PSV7000_ Owners Manual_096-0460-001B - 第89页

■ Administrator Functions ◘ Monitoring Statistics PSV7000 Owner’s Manual 3—19 back Figure 3-9: Sample SPC Log File line entry defined. 23.01.14 10:50:46 ; G044 ; eLeaf ; INTEL RC28F640J3A EBGA64 ; g0044.txt ;; 3 ; 5 ;; P…

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Administrative Functions ■ Administrator Functions
3—18 Data I/O • 096-0460-001B
back
*Inspection quality contains a 4 number record divided by the pipe
[|], such as 1|2|3|4.
1: 100.0-> vision pass or XXX.X->vision error code
2: dX
3: dY
4: dZ
Example:
100.0|85.0|-152.4|-1022.4
dX,dY are recorded in µm, dR is in µdegree
DevicesProcessed-
Marker
DevicesMarked
DevicesInputSys-
tem
SystemYield
SystemThrough-
putExcWait
SystemTo-
talThrough-
putIncWait
DevicesOutputSys-
tem
MachineID
ProgTime
■ Administrator Functions ◘ Monitoring Statistics
PSV7000 Owner’s Manual 3—19
back
Figure 3-9: Sample SPC Log File line entry defined.
23.01.14 10:50:46;G044; eLeaf; INTEL RC28F640J3A EBGA64;
g0044.txt;;3 ; 5 ;;Prog1; 1 ; PASS; 1 ;;Tray1;
95;168;168;100.0|-107.0|61.7|797.2;179;97.00;
100.00;100.00;0;0;86;100.00;1352;1068;81;0003"Blue";2
Time Stamp
Job Name
Job Description
Device
Package
Vision PRJ
Record ID
System Status
System MSG
*
1
From Area ID
From Pos ID
Device Status
Which Probe
SN used
To Area ID
To Pos ID
Devices Inspected
Inspection Passed
Inspection Quality
Socket Yield*
Programmer Yield*
Prog Sys Yield*
2
Devices Marked
Devices Input System
System Total Throughput Inc Wait
Devices Output System
*
1
such as ‘enter Setup Screen’
*
2
over life time, not just current job
Devices Inserted Socket
Devices Processed Marker
System Yield
System Throughput Exc Wait
Machine ID
Prog Time
f
;
;
4
;
;
4
;
t
t
;
;
;
;
3
3
3
3
;
;
5
5
;
;
;
;
;
;
S
S
;
;
;
;
;
;
T
;
;
"
;
;
2
ut
;
;
0
0
D
2
;
;
6
6
;
;
1
0
0
;
;
8
8
0
0
;
;
0
0
0
0
;
;
0
0
0
0
;
;
0
0
;
;
9
9
;
;
9
9
2
;
;
1
8
8
;
;
8
8
;
;
5
5
;
;
1
6
6
;
;
G
G
;
;
8
8
;
;
8
8
12 3
4
56 7 8 9 10 11 12 1314 15
16 17 18 19 20 21
22 23 24 25 26 27 28
29 30
Administrative Functions ■ Maximizing Programming Yields
3—20 Data I/O • 096-0460-001B
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Maximizing Programming Yields
Occasional declines in system yields may occur during day to day
operation of the PSV7000 System. While overall yield levels can vary
depending on device manufacture, any steep change in yields is suffi-
cient reason for investigation of an immediate cause of variation.
These changes in yield can be attributed to a number of causes,
including device quality control, socket issues, system maintenance,
and process errors.
Quality Control of Devices
Variations in the manufacture of devices may affect yields in an auto-
mated system, such as:
Variation in dimensions from different manufacturing lots or
facilities can cause devices to fit improperly in the sockets or
require reteaching the Package File to be placed successfully.
Presence of residual plastic on the edges of the devices (flashing)
can cause devices to rest improperly in the sockets.
Die changes (shrinks, process improvement for improved wafer
yield, etc.) require new algorithms. Data I/O tracks these
changes with vendors and recommends all customers subscribe
to the algorithm update program.
Die processes vary. Programming yields can sometimes vary on
a normal die. Device families recently introduced to the market
tend to have more fluctuations in yields until the semi-vendor's
manufacturing process stabilizes.
Multiple fabrication sites often produce the same devices. Per-
formance characteristics, including programming yield, can
vary from location to location.
Lead oxide accumulating on device leads is an issue for some
devices. This can vary with age and the storage conditions.
Programming yields decrease with the number of programming
cycles. Devices that are processed more than once are more
likely to experience problems.
Socket Issues
The programming sockets are perhaps the most important and vul-
nerable element of the PSV7000 System. They are subject to residue
buildup, damage from mis-inserted devices (perhaps due to poor cal-
ibration of the placement system), and general wear and tear.
Socket conditions that cause varying yields include the following:
Debris of any type can prevent sockets from closing completely.
Debris may not be visible. Simple actuation may clear debris, or
Socket life is generally
rated by the manufacturer
as the number of inser-
tions per socket after
which yields may drop
significantly.