prober-english - 第3页

3 4 inch 6 inch Model HMP-400 / HMP-600 ・ Model HM P-400 is for 4" wafers. ・ Model HM P-600 is for 6" wafers. Bestselling  Compact  Manual  Prober This  is  a  compact  manual  prober  for  R&D  …

● Wafersize2”to12”

● ManualandSemi‐automatic

● Ultralow currentmeasurementinfAlevel

● Low capacitancemeasurementinfF level

● Highfrequency measurementupto67GHz

● Thermaltestfrom‐65゜Cto+400゜C(Atmospheric)

● Thermaltestfrom 4kto+500゜C(Vacuum)

● 1/fnoise,RTNmeasurement

● PulseI‐Vtest,Ultra

highspeedI‐Vtest

● Highcurrentmeasurement(～200Apulse)

● Highvoltagemeasurement(～10kV)

● Electrostaticdischarge(ESD)evaluation

● Failureanalysis

● Magneticstimulation measurement

● Optoelectronics (VCSEL,PDetc.)measurement

● Waferlevelreliabilitytest (EM/TDDB/HCI/NBTI/BT)

From

UltraLow

SignaltoHighPower

test

FromDC

，

‐

，

‐

V

easurement

toRF

easurement

OurProbingSolutions

WeofferyouanalysisprobesystemsforsemiconductorandFPD (Flat‐paneldisplay).

Wecanprovidevariousprobesystemsfromaffordablecompactmanual probersforR&Dtohigh‐end

300mmsemi‐automatic probesystemfor‐65゜Cto+300゜Cthermaltest.

Wecancustomizethemostsuitableprobing solutionthatmatchestoyourmeasurement

application.

Ourprobesystemscorrespondtowidevarietyofapplicationfrom ultra lowsignaltesttohighpower

devicetest,fromDCparametric measurementtoRFmeasurement,waferlevelreliabilitytest,

magnetic fieldimpressionmeasurement,andopticaldevicemeasurement.

WesupportyourdevelopmentofR&Dandtechnicalimprovement.

HiSOL,Inc.isacertifiedsolutionpartnercompany

ofKEYSIGHTTechnologies

ManualProber

Semi‐AutomaticProber

ProbeSystemforFPD

Vacuumprobesystem

Specialty Probesystem

Accessories

Applications

4inch 6inch

Model HMP-400 / HMP-600

・

Model HMP-400 is for 4" wafers.

・

Model HMP-600 is for 6" wafers.

BestsellingCompactManualProber

ThisisacompactmanualproberforR&Dthatsupportswafermeasurementsrangingfromsmallchip upto4” or6” wafers.

Proberiscapableofmeasuringultra low curren tsonthefAlevelorlowcapacitanceonthepFlevelbyselectingappropriate

options.

Hightemperaturetestscanbealsomadebyincorporatingahotchuck

thatsupportsatemperaturerangefrom

roomtemperature to+300°C.

‐ UltralowsignalI‐Vmeasurements(fAlevel)

‐ VariousC‐Vmeasurements(quasi‐staticC‐V,HF‐CV)

‐ 4‐terminalresistancemeasurements

‐ Temperaturecharacteristicstestsinrangefromroomtemperature to

+200°Cor+300°C

‐ Mountsinglovebox

‐ Probecardsupport

‐ RFmeasurements(upto67 GHz)

‐ Ultrahigh‐speedI‐Vmeasurements

‐ High‐powerdevicemeasurements

(100Apulse,±3kVtriaxial,±10kVcoaxial)

‐ Light‐receiving/emittingcharacteristicsevaluationapplicationsfor

optoelectronics (suchasLED,

LD,VCSEL,andPD)

Extended applications

Applications

■ MANUAL PROBER

Wafer Size

X‐Ycoarsetravel

X‐Yfinetravel

θ travel

PlatenZaxisaction

Unitdimension（W×D×H）*

Weight*

PlatenZaxisadjustment

HMP‐400 HMP‐600

upto φ100mm upto φ150mm

X：105mm，Y：150mm X：155mm，Y：200mm

350×390×450mm

390×450×450mm

28kg 36kg

XY：13mm / Micrometerhead

coarse±30°,fine±2.5°

0‐ 20mmfree

0～15mm

*Itemswithasteriskvarydependingonsystemconfiguration.

ManualProber

8inch 12inch

Model HMP-800 / HMP-1200

Thisisastandardmanualproberthatsupports8”or12”wafers.

・

Model HMP-800 is for 8" wafers.

・

Model HMP-1200 is for 12" wafers.

Thisprobersupportsreliableon‐wafermeasurementswithasimpleyethigh‐accuracymechanismthatiseasytooperate.

Thisstandardmanualprobermodelisscalabletosupportawiderangeofapplicationssuchashotchucksystems

(fromroomtemperatureto+200°Cor+300°C),submicronresolutionstages,and

lasercutters.

Applications

‐ Temperaturecharacteristicstestsinrangefrom+20°Cto+300°C

‐ UltralowsignalI‐Vmeasurements(fAlevel)

‐ VariousC‐Vmeasurements(quasi‐staticC‐V,HF‐CV,andRF‐CV)

‐ RFmeasurements(upto67GHz)

‐ Ultrahigh‐speedI‐Vmeasurements

Extended applications

‐ Probecardsupport(cansupportMultisiteWLR)

‐ Built‐inlasercutter(Pointmarking,Exfoliationofprotectionlayer,

Metallayercutting)

‐ Probingwithsubmicronaccuracyachievedbyabuilt‐in

metallograph,activevibrationisolator,andultrahigh‐accuracy stage

‐ Light‐receiving/emittingcharacteristicsevaluationapplications

foroptoelectronics (suchasLED,LD,VCSEL,andPD)

‐ Common

gatepad contactsofflat‐paneldisplaydevices

‐ High‐powerdevicemeasurements

(200Apulse,±3kVtriaxial,±10kVcoaxial)

‐ Waferlevelreliabilitytests(suchasEM,TDDB,HCI,NBTI,andBT)

■ MANUAL PROBER

WaferSize

X‐Ycoarsetravel

X‐Yfinetravel

θ travel

PlatenZaxisaction

Unitdimension（W×D×H）*

Weight*

PlatenZaxisadjustment

HMP‐800 HMP‐1200

～φ200mm ～φ300mm

X：205mm，Y：300mm X：305mm，Y：400mm

550×650×450mm

690×780×450mm

60kg 80kg

XY：13mm/Micrometerhead

coarse±30°,fine±2.5°

0/0.3/10mm

0～13mm

*Itemswithasteriskvarydependingonsystemconfiguration.

ManualProber