PSV7000_ Owners Manual_096-0460-001B - 第90页

Administrative Functions ■ Maximizing Programming Yields 3—20 Data I/O • 096-0460-001B back Maximizing Programming Yields Occasional declines i n system yiel ds may occur during day to day operation of the PSV7000 System…

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■ Administrator Functions ◘ Monitoring Statistics
PSV7000 Owner’s Manual 3—19
back
Figure 3-9: Sample SPC Log File line entry defined.
23.01.14 10:50:46;G044; eLeaf; INTEL RC28F640J3A EBGA64;
g0044.txt;;3 ; 5 ;;Prog1; 1 ; PASS; 1 ;;Tray1;
95;168;168;100.0|-107.0|61.7|797.2;179;97.00;
100.00;100.00;0;0;86;100.00;1352;1068;81;0003"Blue";2
Time Stamp
Job Name
Job Description
Device
Package
Vision PRJ
Record ID
System Status
System MSG
*
1
From Area ID
From Pos ID
Device Status
Which Probe
SN used
To Area ID
To Pos ID
Devices Inspected
Inspection Passed
Inspection Quality
Socket Yield*
Programmer Yield*
Prog Sys Yield*
2
Devices Marked
Devices Input System
System Total Throughput Inc Wait
Devices Output System
*
1
such as ‘enter Setup Screen’
*
2
over life time, not just current job
Devices Inserted Socket
Devices Processed Marker
System Yield
System Throughput Exc Wait
Machine ID
Prog Time
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Administrative Functions ■ Maximizing Programming Yields
3—20 Data I/O • 096-0460-001B
back
Maximizing Programming Yields
Occasional declines in system yields may occur during day to day
operation of the PSV7000 System. While overall yield levels can vary
depending on device manufacture, any steep change in yields is suffi-
cient reason for investigation of an immediate cause of variation.
These changes in yield can be attributed to a number of causes,
including device quality control, socket issues, system maintenance,
and process errors.
Quality Control of Devices
Variations in the manufacture of devices may affect yields in an auto-
mated system, such as:
Variation in dimensions from different manufacturing lots or
facilities can cause devices to fit improperly in the sockets or
require reteaching the Package File to be placed successfully.
Presence of residual plastic on the edges of the devices (flashing)
can cause devices to rest improperly in the sockets.
Die changes (shrinks, process improvement for improved wafer
yield, etc.) require new algorithms. Data I/O tracks these
changes with vendors and recommends all customers subscribe
to the algorithm update program.
Die processes vary. Programming yields can sometimes vary on
a normal die. Device families recently introduced to the market
tend to have more fluctuations in yields until the semi-vendor's
manufacturing process stabilizes.
Multiple fabrication sites often produce the same devices. Per-
formance characteristics, including programming yield, can
vary from location to location.
Lead oxide accumulating on device leads is an issue for some
devices. This can vary with age and the storage conditions.
Programming yields decrease with the number of programming
cycles. Devices that are processed more than once are more
likely to experience problems.
Socket Issues
The programming sockets are perhaps the most important and vul-
nerable element of the PSV7000 System. They are subject to residue
buildup, damage from mis-inserted devices (perhaps due to poor cal-
ibration of the placement system), and general wear and tear.
Socket conditions that cause varying yields include the following:
Debris of any type can prevent sockets from closing completely.
Debris may not be visible. Simple actuation may clear debris, or
Socket life is generally
rated by the manufacturer
as the number of inser-
tions per socket after
which yields may drop
significantly.
■ Maximizing Programming Yields ◘ System Maintenance that Affects Yield
PSV7000 Owner’s Manual 3—21
back
it may be necessary to clean sockets with low pressure, clean dry
air.
Blow out sockets every day. Refer to Inspecting the Socket Adapters
on page 4-8. Actuate the socket to blow out debris from beneath
the contacts. More frequent cleaning is recommended in a dirty
environment.
Bent or distorted contact pins can cause intermittent socket fail-
ures.
System Maintenance that Affects Yield
PSV7000 machine maintenance is critical to maintaining high yields.
Periodic cleaning, adjustment and replacement of worn elements
ensures the best possible performance. These periodic procedures are
outlined in Maintenance Schedule on page 4-2 and should be followed
closely.
Part of regular maintenance is ensuring that the system hardware is
in good working order, and that settings are accurate.
To check programmer hardware see FlashCORE Programmer Diagnos-
tics on page 4-28.
For accurate placement, ensure that workspace locations (also known
as a Package File) are taught correctly.
If throughput is down, perform Get Movetimes again: see Optimize
Movetimes on page 3-11.
Process Errors
Finally, some process errors can result in reduced yield. While an
automated approach eliminates most human error during produc-
tion, errors in setup or maintenance can result in reduced yield:
Using old algorithms may affect programming yields.
PSV7000 System algorithms are updated weekly at
http://www.dataio.com/algorithms/ and are available depending
on your maintenance plan. Algorithms are updated vis
TaskLink. See TaskLink Help for more information.
Selecting the wrong device part number for the job in TaskLink,
and therefore the wrong algorithm.
Selecting unintended programming processes in TaskLink (sec-
tor protection, security options, verify options, continuity test-
ing, blank checking).
Measuring yields too infrequently, so that a drop in yield rates is
not detected until a large number of devices have failed.