IPC-4556 印制板化学镍钯浸金（ENEPIG）规范ENG - 第70页
The samples in the package marked ‘ ‘Hand Cut’ ’ were not evaluated. The individual wire bond coupons were immediately labeled with the same designation used for the panel prior to removal of the coupon from the panel an…
The electroless nickel and immersion gold surface finish thickness metal layers were selected as a control; the electroless
palladium thickness and wire bond pad surface roughness were the variables chosen by consensus of the subcommittee for
evaluation of the suitability of ENEPIG as a plating finish for gold wire bonding.
The electroless palladium thickness layer varied based upon the following target thicknesses:
a. 4 micro inches
b. 8 micro inches
c. 12 micro inches
d. 20 micro inches
ENEPIG Plating Finish Attributes Used to Evaluate 1-Mil Gold Wire Bonding 1 mil gold ball auto wire bonding for evalu-
ation of the ENEPIG finish was based upon using the established volume manufacturing wire bond processes used at St. Jude
Medical (Scottsdale, AZ). Experienced and certified wire bond associates and technicians performed all wire bond setups,
calibrations and conducted the actual wire bonding of the ENEPIG test vehicles.
The wire bond testing was configured as a blind test. The suppliers, plating thicknesses and other properties were unknown
before and after actual processing. Twenty-one (21) groups of panels were received with special labeling used for designa-
tion of the coupons and wire bonding data collection (Table A8-I).
Development of 1 mil gold wire bond parameters and attributes used for wire bonding onto the coupons with the ENEPIG
plating finish was consistent with the same approaches used to establish auto wire bonding parameters for standard electro-
lytic gold plating finish substrates.
Auto Wire Bond Process Design Point Areas of Focus Included:
• Preheat Stage Temperature
• Power / Force / Time
• Visual Inspection Before and After Wire Bonding
• Selection of Coupons within the Panels
• One Set of Parameters to be used for ALL Wire Bond Samples (Standardization Target)
• No Effort would be Placed into ‘‘Making Wires Stick’’
• Wire Bond Equipment was Calibrated Before Processing
• Certified Wire Bond Operators Used for Wire Bonding
• 1 mil Diameter Gold Wire Used for Bonding
• Destructive Pull Testing per MIL-STD-883 Would be Incorporated
• Pre-conditioning of Test Vehicle Before Wire Bonding
Table A8-I Twenty-one Panels Marked (a) Whole Panel, (b) Array and (c) Hand Cut
January 2013 IPC-4556
59
ID
１
２
３
４
５
６
７
８
９
１０
１１
１２
１３
１４
１５
SUMMARY OF WIRE BOND Ni-Pd-Au COUPONS RECEIVED
From Whole Panel FRONT
From Arrays
MARK
BACK
MARK
FRONT
MARK
BACK
MARK
＊＊２
SN12-1
O-XX & XXB
13-T
Ⅱ
I
markings
NONE
Ⅱ
l
N/A
7-B
7-T
１５
１７
SN13-3
SN13-4
SN7-2
SN7-3
SN7-4
VA
XXIB
XXIVA
I
I
NONE I XII A
SN9-3
N/A
9-T
N/A
VIII A
XXV A
VII A
VII B
IXB
２０
XX-R
SN12-4
SN15-3
SN17-3
SN17-4
SN20-1
SN20-3
SN20-4
SN2-1
SN2-4
SN3-2
SN3-4
SN5-1
N/A
N/A
N/A
N/A
N/A
MARKING ON ALL
PANELS & ARRAYS
6×8 Card Array
PN ENEPIG IPC MFR
IVB
65916 DC1032
N/A
SN5-3
XIB
XB
SN8-4
N/A
XXII-2A
From Hand Cut
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Ｎ／Ａ
Ｎ／Ａ
Ｎ／Ａ
Ｎ／Ａ
Ｎ／Ａ
Ｎ／Ａ
The samples in the package marked ‘‘Hand Cut’’ were not
evaluated.
The individual wire bond coupons were immediately labeled
with the same designation used for the panel prior to removal
of the coupon from the panel and packaging (Table A8-I and
Figure A8-2). To ensure maximum traceability from coupon to
coupon and supplier to supplier, a standard label approach was
adopted for wire bonding to each test vehicle.
The identical wire bond locations on each coupon were used
for wire bonding for each of the 6 different ENEPIG suppliers
followed by destructive pull testing. For example, wire bond
pad location #1 in the X-direction per Figure A8-1 was the
same location used for all 21 panel groups. Wire bond loca-
tion #2 corresponded to location number 2 for all 21 panel
groups. Panel groups were composed of six (6) Suppliers, four
(4) different palladium thicknesses and two (2) levels of sur-
face roughness (Table A8-II).
Figure A8-2 Example of 6 inx8inPanel Containing 1 in x
1in ENEPIG Wire Bond Coupons
Table A8-II Destructive Wire Bond Pull Test Force (grams) Results for All 21 ENEPIG Test Groups
IPC-4556 January 2013
60
ID
1A
１
２
３
４
５
６
７
８
９
１０
Avg
Min
Max
X
１
Ｉ
Y
３
１０．１
１０．８
１０．８
１０．１
８．７５
８．６５
９．２
１０．９
７．７５
９．６６
７．７５
１０．９
３
８．２５
１０．８
１０．９
１１．２
１１．２
１０．６
１１．５
１１．２
１１．９
１０．２
２
１０．８
８．２５
１１．９
II-SN13-3
X Y
３
９．８
１０．１
９．９
１０．６
８．３
８．８
１１．３
１０．９
１０．３
９．９
９．９８
８．３
１１．３
３
１１
１１．８
１２
１２．２
１１．１
１１．８
１１．６
１１．２
１１．８
３
１１．７
１１
１２．５
II-SN13-4
X Y
３
９．５
８．９
１１
９．７
１０．１
７．６５
９．４
１１．２
１０．６
１２．５
７．３５
３
１０．４
１１．９
９．５３
７．３５
１１．２
１１．５
１２
１２．２
１２．６
１２．３
１２．５
１０．９
１１．５
４
１１．７
１０．４
１２．６
III SN7-2
X Y
３
９．７５
９．５５
９．０５
９．６５
９．７
１０．９
９．５
９．６５
９．７５
９．９
３
１０．６
１１．１
１１．１
１１．３
１１．５
９．７４
９．０５
１０．９
１０．９
１１
１１．２
１１．５
１１．９
５
１１．２
１０．６
１１．９
II SN7-3
X Y
３
１０．１
１０．７
１０．４
９．１
９．９
１０．２
５．８
９．５
１０．４
１０．４
９．６３
５．８
１０．７
３
１０．６
１０．９
７．８
９．８５
９．９
１０．７
１０．９
１０．６
１０．９
６
１０．２
７．８
１０．９
III SN7-4
X Y
３
９．６
９．４
１０．３
１０．１
９．７５
８．８５
９．４
７．９
８．８
３
９．４２
７．９
１０．３
１０．７
９．０５
９．１５
１０．９
１０．１
１１．４
９．３５
１０．５
９．２
１０．１
８．８５
８．８５
１１．４
７
IVB
X Y
３
８．８５
８．９５
７．２５
８．２
８．２５
７．４５
８．１
８．７５
８．２５
８．５
３
１０．７
１０．３
１０．７
７．２５
８．９５
１１．５
１０
１０．８
１０．９
１１．１
１１．２
８
１０
１１．５
IXB
X Y
３
９．７５
３
１０．４
１０
９．２
９．９５
１０．４
１０．８
９．６５
１０．３
１０．２
９．５５
９．８
１０．９
９．９５
１１．３
８．２５
１２．１
８．２５
８．７
１１．７
１１．３
８．２５
１０．２
９
９．２
１２．１
XXB
X Y
３
９．４
３
１０．５
９
１０．３
９．６ １０
９．７５
９．３５
８．８５
９．０５
９．５５
９．８５
１０．４
１０．２
１０．５
１０．５
９．７５ ９．７
８．２
１０
９．７
８．２
９．７５ １０．８
X
VA
Y
３
９．６
９．９
９．６
９．４５
８．６５
８．８
８．９５
９．１
１０．５
１０．８ ９．０５
９．９
８．２６
１０．８ ９．４２ １０．７ ９．２５ １０．３ ９．３６
３
１０．３
１０．４
１１．３
１０．３
１１．４
１１．２
１１．１
１１．６
１１．９
８．６５
１０．５
１１．２
１１
１１
１０．３
１１．９
VIIA
X
Y
３
９．７５
９．３
３
１１．８
１０．６
９．９ １１．１
１０．７
１０．３
１１．６１０．５
８．８５
１０．４
１２
１１．１
９．７
１０．９
１１．８
１１．５
１０．１
８．８５
１１．１
９．８５
１２．１
１１．３
９．８５
１２
１２．１
VIIB
X Y
３
７．４５
８．１５
８．９５
９．３
１２
９．４５
９．３５
３
９．６５
９．４５
１０．８
９．９
８．９
９．３
１０．５
５．５５
９．２５
９．５５
１１．８
８．９５
１２．４
９．２２
５．５５
９．８４
７．４５
１０．８
１２．４
ID
１
２
３
４
５
６
７
８
９
１０
Avg
Min
１３
Max
VIIIA
X
Y
３
３
１０．１ １０．５
８．８
９．１５
９．５５
９．９
９．１
９．４５
８．３５
９．９
１０．５
１０．２
９
１１．２
１１．３
７．３５
１２
１２．５
１０．６
１１．９
９．４４
７．３５
１０．５
１０．７
８．８
１２．５
１４
XB
X
Y
３
３
９．０５
８．７
８．６５
９．２５
９．９５
１０．１
９．９５
９．６５
１０．６
１２．４
９．４
８．９
１０．１
１０．１
１０
９．９
９．８
９．８
８．９
９．９５
９．４
８．６５
１５
１０．１
８．９
１０ １２．４
XIB
X Y
３
８．８
８．９５
８．９５
９．８
９．４５
９．０５
３
８
９．５
１２．１
１０．１
１０．６
１１．１
１１．５
１１．４
１１．９
９．６
８．４５
１０．９
１０．１
１２．７
１０．９
８
９．４
８．４５
１０．９ １２．７
１６
XIIA
X Y
３
９．８
９．３
１０．２
９．６
１０．１
３
１０．２
１０．２
１０．４
１０．３
１０．３
１０．３ １０．３
８．９５
１０．２
９．５ １０．２
１０．２
９．８５
１０．５
１０．２
９．８ １０．２
１０．２
８．９５
１０．５
１７
１０．４
XXIB
X
Y
３
３
９．８５
９．２５
７．３
８．５
９．７５
９．９
１１．３
１０．４
１０．２
８．９５
１０．４
９．９
９．８５
１０．３
１０．１
１０．１
９．７
１０．５
１０
９．３５
９．８４
８．９５
１８
９．７
７．３
１０．５ １１．３
XXII-2A
X
Y
３
３
９．５５９．４
１０ ８．３５
１０．６
７．２５
９．１５
８．４５
８．７５
１０．２
８．４
８．８５
８．７
９．２５
１０．２
９．９
９．９５
１０．１
１０．１ １０．４
９．０５
７．２５
９．６９
８．３５
１０．２ １０．６
１９
XXIVA
X
Y
３
９．９５
９．２
９．５５
１０．８
９．１５
８．９
３
９．２
８．３５
８．５
９．３５
９．９
８．４５
８．９
９．８
９．９
８．８５
１０．１
８．７５
９．３５
９．７５
９．２４
８．３５
１０．１
２０
９．４２
８．７５
１０．８
XXR
X
Y
３ ３
８．９５
１０．６
９．０５ ９．１５
９．５５
１０
９．４
１０．３
１０．７
１０．１
１０．３
７．５
８．８ ８．８
１０．６
７．７５
９．９５
８．７
８．９１０．２
９．４２
７．５
１０．６
９．４９
２１
７．７５
１０．７
XXVA
X
Y
３
３
９．１ ９．９
１０．２
１０．８
９．４５
１１．８
１０．６
１１．５
１０
１０．２
１０．３
１０
１０．２
１０．５
９．５５
１０．１
１０．２
１０．１ １０．２
９．９９
９．１
１０．５
１０．６
９．４５
１１．８
AVG
９．５７
９．６９
９．８４
１０．０１
９．９６
９．８０
９．９９
７．４５
８．１５
７．２５
８．２
８．２５
７．４５
１０．２４
５．８
１０．１４ ５．５５
１１．６
１０．１７
７．７５
７．３５
９．５７
Min
１０．２４｜ ８．２５
Max
１１．８
１１．９
１２
１２．２
１２．２
１２．６
１２．３
１２．５
１１．９
１２．５
５．５５
１１．８０］
１２．５５
1 mil Gold Wire Bonding and Destructive Pull Testing Evaluation per MIL-STD-883 The 1 mil gold wire bond parameters
developed for the ENEPIG plating finish test vehicles were based upon the same 1 mil gold wire bond approach used in the
development of the wire bond parameters designed for production level substrates with gold plating finish.
Manufacturing processes and operations are inherently specific. While automatic wire bonders are similar, they may be dif-
ferent in specific aspects. Wire bond fixtures and capillaries are critical and play a significant role in a successful wire bond-
ing operation. The experience levels of the wire bond operator are also important.
Following removal of the coupons from the panel and marking of the coupons, the parts were baked in a nitrogen oven at
150 °C [302 °F] for 4 hours. The parts were then plasma cleaned and wire bonded. 120 wires were placed onto each con-
ditioned coupon. A minimum of 10 each 1 mil gold wires per coupon in the X-direction and 10 wires in the Y-direction were
bonded, followed by DPT (see Figure A8-1).
The 1 mil gold wire bonding parameters selected for bonding on substrates with an electrolytic gold plating finish were
modified for the bonding of ENEPIG coupons with the immersion gold finish, as follows:
Reduction in Power by 7%
Force was increased by 10%
Time was increased by 100%
Stage temperature at the substrate surface was 150 °C±5°C[302 °F ± 9 °F].
MIL-STD 883 destructive pull test requirements for all ENEPIG test vehicles were met (see Figures A8-3 and A8-4).
Figure A8-3 Visual Evaluation of Wire Bonding Showing Classical Crescents Resulting in Neck Breaks
(Left) Destructive Pull Test value of 12.5 grams / (Right) DPT is 5.5 grams
January 2013 IPC-4556
61
Vac-High PC-Std. 10 kV
50 m
4/5/2011 *000055 VarcHigh Pc Srd.oky
20 pm
４１５２０４１２００００５６