SIPLACE D1 规格说明书英文版 - 第11页

11 Placement Heads Standard Functions / Options 12 nozzle Collect & Place head 6 nozzle Co llect & Pla ce head S tandard- functions Camera, va cuum sensor , f orce measurement, PCB warpage, check, individual reco…

Head Modularity

Overview

The SIPLACE D1 is charac-

terized by maximum flexibil-

ity in the production process.

This flexibility is partly due to

the head modularity of the

placement machine as it

allows different placement

head variants to be config-

ured to suit the production

requirements. The gantry on

the SIPLACE D1 can be

equipped with one (as a

SIPLACE D1S) or two

(SIPLACE D1) placement

heads, as required. The fol-

lowing placement head con-

figurations are possible:

Operation with two place-

ment heads:

• C&P12 and P&P head

• C&P6 and P&P head

Operation with just one

placement head:

• C&P12 head

• C&P6 head

• P&P head

If the placement system was

delivered with just one place-

ment head, you can retrofit a

second placement head

using an upgrade kit.

Collect&Place principle

The SIPLACE 12 and 6-

nozzle Collect&Place heads

work on the Collect&Place

principle. This means that,

within each cycle, 12 or 6

components are picked up

and "collected" by the place-

ment head, are optically cen-

tered on the way to the board

and are rotated into the

required placement angle.

They are then placed gently

and accurately on the PCB.

This principle is particularly

suitable for the high-speed

placement of standard com-

ponents.

Pick&Place principle

The Pick&Place head on the

SIPLACE D1 first picks up

the component. On the way

to the placement position, it

centers it optically and

rotates is into the required

placement angle. This

method is particularly suit-

able for fast and accurate

placement of special compo-

nents in the fine-pitch and

super-fine pitch ranges.

Checking and self-learning

functions

The SIPLACE placement

heads' reliability can be fur-

ther increased with various

checking and self-learning

functions.

• Component sensor

It checks for the presence

of a component at the

nozzle before and after the

pick-up and placement

process.

• Digital camera on the

placement head

Checks the position of

each component at the

nozzle. Any deviations

from the required pick-up

position are corrected

before placement takes

place.

• Force sensor

Monitors the specified

component set-down

forces. With the sensor

stop method, differences

in height during pick-up

and any unevenness of

the PCB surface are com-

pensated during place-

ment.

• Vacuum sensor

Checks whether the com-

ponent was picked up or

set down correctly.

Collect&Place principle Pick&Place principle

Placement Heads

Standard Functions / Options

12 nozzle Collect &Place head 6 nozzle Collect&Place head

Standard-

functions

Camera, vacuum sensor, force

measurement, PCB warpage,

check, individual recording for

each component

Standard

functions

High-resolution camera,

vacuum sensor, force measure-

ment, PCB warpage, check,

individual recording for each

component

Options High-resolution camera, compo-

nent sensor, short nozzle, short

sleeve, nozzle changers, special

nozzles

Options Short nozzle, short sleeve,

nozzle changers, special

nozzles

Pick&Place head

Standard

functions

Fine-pitch camera, vacuum sen-

sor, force sensor, nozzle

changer, PCB warpage check,

individual recording for each

component

Options Flip-chip camera, special

nozzles, grippers, coplanarity

module

Placement Heads

Collect&Place Heads

12-nozzle

Collect&Place head

CO camera type 28

12-nozzle

Collect&Place head

CO camera type 29

12-nozzle

Collect&Place head

CO camera type 38

6-nozzle

Collect&Place

head

CO camera type 29

Component range

a) Please note that the range of components that can be placed is also affected by the pad geometry, customer-specific

standards, component packaging tolerances and component tolerances

0402 to PLCC44,

BGA, µBGA, flip-

chip, TSOP, QFP, SO

to SO32, DRAM

0201

to flip-chip, bare

die, PLCC44, BGA,

µBGA, TSOP, QFP,

SO to SO32, DRAM

b) With 0201 package

01005

to 16 x

16 mm²

c) With 01005 package

0201to 27 x

27 mm²

Component specification

max. height

min. lead pitch

min. lead width

min. ball pitch

min. ball diameter

min. dimensions

max. dimensions

max. weight

6 mm

0.5 mm

0.2 mm

0.35 mm

0.2 mm

1.0 x 0.5 mm²

18.7 x 18.7 mm²

2 g

6 mm

0.3 mm

0.15 mm

0.25 mm

0.14 mm

0.6 x 0.3 mm²

18.7 x 18.7 mm²

2 g

6 mm

0.25 mm

0.1 mm

0.25 mm

0.14 mm

0.4 x 0.2 mm²

16 x 16 mm²

2 g

8.5 mm

0.3 mm

0.15 mm

0.25 mm

0.35 mm

0.14 mm

0.2 mm

0.6 x 0.3 mm²

27 x 27 mm²

5 g

d) For components < 18 x 18 mm²

e) For components  18 x 18 mm²

Programmable set-down

force

2.4 N - 5.0 N 2.4 N - 5.0 N 2.4 N - 5.0 N 2.4 N - 5.0 N

Nozzle types 9xx 9xx 9xx 8xx, 9xx

X/Y accuracy

f) The accuracy value was measured using the vendor-neutral IPC standard

± 50 µm/3

± 67 µm/4

± 50 µm/3

± 67 µm/4

± 50 µm/3

± 67 µm/4

± 52.5 µm/3

± 70 µm/4

Angular accuracy ± 0.53°/3

± 0.71°/4

± 0.53°/3

± 0.71°/4

± 0.53°/3

± 0.71°/4

± 0.225°/3

± 0.3°/4

Component range 98% 98.5% 96% 99.8%

Component camera type 28 29 38 29

Illumination levels 5 5 5 5

Possible illumination level

settings

256