IPC-4556 印制板化学镍钯浸金（ENEPIG）规范ENG - 第4页
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IPC-4556
Specification for
Electroless Nickel/
Electroless Palladium/
Immersion Gold (ENEPIG)
Plating for Printed Circuit
Boards
Developed by the Plating Processes Subcommittee (4-14) of the
Fabrication Processes Committee (4-10) of IPC
Users of this publication are encouraged to participate in the
development of future revisions.
Contact:
IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105
®
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Acknowledgment
Any document involving a complex technology draws material from a vast number of sources. While the principal members
of the Plating Processes Subcommittee (4-14) of the Fabrication Processes Committee (4-10) are shown below, it is not pos-
sible to include all of those who assisted in the evolution of this standard. To each of them, the members of the IPC extend
their gratitude.
Fabrication Processes
Committee
Co-Chairs
George Milad
Uyemura International Corp.
Gerard A. O’Brien
Technical Liaison of the
IPC Board of Directors
Solderability Testing & Solutions, Inc.
Plating Processes
Subcommittee
Co-Chairs
George Milad
Uyemura International Corp.
Gerard A. O’Brien
Solderability Testing & Solutions, Inc.
Bob Neves
Microtek Laboratories
Dongkai Shangguan
Flextronics International
Plating Processes Subcommittee
Wallace Ables, Dell Inc.
Martin Anselm, Universal
Instruments Corporation
Craig Bachman, Molex Copper Flex
Products
Tina Barclay, TAS Consulting
Bill Barthel, Plexus Manufacturing
Solutions
Martin W. Bayes, Ph.D., Dow
Electronic Materials
Luc Beauvillier, Isola Group SARL
Elizabeth Benedetto, Hewlett-Packard
Company
Jon Bengston, Uyemura International
Corp.
Wendi Boger, Viasystems Group, Inc.
Jim Bogert, Fischer Technology Inc.
Mumtaz Y. Bora, Peregrine
Semiconductor
William C. Bowerman, OMG
Electronic Chemicals
Trevor S. Bowers, Adtran Inc.
Peter Bratin, Ph.D., ECI Technology,
Inc.
Jerry Brewer, Atotech USA Inc.
Dock Brown, Medtronic
Lee Burger, OMG Electronic
Chemicals
Matthew J. Byrne, BAE Systems
Platform Solutions
Mike V. Carano, OMG Electronic
Chemicals
Srinivas Chada, Ph.D., Power-One
Alex Chen, Celestica
Renewable Energies Inc.
Peter Chiang, MSI (Micro-Star
International Co., Inc.)
Joshua Civiello, Defense Supply
Center Columbus
Horst Clauberg, Kulicke & Soffa
Industries Inc.
Christine R. Coapman, C2 Consulting
David J. Corbett, Defense Supply
Center Columbus
G. Sidney Cox, Ph.D., DuPont
Donald Cullen, MacDermid, Inc.
Richard Davidson, Honeywell
Aerospace
Michael F. DiCicco, Northrop
Grumman Corporation
Karl H. Dietz, Ph.D., Karl Dietz
Consulting LLC
Steven Dunford, Schlumberger Well
Services
Gene Dunn, Plexus Corporation
C. Don Dupriest, Lockheed Martin
Missiles & Fire Control
Patricia S. Dupuis, Raytheon
Company
Richard M. Edgar, Tec-Line Inc.
Theodore Edwards
Steven R. Etheridge, Dell Inc.
John J. Fendrock, Raytheon Missile
Systems
Ellen Finch, Anaren Microwave Inc.
Sandra M. Fortune, Northrop
Grumman Corporation
Dennis Fritz, MacDermid, Inc.
Hiroyuki Fukuda, Shikoku Chemicals
Corporation
Lionel Fullwood, WKK Distribution
Ltd.
Gerald Gagnon, Extech Instruments
Corporation
Thomas Gahagan, Anaren Microwave
Inc.
Andrew Glendening, Northrop
Grumman ESSD
Robert Gordon, Amonix, Inc.
Michael R. Green, Lockheed Martin
Space Systems Company
Albin Gruenwald, Uyemura
International Corp.
Donald Gudeczauskas, Uyemura
International Corp.
Michael Haller, Fischer Technology
Inc.
Philip M. Henault, Raytheon
Company
David D. Hillman, Rockwell Collins
Charles Hirbour, Technic Inc.
Joanne Hohman, Lockheed Martin
Missiles & Fire Control
Helen Holder, Hewlett-Packard
Company
Michelle Hong, Wistron Corporation
Jay Huang, Wistron Corp.
Werner Huegel, Ph.D., Robert Bosch
GmbH
Jim Huff, Dell Inc.
Joseph Jacobi, Lockheed Martin
Missiles & Fire Control
January 2013 IPC-4556
iii