Nexus_EN_CN - 第5页

5 Operating principles | 运行原理 Heating and cooling Satilinatil | 加热和冷却 A major benet of the Nexus contact soldering system is that the heating or cooling gradient can be pr edened based on pre - determined parameters. T…

› Heating and cooling on a usable area of

500 mm x 500 mm

› Clearance of 100 mm above heating plate

› Max. operating temperature 400 °C

› Heating rate max. 150 K/min

cooling rate max. 180 K/min

› Vacuum up to 1mbar (optional 0,1 mbar)

› Fluxless activation with different gases possible

› One gas line for N

with pressure regulator and gas

monitoring; proportional valve

› Each gas supply line is equipped with a switch to save

purging gas while the machine is not in use

› The vacuum system can be equipped with adjustable

ow ratios. The volumetric ow rate for process gases is

adjustable and controlled by a proportional valve.

› Fluxless operation with 100 % nitrogen, forming gas,

formic acid or up to 100 % hydrogen

› Formic acid bubbler with fill level compensation to keep

the saturation always at the same level (saturation level

of N

depends on the fill level of the bubbler)

› Optional Residue Management System for use with

solder paste

›

组合式加热/冷却板，可用面积500 mm x 500 mm

›

加热板上方间距100mm

›

加热板工作温度可高达400°C

›

加热速率约150 K/min，最高冷却速率180 K/min

›

真空可达1mbar（可选0.1mbar）

›

可在多种制程气体下实现无助焊剂焊接

›

配备带压力调节器和气体监测功能的N2气体管线；进气口通过

质量-流量控制器进行控制

›

每条供气管线均配备开关，设备停用时可节省制程气体

›

真空速率可调；制程气体的体积流速可通过质量-流量控制器进

行调节和控制

›

可在混合气体、甲酸或高达100%氢气环境下进行无助焊剂焊接

›

带液位补偿功能的甲酸器，确保饱和度稳定（如果液位不受控/

不平衡，N2饱和度将发生波动）

›

针对使用焊膏的应用，提供残渣管理系统选项

Benets for exible processes

Nexus at a glance

Nexus系统概览

related to contact plate

Operating principles

运行原理

Heating and cooling Satilinatil

| 加热和冷却

A major benet of the Nexus contact soldering system is that the heating or cooling gradient can be predened based on pre-

determined parameters. The gradients can be preset as required. Within these specication limits, the temperature is adjusted

automatically by the Nexus so that these limit values are not exceeded. This eliminates the possibility of a malfunction of the

assembly to be soldered.

Nexus接触焊接系统的主要优点是可以根据预定参数预定义加热或冷却梯度。可以根据需要预先设置渐变。在这些规格限制内，Nexus会自动

调整温度，以免超出这些限制值。这消除了待焊接组件发生故障的可能性。

The heating output of the Nexus has been designed for a uniform heating process when fully loaded with high-mass assemblies

meaning that short cycle times are also no problem. Sensor components determine and verify the temperatures recorded on the

goods carrier support.

Nexus的加热输出设计为在满载高质量组件的情况下实现均匀的加热过程，这意味着较短的循环时间也不成问题。传感器组件确定并验证在货

物支架上记录的温度。

100

150

200

250

300

2200 2300 2400 2500 2600 2700 2800

Temperature in °C

Time in s

Set value

Controller 1

Controller 2

Controller 3

The vacuum soldering process generates temperatures of

up to 400 °C and is an ideal solution for void-free and flux-free

applications. The Nexus not only provides your manufactu-

ring operation with advantages for the soldering process, but

rather for bonding processes as well.

真空焊接制程可提供最高

400°C

的焊接温度，是无空洞和无助焊剂焊

接应用的最理想解决方案。无论是焊接制程还是粘合制程，

Nexus

设

备都能够为您的生产应用提供无与伦比的多种优势。

heating plate

加热板

PCB

电路板

cooling

冷却

hermetically sealed process chamber

密封炉膛

direct

heat transfer

Example vacuum heating process

真空加热过程示例

Reliable vacuum processes

for improved quality

可靠真空制程，提升焊接质量

Increased productivity and quality advantages can be achieved

in the production of power electronics by means of vacuum

soldering. Vacuum provides for oxide-free processes as well

as improved wetting, and thus for more effectively lled solder

joints. Beyond this, vacuum drastically reduces the number of

voids in solder joints and supports processes such as plasma

cleaning and gas exchange for advanced packaging. Tempera-

tures of up to 400 °C are possible with Nexus.

在电力电子元器件生产中，真空焊接工艺可帮助客户显著提升生产效率

和产品质量。真空环境可确保实现无氧化焊接，改善湿润性能，获得更

饱和的焊点，还能够显著降低焊点空洞率，并支持先进封装领域中的等

离子清洗和换气等工艺。

Nexus

设备最高焊接温度可达到

400 °C

。

without vacuum with vacuum

400 400

300 300

200 200

100 100

0 2 4

vacuum for

void-free solder joints

evacuate and ood

with nitrogen

vacuum and input, e.g.,

formic acid for oxide-free

wetting surfaces

heat up to

solder temperature

activation

phase

pre-heating

phase

cooling phase

solder temperature

6 8min

1000

°C °C

1000

hPa hPa

0 0