can be use d for external systems to define which panels are to be produced and whi…

OSC package

The licensed OSC package

contains functions for simpli-

fied placement of odd

shaped components (OSC),

such as connectors or sock-

ets.

The license is activated via

SIPLACE PRO.

For detailed information,

refer to the OSC package

user guide, item number

[00198374-xx].

The following functions are

contained in the OSC pack-

age:

OSC measurement options

• Customized odd shaped

component

This enables the user to

describe any abstract pat-

tern on a component e.g.

connection leads of a tri-

angular shape. This pat-

tern can then be easily

created and edited at the

station, using the wizard

function.

• Stereo measurement

Stereo measurement

means that two images

are taken of each compo-

nent, from different direc-

tions, using a stationary

camera. These images

are overlapped to show

connectors, pins etc. in 3D

to support easy and pre-

cise evaluation of struc-

tures which, due to color,

shading or background

structures, are difficult to

recognize in conventional

2D measurement.

• Special position evalua-

tion

This function supports

separate definition of posi-

tion-determining features

(x,y, angle) independent

of the features for good-

bad recognition.

Placement of snap-in com-

ponents

This function monitors

whether snap-in components

engage in the board prop-

erly, during automatic place-

ment.

Pin in paste height check

This option extends the

"snap-in" function for CPP

and Twin heads.

Automatic calculation of

optimum acceleration

This function enables the

user to automatically calcu-

late the optimum accelera-

tion of individual axes for a

component at the station.

The acceleration values

found can then be checked in

an additional test run and

sent back to the program-

ming system if successful.

Placement of very high

components

In special application cases

the software can place a very

high component with auto-

matic collision prevention.

Additional force levels for

TH and CPP head

•30 N for TH

• 15 N for CPP

15.5 mm high components with CPP restrictions

• The maximum height of 15.5 mm can only be reached if the

PCB warpage upwards is 0 mm (setting in SIPLACE Pro).

• NO SIPLACE TwinStar permitted anywhere in the line.

• If there are two SIPLACE MultiStars (CPP) in the same

placement area, only one CPP can place components up to

15.5 mm.

Virtual Inkspot Handler (VIH)

The virtual inkspot handler

(VIH) allows you to scan in

inkspots from an external

system.

This option can be used for

external systems to define

which panels are to be

produced and which to be

omitted. A panel is a specific

part of a printed circuit

board. This concept is much

more flexible than the

physical inkspot concept.

It can be integrated into the

ongoing production process,

if external systems

individually decide whether

each panel it is in a good or

bad state and whether

additional processing steps

are to be omitted or not.

The boards are typically

measured by the external

system and the information

about which panels are good

or bad is then available.

The use of this information

via VIH offers the benefit that

no physical inkspots need to

be read by the PCB camera.

This improves performance,

particularly for boards with a

large number of panels.

This option can also be used

if the panels do not have

room for a physical inkspot.

Workflow VIH with XML file

Workflow VIH with MES and BoardGateKeeper (BGK)

Process Data Interfaces (PDI)

The process data interface (PDI), which can be addressed via

the OIB interface, enables you to access not only the trace-

ability data of the components placed but also various process

parameters for the component placement. The PDI makes

over 40 process attributes per placement position available,

such as:

• Pickup (actual pick position, pickup location ID)

• Dipping (result, timestamp)

• Vision measuring (result plus camera ID)

• Placement (actual place position, ref. desig., vacuum val-

ues)

The data packages contain the data for each board and stop-

per position.

Each individual data package contains a maximum of 200

placement positions.

ASM Software Products

Overview

Workflows ASM Software Product Standard Option

Planning

ASM Production Planner

Fully automatic product grouping and optimization by taking deliv-

ery deadlines into account

SIPLACE SiCluster Professional / SiCluster Multiline

Fully automatic product grouping

Virtual production

SIPLACE Pro

One application for all programming tasks

SIPLACE LED Pairing

Simple placement of LEDs with multiple classes

Process optimization

ASM DFM HealthCheck

Automatic determination of optimum print parameters

ASM ProcessExpert

The first self-learning inline expert system for electronics produc-

tion worldwide

Production

SIPLACE Station Software

Diverse operating system

ASM OIS

Operator Information System

ASM Command Center

Automatic operator management for all machine assistants

ASM Performance Monitor

Live KPI monitoring

Material Management

ASM Material Manager

Control and optimization of SMD material management

ASM Line Monitor

Overview of material consumption in the lines.

Preparation

ASM Setup Center

Avoid setup errors with reliable setup verification

SIPLACE Material Setup Assistant

Optimization of offline setup preparation and of material flow

Factory monitoring

ASM EDM

Convenient data management for placement programs

ASM Traceability

Traceability of the placement processes

SIPLACE Explorer

Line monitoring system

Factory Integration

ASM OIB

Seamless integration of SIPLACE software solutions with third

party systems

ASM Remote Smart Factory

Professional remote service infrastructure