Nexus_EN_CN - 第3页
3 Oxide and void-free joint surface between chip and interconnected device Integrated or separate cleaning and de-scaling processes Simple proling and fast heating and cooling rates Assembly under high level of vacuum I…
Void-free soldering with vacuum
Ideal for a great variety of applications
The Nexus guarantees high-quality results with a reow process using contact heat in
a vacuum. It thus meets the highest requirements of power electronics, in the advanced
packaging and semiconductor area.
The Nexus contact soldering system is best suited for void-free soldering of different
devices (e.g. IGBT) on DCB substrates. The combining of materials that are normally highly
dissimilar takes place in the vacuum at a reduced pressure at temperatures up to 400 °C.
The reduced pressure thereby helps to minimise oxidation on the components and on the
solder itself. The transfer of heat is via heat contact surfaces or optional by radiation. The
Nexus system is predominantly used in small and medium production lines as well as in the
eld of laboratory.
Nexus设备采用接触式加热和真空处理技术，确保实现最佳焊接效果，由此满足电力电子行业在先进封装
和半导体技术领域的最高要求。
Nexux接触式焊接系统尤其适合于DCB基板上不同设备（例如IGBT）的无空洞焊接。高度相异的材料在真
空低压以及高达400 °C的温度下相结合。此外，真空环境还有助于最大程度防止元器件和焊料氧化。热传
导通过隔热垫和热辐射完成。Nexus系列主要用于中小型生产线以及实验室领域。
Contact
Soldering
Reliable and flexible
无空洞真空焊接工艺
适用于多种行业应用
3
Oxide and void-free joint surface between chip and interconnected device
Integrated or separate cleaning and de-scaling processes
Simple proling and fast heating and cooling rates
Assembly under high level of vacuum
Integration of drying and degassing processes
Optimum dispersal of waste heat
Reliable contact soldering
The Nexus makes it possible!
The Rehm Thermal Systems vacuum soldering oven is ex-
ceptionally well suited for production facilities which pursue
flux-free and void-free soldering in various inert gases (N
2
,
H
2
, N
2
/H
2
95/5).
The use of lead-free and lead-containing pastes and pre-
forms with/without flux is also possible. Miniaturization in
the elds of advanced packaging and semiconductors can
be further developed by means of vacuum technology.
可靠的接触焊 Nexus以行践言
锐德热力系统真空炉十分适合于在各种惰性气体（N2、H2、N2 / H2
95/5）中追求无需助焊剂和无空洞焊接的生产设备。
锡膏与焊料片有铅/无铅均可，也可采用无肋焊剂方式。真空有助于
推动先进封装与半导体技术的微型化发展。
芯片与元件之间的焊点无空洞无氧化
集成或独立式清洗和除垢
轻松设置温度曲线，快速加热和冷却
制程环境高度真空
集成干燥和排气制程
优化散热，满足功率器件需求
4
› Heating and cooling on a usable area of
500 mm x 500 mm
› Clearance of 100 mm above heating plate
› Max. operating temperature 400 °C
*
› Heating rate max. 150 K/min
*
,
cooling rate max. 180 K/min
*
› Vacuum up to 1mbar (optional 0,1 mbar)
› Fluxless activation with different gases possible
› One gas line for N
2
with pressure regulator and gas
monitoring; proportional valve
› Each gas supply line is equipped with a switch to save
purging gas while the machine is not in use
› The vacuum system can be equipped with adjustable
ow ratios. The volumetric ow rate for process gases is
adjustable and controlled by a proportional valve.
› Fluxless operation with 100 % nitrogen, forming gas,
formic acid or up to 100 % hydrogen
› Formic acid bubbler with fill level compensation to keep
the saturation always at the same level (saturation level
of N
2
depends on the fill level of the bubbler)
› Optional Residue Management System for use with
solder paste
›
组合式加热/冷却板，可用面积500 mm x 500 mm
›
加热板上方间距100mm
›
加热板工作温度可高达400°C
›
加热速率约150 K/min，最高冷却速率180 K/min
›
真空可达1mbar（可选0.1mbar）
›
可在多种制程气体下实现无助焊剂焊接
›
配备带压力调节器和气体监测功能的N2气体管线；进气口通过
质量-流量控制器进行控制
›
每条供气管线均配备开关，设备停用时可节省制程气体
›
真空速率可调；制程气体的体积流速可通过质量-流量控制器进
行调节和控制
›
可在混合气体、甲酸或高达100%氢气环境下进行无助焊剂焊接
›
带液位补偿功能的甲酸器，确保饱和度稳定（如果液位不受控/
不平衡，N2饱和度将发生波动）
›
针对使用焊膏的应用，提供残渣管理系统选项
Benets for exible processes
Nexus at a glance
Nexus系统概览
*
related to contact plate