Operation-Spec-Oxford-System-100-Rev-C.pdf

Oxford Instruments Plasmalab 100 ICP-RIE Page 1 of 8 GENERAL PROCESS AND OPERATION SPECIFICATION Oxford System Plasmalab 100 I CP-RIE I. SCOPE a. The purpose of this docum ent is to describe requ irements and bas ic oper…

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Oxford Instruments Plasmalab 100 ICP-RIE
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GENERAL PROCESS AND OPERATION SPECIFICATION
Oxford System Plasmalab 100 ICP-RIE
I. SCOPE
a. The purpose of this document is to describe requirements and basic operating instructions
for the Oxford Instruments Plasmalab 100 ICP-RIE. This tool is intended for general
purpose use to perform Reactive Ion Etching on a variety of substrates and films.
II. SAFETY
a. You must be trained and signed off to use this equipment.
b. Keep all doors and protective shields in place before operating this equipment.
c. This tool can produce high voltage, RF energy, high temperatures, and low temperatures.
Use caution when interacting with the various components of this tool.
d. This equipment uses liquid nitrogen (LN2) to cool the substrate holder in the chamber.
Use caution and wear the cryo gloves when moving the LN2 valve.
e. Minimum operating temperature of substrate table/holder: DO NOT operate the substrate
chiller below -100°C. This places the O-rings and seals at risk and reduces the life of the
equipment.
f. If you are unsure about any procedure or indication while operating this equipment,
contact a staff member or trainer for assistance.
III. APPLICABLE DOCUMENTS, MATERIALS, AND REQUIREMENTS
a. For more information about the hardware, software operating system, and general system
specifications see the factory manual (sk AggieFab staff for a copy).
b. Process gases are available to the system: O2, Ar, SF6, CHF3. He is used for backside
cooling.
c. Appendix A: Recipe Parameter Information
d. Appendix B: Common Substrate Chemistry Recipes
e. Appendix C: Cryogenic Deep RIE
IV. OPERATION
1. Log in:
a. Open the liquid nitrogen (LN
2
) valve using the cryogenic gloves provided.
i. This valve is on to the large dewar to the left of the tool.
b. Log in by selecting “System,” then “Password.”
i. Optionally, you can click where it says “View_Only” in the top center of
the screen.
2. Open the chamber:
a. Select “System,” then “Pumping” to access the “PUMP CONTROL” page.
b. Press “STOP” in the loadlock menu on the lower left side.
i. A message saying, “Wafer process complete, ready to vent” may pop up,
if so, select “OK.”
c. Press “VENT” in the loadlock menu on the lower left side.
i. Wait until “Vent Time Left” is 0 sec.
d. Open the loadlock door and remove the carrier wafer.
Oxford Instruments Plasmalab 100 ICP-RIE
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3. Ready sample and close the chamber:
a. If your sample is not a standard 4-inch wafer, use Kapton tape to mount it to the
carrier wafer.
i. Ensure the sample is away from the outside edge of the carrier wafer.
The clamp may hit your sample if it is mounted too close to the edge.
b. Place the wafer into the loadlock.
i. Ensure the wafer is sitting flat and that the round edge is touching the
two circular knobs.
ii. If the carrier wafer has a major flat, face it to the right (towards the
process chamber).
c. Close the loadlock door.
d. Press “STOP” on the pump menu.
4. Load, edit, and run your recipe:
a. Select “PROCESS” in the top left of the screen.
b. Select “Recipes”
c. Select “Load”
d. Select “YES” to overwrite the current recipe. This does NOT delete the recipe; it
loads a new one.
i. The prompts for overwriting a recipe and loading a new one are similar
and can be easily confused. Look at which action is highlighted (load or
save) before proceeding.
e. Select desired recipe from the list.
f. To edit a recipe, right-click a recipe step and select “Edit Recipe”.
i. Time is in “hh:mm:ss”.
ii. See “Appendix A - Recipe Parameter Information” for recipe constraints.
g. Select “RUN” when the recipe is ready.
i. ALWAYS ENTER A WAFER NAME. Not naming a wafer can cause
software errors.
ii. The system will automatically evacuate the loadlock, move the sample
into the process chamber, and begin the recipe.
5. While running the recipe:
a. Notice that at the top left of the “Process” => “Chamber 1” screen, there is a box
that shows the current running recipe name, recipe step, and step time left in
hh:mm:ss.
b. Fill out the logbook as your recipe is running.
6. Unload your sample:
a. Before venting, visually confirm the sample is in the loadlock, and that the tool is
finished moving.
b. Follow the instructions above to vent the loadlock and unload the sample.
c. Place the carrier wafer back into the loadlock.
7. Run a chamber clean:
a. Load and run the “OPT-CHAMBER O2 CLEAN” recipe.
b. Ensure the LN2 valve is open to allow cooling of the chamber substrate before
beginning this recipe.
i. You may log out of the tool as the clean is running.
c. Close the LN2 when the recipe is finished.
8. Log out:
a. Click “System” then Password”.
b. Click “Verify” then “OK”.
Oxford Instruments Plasmalab 100 ICP-RIE
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