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3 Technical data User Manual SIPLACE HS-60 3.8 Overview of the modules - placement heads Software version SR .503.xx 07/2003 US Edition 90 3.8 Overv iew of th e modu le s - placement heads 3.8.1 12-segment Collect& P…
User Manual SIPLACE HS-60 3 Technical data
Software version SR.503.xx 07/2003 US Edition 3.7 Overview of the modules - gantries
89
The Y axis essentially consists of the following main modules:
– Y axis linear drive with permanent magnet (1) and adapter plate (2)
– Y axis guide system
– Y axis measuring system
The Y axis is driven by a linear motor. The secondary part of the drive is made up of permanent
magnets and is mounted on the machine frame. The primary part is bolted to the gantry (adapter
plate). An anti-crash circuit prevents the traversing paths of the gantries meeting.
3.7.5 Technical data for the Y axis
Drive Direct, linear motor
Maximum speed 2.5 m/sec.
Traversing path of the gantries calculated from
the center of the machine
Gantry 1 - 688.5 mm
Gantry 2 - 768.5 mm
Gantry 3 - 688. 5 mm
Gantry 4 - 768.5 mm
Distance measuring system Metal linear scale
Scale length 1530 mm
Resolution 1 µm
3 Technical data User Manual SIPLACE HS-60
3.8 Overview of the modules - placement heads Software version SR.503.xx 07/2003 US Edition
90
3.8 Overview of the modules - placement heads
3.8.1 12-segment Collect&Place head with standard component vision camera
3.8.1.1 Structure
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Fig. 3.8 - 1 Structure of the 12-segment Collect&Place head
(1) Star with 12 sleeves (4) CO vision module
(2) Motor for "Reject" valve adjustment drive (5) Z axis drive
(3) Turning station (6) Star motor
User Manual SIPLACE HS-60 3 Technical data
Software version SR.503.xx 07/2003 US Edition 3.8 Overview of the modules - placement heads
91
3.8.2 Description
– The 12-segment Collect&Place head works using the "collect & place" principle, i.e. the com-
ponents are held by the nozzles with the aid of a vacuum and, after one complete pick-up cycle,
are placed gently and accurately on the PCB with the aid of forced air. The vacuum in the noz-
zles is also checked several times to determine whether the components were picked up and
set down correctly.
– The "adaptive" sensor stop mode of the z axis compensates for any irregularity of the PCB sur-
face when the components are set down.
– All the components are inserted with the same cycle time. Before the component is inserted, it
is measured by the optoelectronic vision module.
– The component vision module creates an image of the current component.
– The precise position of the component is also determined.
– The package form of the current component is compared against the programmed package
form in order to identify it. Any components that cannot be identified are rejected.
– The turning station turns the component to the required placement position.
– Defective components are rejected and are picked up again during a repair run.
3.8.3 Technical data
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Component range 0201 to PLCC44 including BGA, µBGA, flip-
chip, TSOP, QFP PLCC, SO to SO32, DRAM
Component specification
Max. height
Min. lead pitch
Min. bump pitch
Min. ball/bump diameter
Min. dimensions
Max. dimensions
Max. weight
6 mm
0.5 mm
0.35 mm
0.2 mm
0.6 mm x 0.3 mm
18.7 mm x 18.7 mm
2 g
Programmable set-down force 2.4 to 5.0 N
Nozzle types 9 xx
Max. placement rate 15,000 comp/h
Angular accuracy ± 0.7° / 4 sigma
Placement accuracy with standard vision module ± 80 µm / 4 sigma