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HiSOL Probe  Syste m  Products

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HiSOL ProbeSystemProducts
Wafersize2”to12
ManualandSemiautomatic
Ultralow currentmeasurementinfAlevel
Low capacitancemeasurementinfF level
Highfrequency measurementupto67GHz
Thermaltestfrom‐65Cto+400C(Atmospheric)
Thermaltestfrom 4kto+500C(Vacuum)
1/fnoise,RTNmeasurement
PulseIVtest,Ultra
highspeedIVtest
Highcurrentmeasurement(200Apulse)
Highvoltagemeasurement(10kV)
Electrostaticdischarge(ESD)evaluation
Failureanalysis
Magneticstimulation measurement
Optoelectronics (VCSEL,PDetc.)measurement
Waferlevelreliabilitytest (EM/TDDB/HCI/NBTI/BT)
From
From
UltraLow
UltraLow
SignaltoHighPower
SignaltoHighPower
test
test
,
,
FromDC
FromDC
I
I
V
V
C
C
V
V
m
m
easurement
easurement
toRF
toRF
m
m
easurement
easurement
OurProbingSolutions
WeofferyouanalysisprobesystemsforsemiconductorandFPD (Flatpaneldisplay).
Wecanprovidevariousprobesystemsfromaffordablecompactmanual probersforR&Dtohighend
300mmsemiautomatic probesystemfor‐65Cto+300Cthermaltest.
Wecancustomizethemostsuitableprobing solutionthatmatchestoyourmeasurement
application.
Ourprobesystemscorrespondtowidevarietyofapplicationfrom ultra lowsignaltesttohighpower
devicetest,fromDCparametric measurementtoRFmeasurement,waferlevelreliabilitytest,
magnetic fieldimpressionmeasurement,andopticaldevicemeasurement.
WesupportyourdevelopmentofR&Dandtechnicalimprovement.
HiSOL,Inc.isacertifiedsolutionpartnercompany
ofKEYSIGHTTechnologies
ManualProber
SemiAutomaticProber
ProbeSystemforFPD
Vacuumprobesystem
Specialty Probesystem
Accessories
Applications
2
3
4inch 6inch
Model HMP-400 / HMP-600
Model HMP-400 is for 4" wafers.
Model HMP-600 is for 6" wafers.
BestsellingCompactManualProber
ThisisacompactmanualproberforR&Dthatsupportswafermeasurementsrangingfromsmallchip upto4” or6” wafers.
Proberiscapableofmeasuringultra low curren tsonthefAlevelorlowcapacitanceonthepFlevelbyselectingappropriate
options.
Hightemperaturetestscanbealsomadebyincorporatingahotchuck
thatsupportsatemperaturerangefrom
roomtemperature to+300°C.
UltralowsignalIVmeasurements(fAlevel)
VariousCVmeasurements(quasistaticCV,HFCV)
4terminalresistancemeasurements
Temperaturecharacteristicstestsinrangefromroomtemperature to
+200°Cor+300°C
Mountsinglovebox
Probecardsupport
RFmeasurements(upto67 GHz)
UltrahighspeedIVmeasurements
Highpowerdevicemeasurements
(100Apulse,±3kVtriaxial,±10kVcoaxial)
Lightreceiving/emittingcharacteristicsevaluationapplicationsfor
optoelectronics (suchasLED,
LD,VCSEL,andPD)
Extended applications
Applications
MANUAL PROBER
Wafer Size
XYcoarsetravel
XYfinetravel
θ travel
PlatenZaxisaction
UnitdimensionW×D×H*
Weight*
PlatenZaxisadjustment
HMP400 HMP600
upto φ100mm upto φ150mm
X105mmY150mm X155mmY200mm
350×390×450mm
390×450×450mm
28kg 36kg
XY13mm / Micrometerhead
coarse±30°,fine±2.5°
0‐ 20mmfree
015mm
*Itemswithasteriskvarydependingonsystemconfiguration.
ManualProber