SIPLACE D1 规格说明书英文版 - 第27页

27 Component Feeding Waffle-Pack Changer Technical Data Dimensions, weight Electrical ratings Permitted envir onmental factors Dimensions (L x W) 1560 x 360 mm² Height 830 mm ± 15 mm PCB transp ort height 900 mm ± 15 mm …

Component Feeding

Waffle-Pack Changer

Description

If the placement process

requires components to be

supplied in several waffle-

pack trays, we recommend

an automatic magazine

change using a waffle-pack

changer (WPC). The WPC

set-up is precisely matched

to the placement sequence

in order to optimize the tim-

ings and distances traveled.

One bin with component

trays moves in the vertical

direction until the desired

magazine is within the range

of the feed axis.

The horizontal feed axis

transports the tray from the

tray supply to within the

range of the placement head.

The first magazine is made

available as soon as a PCB

moves onto the PCB con-

veyor, and valid panel and

set-up data is available. All

other magazine changes are

carried out time-neutrally

during the placement pro-

cess. Defective components

are returned to the original

tray.

The waffle-pack changer can

be docked into location 1 on

the D1 machine.

It does not take up the entire

width of a location. The com-

ponent table integrated into

the upgrade kit has a capac-

ity of 5 locations for feeder

modules.

Upgrade kit

WPC

Component Feeding

Waffle-Pack Changer

Technical Data

Dimensions, weight

Electrical ratings

Permitted environmental

factors

Dimensions (L x W) 1560 x 360 mm²

Height

830 mm ± 15 mm PCB transport height

900 mm ± 15 mm PCB transport height

930 mm ± 15 mm PCB transport height

950 mm ± 15 mm PCB transport height

1360 mm ± 15 mm

1430 mm ± 15 mm

1460 mm ± 15 mm

1480 mm ± 15 mm

Weight approx. 240 kg

Load per unit area 4.19 kN/m²

Dimensions of the waffle-pack tray (L x W x H) 360 x 260 x 6 mm³

Weight of the waffle-pack tray carrier 0.8 kg

Waffle-pack tray dimensions including components 341 x 235 x 15 mm³

max. 341 x 235 x 23 mm³

Weight of the waffle-pack tray carrier including waffle-pack trays

and components max. 1.2 kg

Storage capacity for waffle-pack tray carriers max. 28

Total weight of the 28 waffle-pack tray carriers 27.6 kg

Weight for magazine storage unit, waffle-pack tray carriers, waffle-

pack trays and components max. 50 kg

Changeover time for waffle-pack tray carrier

over 1 level

over 10 levels

over 27 levels

1.9 s

2.3 s

2.9 s

Supply voltage 3 x 208 VAC ± 5 %; 50/60 Hz (U.S.A. version)

3 x 230 VAC ± 5 %; 50/60 Hz

3 x 380 VAC ± 5 %; 50/60 Hz

3 x 400 VAC ± 5 %; 50/60 Hz (European version)

3 x 415 VAC ± 5 %; 50/60 Hz

Nominal apparent power 800 VA

Rated current 0.7A at 3 x 400 VAC

Fuses 3 x 10 or 3 x 16 A

Room temperature between 15 °C and 35 °C

Atmospheric humidity 30 - 90%

(No higher than 45% on average to prevent any

possibility of condensation on the machine)

Digital Vision System

The digital SIPLACE vision

system guarantees

extremely fast and reliable

component recognition,

while being very simple to

use. The system identifies

each individual component

from its shape and color.

Even complex component

shapes, such as flip-chip or

CCGA are detected

extremely reliably.

The system is not only used

in the placement head cam-

eras; it can also be found in

the PCB camera. As well as

ensuring that components

are detected accurately, it

also ensures reliable recog-

nition of the ink spots and

PCB fiducials.

The benefits at a glance:

• Extremely fast and reliable

component recognition

• Shortest cycle times

• Robust measurement with

reference to the shape

and color

• Straightforward program-

ming

• Offline programming of

component shapes

• Rapid introduction of new

products (NPI)

• Open architecture allows

you to quickly adapt to

new requirements

• Optimum placement

results through individual

measurement of each

component

Digital vision cameras

12 nozzle Collect&Place head camera for 01005

12 nozzle Collect&Place head camera (High Resolution)

12-nozzle Collect&Place head camera

6-nozzle Collect&Place head camera

P&P head standard camera

P&P head (TwinHead) camera

P&P head flip-chip camera

1 PCB camera

Examples of digital vision system analysis times

01005 9 ms

PLC44 17 ms

BGA 225 balls 18 ms