Specification SIPLACE X-Series S 规格说明书 - 第5页
5 Overview of technical data Maximum values Placement pe rformance Benchmark value 172,000 comp./h Component rang e 0201 (me tric) - 2 00 mm x 110 mm Placement ac curacy ± 22 µm, (3 σ ) Feeding capacity (component tro ll…
4
SIPLACE X-Serie
Content
OSC package 43
Virtual Inkspot Handler (VIH) 44
ASM Software Products 45
Overview 45
Technical data 46
Electrical ratings and energy consumption 46
Compressed air supply 47
Electrical connection and compressed air 48
Dimensions and setup conditions 49
Placement machine dimensions 50
Placement machine center of gravity 50
Maneuvering distances for the X component trolleys 51
Maneuvering distances for MTC 52
Maneuvering distances for WPC 53
Spacing distances for single conveyor 54
Spacing distances for the flexible dual conveyor 55
Spacing distances with MTC 56
Spacing distances with WPC 57
Clearance dimensions with JTF-M 58
Clearance Values with Input/Output Conveyor Extension 59
Transportation and delivery configuration 60
List of options 61
Overview of languages 63
ESD certificate 64
Notes 65
5
Overview of technical data
Maximum values
Placement performance
Benchmark value 172,000 comp./h
Component range 0201 (metric) - 200 mm x 110 mm
Placement accuracy ± 22 µm, (3
σ)
Feeding capacity (component trolley X) 160 feeder modules 8 mm X
Board format (length x width) 850 mm
a
x 685 mm
b
a) With license for "Long Board Option" and input/output conveyor extension.
b) Board width up to 560 mm as standard. Board widths up to 685 mm available on request.
Camera 6 illumination levels
Machine protection: Telegray
(RAL 7047)
Machine colors
Covers: Telegray
(RAL 7047)
Covers: Pearl dark gray
(RAL 9023 )
Handles: Ruby red
(RAL 3003)
6
SIPLACE X-Series S
Machine description
Intelligent placement solu-
tions for maximum stan-
dards
Maximum flexibility, top per-
formance or placement qual-
ity: The SIPLACE X-Series S
has state-of-the-art technol-
ogy to master any challenge
arising in SMT production. It
offers all the innovations and
features to ensure efficient
electronics production today
and in the future, and pro-
vides previously unavailable
ways to increase both effi-
ciency and productivity.
Maximum modularity for
every need
The compact design of the
SIPLACE X-Series S forms
the ideal basis for new,
future-oriented production
concepts which keep pace
with dynamically developing
customer requirements, with-
out the need for time-con-
suming conversion as in
traditional SMT production
lines.
The X-Series S placement
machines are available in
four different variants
• SIPLACE X2 S (520210)
• SIPLACE X3 S (520310)
• SIPLACE X4 S (520480)
• SIPLACE X4i S (520440)
The numbers in the type
name indicate the number of
gantries used. Each gantry
has one placement head.
The SIPLACE X-Series S
covers the entire range of
common components with
only three placement heads.
The ideal addition to the
proven SIPLACE TwinStar
and the high speed
SIPLACE SpeedStar is the
new SIPLACE Multistar
placement head.
The user benefits from differ-
ent PCB conveyor variants:
The single conveyor and
the flexible dual conveyor.