M20_Ope_E - 第155页
Chapter 5 Libraries 5-5 SOP X Y SOJ X Y Conne cto r O n e-side Lead ed (bottom ) O n e-side L ead ed (l eft ) O n e-side Lead ed (top) O n e-side L ead ed (right) Two-sid e Lead ed ( X) Two-sid e Lead ed ( Y) L CC PLCC Q…
Chapter 5 Libraries
5-4
Terminat. Four-termination Search (X)
Four-termination Search (Y)
Chip CPL
Electrolytic Capacitor
Edge-midpoint Search
Overall Chip Process
Corner Search
Edge-midpoint Search (Non Recovery)
Pow. Tr. Top
Right
Bottom
Left
Blob One Blob (horizontal)
One Blob (vertical)
Two Blobs (vertical)
Two Blobs (horizontal)
Three Blobs (vertical)
Three Blobs (horizontal)
Four Blobs (corners)
Four Blobs (midpoints)
Multiple Blobs (vertical)
Multiple Blobs (horizontal)
Glass Melf
Transistor Top
Right
Bottom
Left
Chapter 5 Libraries
5-5
SOP
X
Y
SOJ X
Y
Connector One-side Leaded (bottom)
One-side Leaded (left)
One-side Leaded (top)
One-side Leaded (right)
Two-side Leaded (X)
Two-side Leaded (Y)
LCC
PLCC
QFP
BGA Matrix
Staggered
Perimeter-matrix
Perimeter-staggered
Partial-matrix
Partial-staggered
BGA/CSP Matrix
Staggered
XY Dif Pitch Matrix
XY Dif Pitch Staggered
White BGA Matrix
White BGA Staggered
White BGA XY Dif Pitch Matrix
White BGA XY Dif Pitch Staggered
CPL
CPL process (top & bottom)
CPL process (right & left)
CPL process (top)
CPL process (right)
CPL process (bottom)
CPL process (left)
Image Processing Area
The image processing area forms a square with a side of double length of a component. If the
area exceeds the FOV of the camera, the FOV is taken as the area.
Camera types to recognize the components
・ Multi-Scan Camera
Chapter 5 Libraries
5-6
z Applicable Maximum Component Size
Camera type Vision process M10/M20
Multi-Scan Camera Whole View 0402 to 40 mm sq.
2 Views Horizontal 80 × 40 mm
2 Views Vertical 40 × 80 mm
3 Views Horizontal 120 × 40 mm
3 Views Vertical 40 × 120 mm
4 Views 80 mm sq.
Relationship between applicable maximum component size and component height
Component height + PCB thickness
+ pre-mounted component height
Component height
0 to 28 mm 28 to 55 mm
0 to 15 mm
80 m sq./120 x 40 mm
(40 x 120 mm)
36.7 mm sq.
15 to 17 mm
25.4 mm sq.
17 to 25 mm 25.4 mm sq.
z Applicable Minimum Lead Pith/Applicable Minimum Ball Size
Camera type Lead pitch
With ball damage check Without ball damage check
Ball diameter
Ball pitch Ball diameter Ball pitch
Multi-Scan Camera 0.3 mm 0.2 mm 0.4 mm 0.4 mm 0.65 mm
Vision Processing Algorithm for each Component type
The following section shows the application of components and cameras for each vision
process method. However, the available component size below can be limited by actual
Camera specification on the machine.
(Refer to the “Details of Vision Processing Modes” on following pages for details.)
Chips
Chip
Note: For the component which has difficulty to be processed by standard mode, try with other
modes for special component. Finally select the best mode for the component.
● CPL Process Rectangular. Overall parts reflect light: (for standard
chip-type components)
Multi-scan camera Chip size: 0402 or larger