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3 Technical data and assemblie s User manual SIPLACE TX-Series 3.5 Placement head From software version 713.0 Edition 01/2020 138 3.5.5 SIPLACE T winSt ar for high precision IC placement 3 Fig. 3.5 - 10 SIPLACE T winStar…
User manual SIPLACE TX-Series 3 Technical data and assemblies
From software version 713.0 Edition 01/2020 3.5 Placement head
137
3.5.4.10 Technical Data for SIPLACE MultiStar (CPP M) on SIPLACE TX Micron
SIPLACE MultiStar (CPP M)
With component camera type 45
Component range
*a
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-specific
standards, the component packaging tolerances and the component tolerances.
01005 to 15 mm x 15 mm
Component spec.
Max height
*b
Max. height
*c
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
*)b CPP M head: in low installation position
*)c CPP M head: in high installation position
*d
6.0 mm
8.5 mm
250 µm / 120 µm
50 µm
140 µm
70 µm
0.11 mm x 0.11 mm
15 mm x 15 mm
4 g
*)d Only possible for components which are within the camera focal area of ± 1.3 mm.
Set-down force 1.0 - 15 N
Nozzle types 20xx, 28xx
X/Y accuracy
*e
With "accuracy class"
*f
Without "accuracy class"
*)e The accuracy values fulfill the conditions in the ASM scope of supply and services.
*)f Setting in SIPLACE Pro Component Shape Editor.
± 20 µm/3σ
± 25 µm/3σ
Angular accuracy ± 0.38° / 3σ
Illumination level 5
3 Technical data and assemblies User manual SIPLACE TX-Series
3.5 Placement head From software version 713.0 Edition 01/2020
138
3.5.5 SIPLACE TwinStar for high precision IC placement
3
Fig. 3.5 - 10 SIPLACE TwinStar for high precision IC placement
3
(1) Pick&Place module 1 (P&P1) - the TwinStar consists of 2 Pick&Place modules
(2) Pick&Place module 2 (P&P2)
(3) DP axis
(4) Z axis drive
(5) Incremental distance measuring system for the Z axis
User manual SIPLACE TX-Series 3 Technical data and assemblies
From software version 713.0 Edition 01/2020 3.5 Placement head
139
3.5.5.1 Description
This sophisticated placement head consists of two placement heads of the same type coupled to-
gether. Both heads work using the Pick&Place principle. The TwinStar is suitable for processing
complex and large components. Two components are picked up by the placement head, optically
centered on the way to the placement position and rotated into the necessary placement angle.
They are then placed gently and accurately onto the PCB with a controlled blast of air.
New nozzles (type 5xx) have been developed for the TwinStar. With an adapter you can also use
the nozzles of type 4xx from the Pick&Place head and nozzles of type 8xx, 9xx and 2xx from the
Collect&Place heads.