M20_Ope_E - 第157页
Chapter 5 Libraries 5-7 ● Electrolytic Capacitor Two terminat ions reflect light: ( for standard two leads component such as electrolytic capacitor) Multi-scan camera Termination size: 0.5 mm sq. or larger ● Edge-midpoin…
Chapter 5 Libraries
5-6
z Applicable Maximum Component Size
Camera type Vision process M10/M20
Multi-Scan Camera Whole View 0402 to 40 mm sq.
2 Views Horizontal 80 × 40 mm
2 Views Vertical 40 × 80 mm
3 Views Horizontal 120 × 40 mm
3 Views Vertical 40 × 120 mm
4 Views 80 mm sq.
Relationship between applicable maximum component size and component height
Component height + PCB thickness
+ pre-mounted component height
Component height
0 to 28 mm 28 to 55 mm
0 to 15 mm
80 m sq./120 x 40 mm
(40 x 120 mm)
36.7 mm sq.
15 to 17 mm
25.4 mm sq.
17 to 25 mm 25.4 mm sq.
z Applicable Minimum Lead Pith/Applicable Minimum Ball Size
Camera type Lead pitch
With ball damage check Without ball damage check
Ball diameter
Ball pitch Ball diameter Ball pitch
Multi-Scan Camera 0.3 mm 0.2 mm 0.4 mm 0.4 mm 0.65 mm
Vision Processing Algorithm for each Component type
The following section shows the application of components and cameras for each vision
process method. However, the available component size below can be limited by actual
Camera specification on the machine.
(Refer to the “Details of Vision Processing Modes” on following pages for details.)
Chips
Chip
Note: For the component which has difficulty to be processed by standard mode, try with other
modes for special component. Finally select the best mode for the component.
● CPL Process Rectangular. Overall parts reflect light: (for standard
chip-type components)
Multi-scan camera Chip size: 0402 or larger
Chapter 5 Libraries
5-7
● Electrolytic Capacitor Two terminations reflect light: ( for standard two
leads component such as electrolytic capacitor)
Multi-scan camera Termination size: 0.5 mm sq. or larger
● Edge-midpoint search Chips. Overall parts reflect light: (for special type
(Fastest process) component)
Multi-scan camera Chip size: 0402 or larger
● Corner search Chips. Overall parts reflect light: (for special type
component)
Multi-scan camera Chip size: 0.5 mm sq. or larger
● Overall Chip Process Rectangular. Overall parts reflect light: (for special
type component)
Multi-scan camera Chip size: 1.25 mm sq. or larger
● Glass Melf Cylindrical-shape-glass-encapsulated
Two electrodes reflect light.
Multi-scan camera Outside diameter: 1.0 mm or larger
Chapter 5 Libraries
5-8
Transistors
Transistor
● Transistor Three terminations reflect light. One termination is on
the opposite side with two terminations.
Multi-scan camera Termination size: 0.5 mm sq. or larger
Note: Select [Standard] process type for the standard transistor.
Select [High Speed] process type for the power transistor.
● Pow. Tr. More than three electrodes reflect light. One flat
electrode (large electrode) is on the opposite side with
other electrodes.
Multi-scan camera Termination size: 0.5 mm sq. or larger
Power transistors can be handled by either the “Transistor” process or the
“Pow. Tr.” process.
However using the “Pow. Tr.” process can have better result than the
“Transisotor” process.