SIPLACE D1 规格说明书英文版 - 第9页

9 Modular Machine Concept Sample Configuration BZ Buffer zone C & P Collect & Place head CM Coplanarity module COT Component changeover table FCC Flip-chip camera, type 25 G1 Gantry 1 ICC IC camera, type 33 or 36…

Modular Machine Concept

Step 1: Placement system with 1 gantry

Step 2: Selection of the placement heads

12-segment C&P head

6-segment C&P head

Pick&Place head

Step 3: Selection of the conveyor

Single conveyor

Flexible dual conveyor

Step 4: Selection of the component

changeover table, WPC

Component changeover table

Waffle-pack changer WPC

Step 5: Selection of the feeder modules

S tape feeder modules

Modular Machine Concept

Sample Configuration

BZ Buffer zone

C&P Collect&Place head

CM Coplanarity module

COT Component changeover table

FCC Flip-chip camera, type 25

G1 Gantry 1

ICC IC camera, type 33 or 36

NCH C&P Nozzle changer for the C&P head

NCH P&P Nozzle changer for the Pick&Place

head

OP Operator panel

P&P Pick&Place head

PA Placement area

WPC Waffle-pack changer

COT

NCH P&P

NCH C&P FCC CM ICC P&P

COT/WPC

C&P

OP OP

Head Modularity

Overview

The SIPLACE D1 is charac-

terized by maximum flexibil-

ity in the production process.

This flexibility is partly due to

the head modularity of the

placement machine as it

allows different placement

head variants to be config-

ured to suit the production

requirements. The gantry on

the SIPLACE D1 can be

equipped with one (as a

SIPLACE D1S) or two

(SIPLACE D1) placement

heads, as required. The fol-

lowing placement head con-

figurations are possible:

Operation with two place-

ment heads:

• C&P12 and P&P head

• C&P6 and P&P head

Operation with just one

placement head:

• C&P12 head

• C&P6 head

• P&P head

If the placement system was

delivered with just one place-

ment head, you can retrofit a

second placement head

using an upgrade kit.

Collect&Place principle

The SIPLACE 12 and 6-

nozzle Collect&Place heads

work on the Collect&Place

principle. This means that,

within each cycle, 12 or 6

components are picked up

and "collected" by the place-

ment head, are optically cen-

tered on the way to the board

and are rotated into the

required placement angle.

They are then placed gently

and accurately on the PCB.

This principle is particularly

suitable for the high-speed

placement of standard com-

ponents.

Pick&Place principle

The Pick&Place head on the

SIPLACE D1 first picks up

the component. On the way

to the placement position, it

centers it optically and

rotates is into the required

placement angle. This

method is particularly suit-

able for fast and accurate

placement of special compo-

nents in the fine-pitch and

super-fine pitch ranges.

Checking and self-learning

functions

The SIPLACE placement

heads' reliability can be fur-

ther increased with various

checking and self-learning

functions.

• Component sensor

It checks for the presence

of a component at the

nozzle before and after the

pick-up and placement

process.

• Digital camera on the

placement head

Checks the position of

each component at the

nozzle. Any deviations

from the required pick-up

position are corrected

before placement takes

place.

• Force sensor

Monitors the specified

component set-down

forces. With the sensor

stop method, differences

in height during pick-up

and any unevenness of

the PCB surface are com-

pensated during place-

ment.

• Vacuum sensor

Checks whether the com-

ponent was picked up or

set down correctly.

Collect&Place principle Pick&Place principle