IPC-4556 印制板化学镍钯浸金（ENEPIG）规范ENG - 第45页
IPC-4556-a5-8 Figure A5-8 Example of the W etting Performance for a Nominal 20 µin Electroless Palladium T ested with SnPb Solder Sample 19 1.48Au/17.95Pd/196.17Ni Fr(mN/mm) Standard : NF-A-89 400P t(s) 0.25 0.20 0.15 0.…
IPC-4556-a5-6
Figure A5-6 Example of the Wetting Performance for a Nominal 4 µin Electroless Palladium Tested with SnPb Solder
Sample 16 1.33Au/3.80Pd/181.65Ni
Fr(mN/mm)
Standard : NF-A-89 400P
t(s)
0.25
0.20
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
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-0.25
IPC-4556-a5-7
Figure A5-7 Example of the Wetting Performance for a Nominal 8 µin Electroless Palladium Tested with SnPb Solder
Sample 17 1.24Au/5.93Pd/184.07Ni
Fr(mN/mm)
Standard : NF-A-89 400P
t(s)
0.25
0.20
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
12345678910
-0.25
IPC-4556 January 2013
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IPC-4556-a5-8
Figure A5-8 Example of the Wetting Performance for a Nominal 20 µin Electroless Palladium Tested with SnPb Solder
Sample 19 1.48Au/17.95Pd/196.17Ni
Fr(mN/mm)
Standard : NF-A-89 400P
t(s)
0.25
0.20
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
12345678910
-0.25
IPC-4556-a5-9
Figure A5-9 Example of the Wetting Performance for a Nominal 4 µin Electroless Palladium Tested with SAC305 Solder
Sample 13 2.22Au/4.39Pd/280.83Ni
Fr(mN/mm)
Standard : NF-A-89 400P
t(s)
0.25
0.20
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
12345678910
-0.25
January 2013 IPC-4556
35
IPC-4556-a5-10
Figure A5-10 Example of the Wetting Performance for a Nominal 8 µin Electroless Palladium Tested with SAC305 Solder
Sample 14 1.42Au/7.48Pd/297.04Ni
Fr(mN/mm)
Standard : NF-A-89 400P
t(s)
0.25
0.20
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
12345678910
-0.25
IPC-4556-a5-11
Figure A5-11 Example of the Wetting Performance for a Nominal 12 µin Palladium Tested with SAC305 Solder
Sample 15 1.78Au/10.03Pd/300.79Ni
Fr(mN/mm)
Standard : NF-A-89 400P
t(s)
0.25
0.20
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
12345678910
-0.25
IPC-4556 January 2013
36
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